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SN65HVD234DR

Texas Instruments

SN65HVD234DR by Texas Instruments

SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.

Median Price

$2.968

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 256,069 parts In-Stock

1+ parts

$2.121

100+ parts

$1.859

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$1.050

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256,069

$2.121

$1.859

$1.050

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Arrow

USA . 859 parts In-Stock

1+ parts

$3.114

100+ parts

$2.056

1k+ parts

$2.035

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859

$3.114

$2.056

$2.035

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Mouser Electronics

USA . 28,574 parts In-Stock

1+ parts

$3.210

100+ parts

$1.990

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$1.780

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$1.710

28,574

$3.210

$1.990

$1.780

$1.710

Newark

USA . 1,551 parts In-Stock

1+ parts

$3.310

100+ parts

$2.050

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$1.820

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1,551

$3.310

$2.050

$1.820

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DigiKey

USA . 8,176 parts In-Stock

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$3.500

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$2.171

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$2.033

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$1.837

8,176

$3.500

$2.171

$2.033

$1.837

Element14

Singapore . 2,400 parts In-Stock

1+ parts

$3.528

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$2.595

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$1.866

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2,400

$3.528

$2.595

$1.866

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Chip1Stop

Japan . 10,000 parts In-Stock

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$1.467

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Farnell

UK . 2,400 parts In-Stock

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$2.485

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$1.786

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$1.786

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RS (Exports)

UK . 1,330 parts In-Stock

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$2.822

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$2.413

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1,330

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$2.822

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Verical

USA . 859 parts In-Stock

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$2.056

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$2.035

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859

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$2.035

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Distributors (In-Stock)

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Ozdisan Elektronik

Türkiye . 16,715 parts In-Stock

1+ parts

$1.568

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16,715

$1.568

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Maritex

Poland . 2,500 parts In-Stock

1+ parts

$1.642

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$1.026

1k+ parts

$0.832

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2,500

$1.642

$1.026

$0.832

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Nova Conductors

Japan . 50 parts In-Stock

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$1.696

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50

$1.696

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Digiode

USA . 270 parts In-Stock

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$2.015

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270

$2.015

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TME

Poland . 854 parts In-Stock

1+ parts

$3.060

100+ parts

$1.840

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$1.730

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854

$3.060

$1.840

$1.730

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Vyrian

USA . 40,717 parts In-Stock

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Cyclops Electronics Ltd

UK . 31,157 parts In-Stock

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Chip Stock

USA . 17,500 parts In-Stock

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NAC Semi

USA . 13,389 parts In-Stock

1+ parts

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$4.850

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13,389

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$4.850

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ComSIT Distribution GmbH

Germany . 11,360 parts In-Stock

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Semtec, LLC

USA . 2,639 parts In-Stock

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2,639

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Mil-Aero Solutions, Inc.

USA . 2,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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Bristol Electronics

USA . 1,151 parts In-Stock

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PC Components Company LLC

USA . 1,040 parts In-Stock

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Pegasus Components GmbH

Germany . 868 parts In-Stock

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Avant Electronics Limited

UK . 286 parts In-Stock

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Sensible Micro Corp

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65

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Amalfi Trading

USA . 47 parts In-Stock

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Prism Electronics

USA . 27 parts In-Stock

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EMSNET

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 40,680 parts In-Stock

1+ parts

$1.250

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40,680

$1.250

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Semicontronic

India . 40,380 parts In-Stock

1+ parts

$1.250

100+ parts

$1.219

1k+ parts

$1.212

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40,380

$1.250

$1.219

$1.212

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.663

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$1.596

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1,000

$1.663

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$1.596

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Argo Parts USA

USA . 3,105 parts In-Stock

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$1.696

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$1.696

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Corphita

USA . 2,991 parts In-Stock

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$1.909

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$1.909

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Continental Prestige Electronics

USA . 1,448 parts In-Stock

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$2.940

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$2.160

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1,448

$2.940

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Corohmni

South Africa . 53 parts In-Stock

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$6.836

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53

$6.836

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$7.906

100+ parts

$7.511

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$7.511

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1,000

$7.906

$7.511

$7.511

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Modulus Dynamics

Lithuania . 1,117 parts In-Stock

1+ parts

$8.198

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$8.198

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$8.198

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1,117

$8.198

$8.198

$8.198

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Parana Technologies

USA . 737 parts In-Stock

1+ parts

$12.570

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$13.023

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737

$12.570

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$13.023

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DigiPath Technology Company

USA . 1,015 parts In-Stock

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$13.842

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1,015

$13.842

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IDEA Electronic Components Group

UK . 2,065 parts In-Stock

1+ parts

$14.124

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$13.418

1k+ parts

$12.712

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2,065

$14.124

$13.418

$12.712

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ChromeModa Solutions

Germany . 1,881 parts In-Stock

1+ parts

$14.124

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$11.582

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$14.124

$11.582

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Kepictronics

USA . 26,000 parts In-Stock

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GreenTree Electronics

Israel . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 13,189 parts In-Stock

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Lixinc

USA . 10,199 parts In-Stock

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S.R.D Solutions

India . 7,950 parts In-Stock

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iodParts Technologies Inc.

India . 5,718 parts In-Stock

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Robosynatics

Brazil . 2,726 parts In-Stock

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2,726

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Lucentia Tech

USA . 2,726 parts In-Stock

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$13.193

1k+ parts

$12.924

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$12.924

2,726

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$13.193

$12.924

$12.924

Allen Electronics Distributors

USA . 2,030 parts In-Stock

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2,030

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Futuretech Components

Singapore . 1,050 parts In-Stock

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Overview

Unlock seamless communication with the SN65HVD234DR by Texas Instruments, a top-of-the-line network interface designed for automotive applications. Manufactured with precision and reliability in mind, this small outline package offers customers unparalleled value and benefits. With a nominal supply voltage of 3.3V and a data rate of 1 Mbps, this interface circuit ensures optimal performance even in extreme temperatures ranging from -40 to 125°C. Say goodbye to connectivity issues and hello to efficiency with the SN65HVD234DR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient utilization of space on the circuit board, making it suitable for compact and space-constrained designs.

No. of Terminals: 8

With 8 terminals, this product offers flexibility in connectivity options, making it versatile for various networking configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable board space, making it ideal for designs where size is a constraint.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in extreme conditions, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can withstand cold environments, making it suitable for outdoor and harsh weather conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions offer redundancy and flexibility in connection options, enhancing the product's reliability and versatility.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a slim profile, making it suitable for space-constrained designs without compromising performance.

Width: 3.9 mm

The compact width of 3.9 mm enables easy integration into tight spaces, ideal for designs where board real estate is limited.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure solder joints during assembly, preventing any reliability issues due to temperature fluctuations.

Length: 4.9 mm

The length of 4.9 mm offers a balanced form factor for easy integration into various circuit board designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the stringent temperature and durability requirements for reliable performance in vehicular environments.

Terminal Form: GULL WING

The gull-wing terminal form provides robust mechanical support and ease of soldering, ensuring secure connections during operation.

Maximum Supply Current: 6 mA

With a maximum supply current of 6 mA, this product offers low power consumption, making it suitable for energy-efficient designs.

Telecom IC Type: INTERFACE CIRCUIT

The interface circuit telecom IC type enables seamless communication and connectivity, making this product an excellent choice for networking applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides compatibility with standard PCB layouts, facilitating easy integration and assembly.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, this product offers fast and reliable data transmission, making it suitable for various networking and communication applications.

Technical Specifications

Network Interfaces SN65HVD234DR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

6 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD234DR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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