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MCP2561T-E/MF

Microchip Technology

MCP2561T-E/MF by Microchip Technology

MCP2561T-E/MF by Microchip: CAN transceiver for automotive apps. Operates at 5V, 1Mbps data rate. Small outline package, -40 to 125°C temp range, TS16949 screening level.

Median Price

$1.200

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,630 parts In-Stock

1+ parts

$1.191

100+ parts

$1.137

1k+ parts

$1.082

10k+ parts

$1.064

4,630

$1.191

$1.137

$1.082

$1.064

Microchip Technology

USA . 71,838 parts In-Stock

1+ parts

$1.210

100+ parts

$0.910

1k+ parts

$0.890

10k+ parts

$0.870

71,838

$1.210

$0.910

$0.890

$0.870

Mouser Electronics

USA . 24,426 parts In-Stock

1+ parts

$1.210

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24,426

$1.210

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DigiKey

USA . 7,689 parts In-Stock

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$1.210

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$0.910

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$0.910

7,689

$1.210

$0.910

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$0.910

Master Electronics

USA . 6,349 parts In-Stock

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$0.825

10k+ parts

$0.764

6,349

-

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$0.825

$0.764

Verical

USA . 6,250 parts In-Stock

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$1.063

10k+ parts

$0.979

6,250

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$1.063

$0.979

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 59,400 parts In-Stock

1+ parts

$1.200

100+ parts

$1.080

1k+ parts

$0.970

10k+ parts

-

59,400

$1.200

$1.080

$0.970

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$1.370

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870

$1.370

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Vyrian

USA . 20,005 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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IBS Electronics

USA . 9,649 parts In-Stock

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$1.157

10k+ parts

$1.072

9,649

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$1.157

$1.072

Chip Stock

USA . 8,100 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 20,778 parts In-Stock

1+ parts

$0.700

100+ parts

$0.682

1k+ parts

$0.679

10k+ parts

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20,778

$0.700

$0.682

$0.679

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Ampacity Inc.

Singapore . 20,397 parts In-Stock

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$0.700

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$0.700

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Continental Prestige Electronics

USA . 1,995 parts In-Stock

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$0.994

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$0.974

1,995

$0.994

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$0.974

Argo Parts USA

USA . 992 parts In-Stock

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$0.994

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$0.994

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$7.438

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$7.066

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$7.066

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$7.438

$7.066

$7.066

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Aztec Data Supply Inc.

USA . 177 parts In-Stock

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$11.090

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$11.090

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Corohmni

South Africa . 19 parts In-Stock

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$12.745

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Lixinc

USA . 8,823 parts In-Stock

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RC Electronics

USA . 6,000 parts In-Stock

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West Coast Incorporated

USA . 2,479 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,503 parts In-Stock

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Formix International (Excess)

India . 1,500 parts In-Stock

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Kepictronics

USA . 1,425 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.343

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$1.302

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$1.274

50

-

$1.343

$1.302

$1.274

Overview

Experience seamless and reliable networking with the MCP2561T-E/MF by Microchip Technology. As a trusted manufacturer in the industry, Microchip delivers top-quality network interfaces that exceed expectations. The MCP2561T-E/MF is perfect for automotive applications with its TS 16949 screening level and high-temperature grade. With a data rate of 1 Mbps and a nominal supply voltage of 5V, this CAN transceiver ensures efficient communication. Trust Microchip to provide cutting-edge solutions for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and sturdy construction, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and efficient use of space on a circuit board.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability in automotive applications, meeting industry standards.

Package Shape: SQUARE

The square package shape is a common design that allows for easy placement and alignment on a circuit board.

No. of Terminals: 8

The 8 terminals provide ample connectivity options for interfacing with other components or systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style offers space-saving benefits while ensuring efficient heat dissipation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows for reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures functionality even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and enhances solderability for a reliable connection.

Terminal Position: DUAL

The dual terminal position allows for flexibility in installation and connection options.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm contributes to a compact overall design and facilitates space-constrained installations.

Width: 3 mm

The 3 mm width offers compatibility with standard spacing requirements on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 C enables efficient soldering and ensures component reliability.

Length: 3 mm

The 3 mm length complements the width dimension for a compact and space-efficient package design.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification signifies suitability for use in automotive applications with stringent temperature requirements.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and offers a lead-free alternative for eco-conscious designs.

Maximum Supply Current: 70 mA

The 70 mA maximum supply current ensures operational efficiency and reliable performance within specified current limits.

Telecom IC Type: CAN TRANSCEIVER

The CAN transceiver type is specifically designed for use in telecommunications applications, providing reliable communication.

Nominal Supply Voltage: 5 V

The 5 V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for precise alignment and connection on a circuit board, facilitating accurate signal transmission.

Data Rate: 1 Mbps

The 1 Mbps data rate enables high-speed communication and data transfer, making it suitable for applications requiring quick and efficient data exchange.

Technical Specifications

Network Interfaces MCP2561T-E/MF attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

1 Mbps

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

MCP2561T-E/MF Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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