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EPROM

EPROM, or Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can be programmed and erased multiple times. EPROM was commonly used in computer systems and electronic devices in the 1970s and 1980s, but has largely been replaced by more advanced memory technologies.

EPROM works by storing data in a grid of memory cells that can be individually programmed and erased using ultraviolet light. Each memory cell consists of a transistor and a floating gate. To program the memory cell, a high voltage is applied to the transistor, which charges the floating gate. To erase the memory cell, ultraviolet light is applied to the chip, which removes the charge from the floating gate. The programming and erasing process can be repeated multiple times, making EPROM a reprogrammable memory technology.

EPROM has several advantages over other types of computer memory, such as ROM and RAM. EPROM can be reprogrammed multiple times, which makes it a versatile and flexible memory technology. EPROM is also non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware.

EPROM

Available Parts 2,400+

Part RoHS Manufacturer Description Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Output Characteristics Organization No. of Words Code Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time Programming Voltage (V)
M27C256B-10F1 by STMicroelectronics

M27C256B-10F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

MATTE TIN

DUAL

R-CDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

262144 bit

4.5 V

e3

.0001 Amp

36.92 mm

100 ns

12.75

M27C256B-12F1 by STMicroelectronics

M27C256B-12F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; JESD-609 Code: e3;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

MATTE TIN

DUAL

R-CDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

262144 bit

4.5 V

e3

.0001 Amp

36.92 mm

120 ns

12.75

M27C256B-15F1 by STMicroelectronics

M27C256B-15F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Width: 15.24 mm;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

MATTE TIN

DUAL

R-CDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

262144 bit

4.5 V

e3

.0001 Amp

36.92 mm

150 ns

12.75

M27C256B-70XF1 by STMicroelectronics

M27C256B-70XF1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; No. of Functions: 1;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

MATTE TIN

DUAL

R-CDIP-T28

5.25 V

5.72 mm

15.24 mm

Not Qualified

262144 bit

4.75 V

e3

.0001 Amp

36.92 mm

70 ns

12.75

M27C512-15F6 by STMicroelectronics

M27C512-15F6

STMicroelectronics

UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

UVPROM

INDUSTRIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

TIN LEAD

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

36.92 mm

150 ns

EPC2TI32N by Intel

EPC2TI32N

Intel

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;

CONFIGURATION MEMORY

INDUSTRIAL

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

50 mA

1695680 words

3.3

3.3/5

1

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Flash Memories

.8 mm

85 Cel

3-STATE

1695680X1

1695680

-40 Cel

MATTE TIN

QUAD

S-PQFP-G32

3

3.6 V

1.2 mm

7 mm

Not Qualified

1695680 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e3

.0001 Amp

7 mm

3.3

M27C512-15F1 by STMicroelectronics

M27C512-15F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

TIN LEAD

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

36.92 mm

150 ns

M27C512-90F6 by STMicroelectronics

M27C512-90F6

STMicroelectronics

UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Surface Mount: NO;

UVPROM

INDUSTRIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

36.92 mm

90 ns

EPC2LC20N by Intel

EPC2LC20N

Intel

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Memory Width: 1;

CONFIGURATION MEMORY

COMMERCIAL

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

SERIAL

SYNCHRONOUS

50 mA

1695680 words

3.3

3.3/5

1

CHIP CARRIER

LCC20,.39SQ

Flash Memories

1.27 mm

70 Cel

3-STATE

1695680X1

1695680

0 Cel

MATTE TIN

QUAD

S-PQCC-J20

3

3.6 V

4.572 mm

8.9662 mm

Not Qualified

1695680 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e3

30

245

.0001 Amp

8.9662 mm

3.3

M27C512-12F1 by STMicroelectronics

M27C512-12F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

36.92 mm

120 ns

M27C512-10F1 by STMicroelectronics

M27C512-10F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Width: 15.24 mm;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

36.92 mm

100 ns

EPC2LI20N by Intel

EPC2LI20N

Intel

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Technology: CMOS;

CONFIGURATION MEMORY

INDUSTRIAL

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

SERIAL

SYNCHRONOUS

50 mA

1695680 words

3.3

3.3/5

1

CHIP CARRIER

LCC20,.39SQ

Flash Memories

1.27 mm

85 Cel

3-STATE

1695680X1

1695680

-40 Cel

MATTE TIN

QUAD

S-PQCC-J20

3

3.6 V

4.572 mm

8.9662 mm

Not Qualified

1695680 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e3

.0001 Amp

8.9662 mm

3.3

M27C512-15F6X by STMicroelectronics

M27C512-15F6X

STMicroelectronics

UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

UVPROM

INDUSTRIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

DUAL

R-GDIP-T28

5.5 V

5.97 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

36.92 mm

150 ns

M27C1001-10F1 by STMicroelectronics

M27C1001-10F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; No. of Functions: 1;

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

MATTE TIN

DUAL

R-CDIP-T32

5.5 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e3

245

.0001 Amp

41.885 mm

100 ns

M27C1001-12F1 by STMicroelectronics

M27C1001-12F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

MATTE TIN

DUAL

R-CDIP-T32

5.5 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e3

245

.0001 Amp

41.885 mm

120 ns

M27C1001-15F1 by STMicroelectronics

M27C1001-15F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

MATTE TIN

DUAL

R-CDIP-T32

5.5 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e3

245

.0001 Amp

41.885 mm

150 ns

EPC2LI20 by Intel

EPC2LI20

Intel

CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V; Package Equivalence Code: LDCC20,.4SQ;

CONFIGURATION MEMORY

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

SERIAL

SYNCHRONOUS

50 mA

1695680 words

3.3

3.3/5

1

CHIP CARRIER

LDCC20,.4SQ

Flash Memories

1.27 mm

85 Cel

3-STATE

1695680X1

1695680

-40 Cel

TIN LEAD

QUAD

S-PQCC-J20

1

3.6 V

4.572 mm

8.9662 mm

Not Qualified

1695680 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e0

.0001 Amp

8.9662 mm

3.3

EPC2TC32N by Intel

EPC2TC32N

Intel

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; JESD-609 Code: e3;

CONFIGURATION MEMORY

COMMERCIAL

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

50 mA

1695680 words

3.3

3.3/5

1

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Flash Memories

.8 mm

70 Cel

3-STATE

1695680X1

1695680

0 Cel

MATTE TIN

QUAD

S-PQFP-G32

3

3.6 V

1.2 mm

7 mm

Not Qualified

1695680 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e3

30

260

.0001 Amp

7 mm

3.3

EPC1441PI8 by Intel

EPC1441PI8

Intel

CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.398 mm; Moisture Sensitivity Level (MSL): 1;

CONFIGURATION MEMORY

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

30 mA

440800 words

3.3

3.3/5

1

IN-LINE

DIP8,.3

OTP ROMs

2.54 mm

85 Cel

3-STATE

440800X1

440800

-40 Cel

TIN LEAD

DUAL

R-PDIP-T8

1

3.6 V

4.318 mm

7.62 mm

Not Qualified

440800 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e0

.00006 Amp

9.398 mm

3.3

M27C256B-12F6 by STMicroelectronics

M27C256B-12F6

STMicroelectronics

UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Supply Current: 30 mA;

UVPROM

INDUSTRIAL

28

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

DUAL

R-CDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

262144 bit

4.5 V

e3

.0001 Amp

36.92 mm

120 ns

12.75

M27C512-12F3 by STMicroelectronics

M27C512-12F3

STMicroelectronics

UVPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;

UVPROM

AUTOMOTIVE

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

TIN

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e3

.0001 Amp

36.92 mm

120 ns

M27C1001-10F1L by STMicroelectronics

M27C1001-10F1L

STMicroelectronics

EPROMs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: Tin/Lead (Sn/Pb);

COMMERCIAL

32

DIP

RECTANGULAR

CERAMIC

NO

CMOS

THROUGH-HOLE

30 mA

131072 words

COMMON

5

5

8

IN-LINE

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T32

Not Qualified

1048576 bit

e0

.0001 Amp

100 ns

EPC1441TC32N by Intel

EPC1441TC32N

Intel

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; No. of Functions: 1;

CONFIGURATION MEMORY

COMMERCIAL

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

30 mA

440800 words

3.3

3.3/5

1

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

OTP ROMs

.8 mm

70 Cel

3-STATE

440800X1

440800

0 Cel

MATTE TIN

QUAD

S-PQFP-G32

3

3.6 V

1.2 mm

7 mm

Not Qualified

440800 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e3

.00006 Amp

7 mm

3.3

M27C512-10F1E by STMicroelectronics

M27C512-10F1E

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T28;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

MATTE TIN

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e3

.0001 Amp

36.92 mm

100 ns

M27C64A-10F1 by STMicroelectronics

M27C64A-10F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE, WINDOW;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

8192 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

8KX8

8K

0 Cel

MATTE TIN

DUAL

R-CDIP-T28

5.5 V

5.97 mm

15.24 mm

Not Qualified

65536 bit

4.5 V

e3

.0001 Amp

36.92 mm

100 ns

12.5

EPC1PI8N by Intel

EPC1PI8N

Intel

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;

CONFIGURATION MEMORY

INDUSTRIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

50 mA

1046496 words

3.3

3.3/5

1

IN-LINE

DIP8,.3

OTP ROMs

2.54 mm

85 Cel

3-STATE

1046496X1

1046496

-40 Cel

MATTE TIN

DUAL

R-PDIP-T8

1

3.6 V

4.318 mm

7.62 mm

Not Qualified

1046496 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e3

.0001 Amp

9.398 mm

3.3

M27C512-10F1X by STMicroelectronics

M27C512-10F1X

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Surface Mount: NO;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

DUAL

R-GDIP-T28

5.5 V

5.97 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

36.92 mm

100 ns

M27C512-12F1E by STMicroelectronics

M27C512-12F1E

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T28;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

MATTE TIN

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e3

.0001 Amp

36.92 mm

120 ns

AM27C512-120DC by Rochester Electronics

AM27C512-120DC

Rochester Electronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

UVPROM

COMMERCIAL

28

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

65536 words

5

8

IN-LINE

70 Cel

64KX8

64K

0 Cel

DUAL

R-CDIP-T28

5.5 V

524288 bit

4.5 V

NOT SPECIFIED

NOT SPECIFIED

120 ns

EPC2TI32 by Intel

EPC2TI32

Intel

CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Organization: 1695680X1;

CONFIGURATION MEMORY

INDUSTRIAL

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

50 mA

1695680 words

3.3

3.3/5

1

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Flash Memories

.8 mm

85 Cel

3-STATE

1695680X1

1695680

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

3

3.6 V

1.2 mm

7 mm

Not Qualified

1695680 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e0

.0001 Amp

7 mm

3.3

M27C4001-15F1 by STMicroelectronics

M27C4001-15F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Technology: CMOS;

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

MATTE TIN

DUAL

R-CDIP-T32

5.5 V

5.72 mm

15.24 mm

Not Qualified

4194304 bit

4.5 V

e3

245

.0001 Amp

41.885 mm

100 ns

M27C1001-10F1X by STMicroelectronics

M27C1001-10F1X

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

MATTE TIN

DUAL

R-GDIP-T32

5.5 V

5.97 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

41.885 mm

100 ns

M27C2001-10F1 by STMicroelectronics

M27C2001-10F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Width: 15.24 mm;

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

262144 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

256KX8

256K

0 Cel

Matte Tin (Sn)

DUAL

R-CDIP-T32

5.5 V

5.72 mm

15.24 mm

Not Qualified

2097152 bit

4.5 V

e3

10

245

.0001 Amp

41.885 mm

100 ns

NMC27C64Q150 by National Semiconductor

NMC27C64Q150

National Semiconductor

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

8192 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

8KX8

8K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

65536 bit

4.5 V

e0

.0001 Amp

150 ns

13

M27C512-12F1X by STMicroelectronics

M27C512-12F1X

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

DUAL

R-GDIP-T28

5.5 V

5.97 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

36.92 mm

120 ns

EPC2LC20 by Intel

EPC2LC20

Intel

CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel; Package Body Material: PLASTIC/EPOXY;

CONFIGURATION MEMORY

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

SERIAL

SYNCHRONOUS

50 mA

1695680 words

3.3

3.3/5

1

CHIP CARRIER

LDCC20,.4SQ

Flash Memories

1.27 mm

70 Cel

3-STATE

1695680X1

1695680

0 Cel

TIN LEAD

QUAD

S-PQCC-J20

1

3.6 V

4.572 mm

8.9662 mm

Not Qualified

1695680 bit

3 V

IT ALSO REQUIRES 5V NOMINAL SUPPLY

e0

.0001 Amp

8.9662 mm

3.3

NMC27C64QE200 by National Semiconductor

NMC27C64QE200

National Semiconductor

UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;

UVPROM

INDUSTRIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

8192 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

85 Cel

3-STATE

8KX8

8K

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

65536 bit

4.5 V

e0

.0001 Amp

200 ns

13

AM27C512-200JI by Rochester Electronics

AM27C512-200JI

Rochester Electronics

UVPROM; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

UVPROM

NOT SPECIFIED

NOT SPECIFIED

M27C1001-45XF1 by STMicroelectronics

M27C1001-45XF1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE, WINDOW;

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

MATTE TIN

DUAL

R-CDIP-T32

5.25 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

4.75 V

e3

.0001 Amp

41.885 mm

45 ns

NTE2732A by Nte Electronics

NTE2732A

Nte Electronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 125 mA;

UVPROM

COMMERCIAL

24

DIP

RECTANGULAR

UNSPECIFIED

NO

1

NMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

125 mA

4096 words

COMMON

5

5

8

IN-LINE

DIP24,.6

EPROMs

2.54 mm

70 Cel

3-STATE

4KX8

4K

0 Cel

TIN LEAD

DUAL

R-XDIP-T24

5.25 V

Not Qualified

32768 bit

4.75 V

e0

200 ns

21

M27C256B-12F1L by STMicroelectronics

M27C256B-12F1L

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

32768 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

32KX8

32K

0 Cel

TIN LEAD

DUAL

R-GDIP-T28

5.5 V

5.71 mm

15.24 mm

Not Qualified

262144 bit

4.5 V

e0

.0001 Amp

120 ns

12.75

NMC27C64Q250 by National Semiconductor

NMC27C64Q250

National Semiconductor

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

8192 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

8KX8

8K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

65536 bit

4.5 V

e0

.0001 Amp

250 ns

13

AM27C512-255DC by Rochester Electronics

AM27C512-255DC

Rochester Electronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

UVPROM

COMMERCIAL

28

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

65536 words

5

8

IN-LINE

70 Cel

64KX8

64K

0 Cel

DUAL

R-CDIP-T28

5.25 V

524288 bit

4.75 V

NOT SPECIFIED

NOT SPECIFIED

250 ns

2708 by Intel

2708

Intel

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;

UVPROM

COMMERCIAL

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

NMOS

-5 V

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

1024 words

5

8

IN-LINE

70 Cel

1KX8

1K

0 Cel

DUAL

R-PDIP-T24

5.25 V

Not Qualified

8192 bit

4.75 V

IT ALSO REQUIRES 12V VDD SUPPLY

450 ns

M27C512-70XF1 by STMicroelectronics

M27C512-70XF1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

UVPROM

COMMERCIAL

28

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP28,.6

EPROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

Not Qualified

524288 bit

4.75 V

e0

NOT SPECIFIED

NOT SPECIFIED

.0001 Amp

36.92 mm

70 ns

M2732A-2F1 by STMicroelectronics

M2732A-2F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;

UVPROM

COMMERCIAL

24

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

NMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

125 mA

4096 words

COMMON

5

5

8

IN-LINE

DIP24,.6

EPROMs

2.54 mm

70 Cel

3-STATE

4KX8

4K

0 Cel

TIN LEAD

DUAL

R-GDIP-T24

5.25 V

5.715 mm

15.24 mm

Not Qualified

32768 bit

4.75 V

21V PROGRAMMING VOLTAGE

e0

31.75 mm

200 ns

21

M27C1001-45F1 by STMicroelectronics

M27C1001-45F1

STMicroelectronics

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Seated Height: 5.72 mm;

UVPROM

COMMERCIAL

32

WDIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

131072 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP32,.6

EPROMs

2.54 mm

70 Cel

3-STATE

128KX8

128K

0 Cel

MATTE TIN

DUAL

R-CDIP-T32

5.5 V

5.72 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

41.885 mm

45 ns

NMC27C16BQ200 by National Semiconductor

NMC27C16BQ200

National Semiconductor

UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: WDIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

UVPROM

COMMERCIAL

24

WDIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

2048 words

COMMON

5

5

8

IN-LINE, WINDOW

DIP24,.6

EPROMs

2.54 mm

70 Cel

3-STATE

2KX8

2K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-GDIP-T24

5.5 V

5.969 mm

15.24 mm

Not Qualified

16384 bit

4.5 V

TTL COMPATIBLE INPUT & OUTPUT LEVELS

e0

.0001 Amp

200 ns