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M27C512-90F6

STMicroelectronics

M27C512-90F6 by STMicroelectronics

STMicroelectronics M27C512-90F6 is a 64KX8 EPROM with 90 ns access time, operating at 5V. It features a 3-STATE output and is ideal for industrial applications requiring reliable non-volatile memory storage in a ceramic, glass-sealed package.

Median Price

$3.812

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Nova Conductors

Japan . 100 parts In-Stock

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$3.812

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Vyrian

USA . 5,542 parts In-Stock

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Digiode

USA . 2,288 parts In-Stock

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Anansix

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Chip Stock

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Q Components

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Pegasus Components GmbH

Germany . 19 parts In-Stock

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Whistler Technology

UK . 16 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Odintec Ltd.

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LIBRA Elektronik GmbH

Germany . 7 parts In-Stock

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ECAB

Sweden . 4 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,057 parts In-Stock

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$2.200

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IDEA Electronic Components Group

UK . 538 parts In-Stock

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$3.169

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$2.852

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538

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$3.510

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$3.335

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$3.335

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10

$3.510

$3.335

$3.335

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Argo Parts USA

USA . 4,330 parts In-Stock

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$3.812

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Continental Prestige Electronics

USA . 1,177 parts In-Stock

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$3.812

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$3.736

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$3.736

Netroflash

USA . 100 parts In-Stock

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$3.812

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Modulus Dynamics

Lithuania . 57 parts In-Stock

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$4.231

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$4.189

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$4.062

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Corohmni

South Africa . 56 parts In-Stock

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$5.816

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MKK Technologies

India . 1,879 parts In-Stock

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$5.960

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DigiPath Technology Company

USA . 1,879 parts In-Stock

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$5.960

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$5.960

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AZTECH Wire

Italy . 435 parts In-Stock

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$10.122

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Microchip USA

USA . 467 parts In-Stock

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$20.816

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Semicontronic

India . 572 parts In-Stock

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$24.000

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$23.400

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$23.280

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Ampacity Inc.

Singapore . 1,388 parts In-Stock

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$27.000

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Kepictronics

USA . 14,919 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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RC Electronics

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A-Z Elektronik GmbH

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GreenTree Electronics

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Alle Elektronik GmbH

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Corphita

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Infinite Electronics LLP (Excess)

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Parana Technologies

USA . 177 parts In-Stock

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Perfect Parts

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Robosynatics

Brazil . 30 parts In-Stock

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Lucentia Tech

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iodParts Technologies Inc.

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Overview

Looking for a reliable EPROM solution? Look no further than the M27C512-90F6 by STMicroelectronics. Crafted with precision using quality materials, this chip offers superior performance and durability. Ideal for industrial applications, this EPROM boasts a 64KX8 organization and 3-STATE output characteristics. With a 90 ns access time and a wide operating temperature range, this versatile chip ensures optimal functionality in any environment. Trust STMicroelectronics for top-notch memory solutions that deliver value and efficiency. Elevate your projects with the M27C512-90F6 today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Operating Mode: ASYNCHRONOUS

Allows for independent operation of the EPROM, increasing flexibility in usage.

Nominal Supply Voltage / Vsup (V): 5

Suitable voltage level for stable and efficient performance of the EPROM.

No. of Terminals: 28

Sufficient number of terminals for connecting to other components and interfaces.

Memory IC Type: UVPROM

Ultraviolet erasable programmable read-only memory allows for easy reprogramming of the memory contents when needed.

Technical Specifications

EPROM M27C512-90F6 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

90 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T28

Length:

36.92 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

M27C512-90F6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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