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M27C512-10F1E

STMicroelectronics

M27C512-10F1E by STMicroelectronics

M27C512-10F1E EPROM by STMicroelectronics features 64KX8 organization, 100 ns access time, and 524288 bit memory density. It is commonly used in commercial applications requiring a parallel interface with a supply voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,657 parts In-Stock

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2,657

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Anansix

USA . 1,518 parts In-Stock

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1,518

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Vyrian

USA . 798 parts In-Stock

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798

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,361 parts In-Stock

1+ parts

$2.096

100+ parts

-

1k+ parts

$1.886

10k+ parts

-

2,361

$2.096

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$1.886

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Corohmni

South Africa . 95 parts In-Stock

1+ parts

$2.728

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95

$2.728

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Aztec Data Supply Inc.

USA . 229 parts In-Stock

1+ parts

$3.030

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229

$3.030

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MKK Technologies

India . 1,791 parts In-Stock

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$3.941

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1,791

$3.941

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DigiPath Technology Company

USA . 1,791 parts In-Stock

1+ parts

$3.941

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1,791

$3.941

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AZTECH Wire

Italy . 829 parts In-Stock

1+ parts

$16.860

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829

$16.860

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Semicontronic

India . 1,404 parts In-Stock

1+ parts

$20.000

100+ parts

$19.500

1k+ parts

$19.400

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1,404

$20.000

$19.500

$19.400

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Ampacity Inc.

Singapore . 1,486 parts In-Stock

1+ parts

$27.000

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1,486

$27.000

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Continental Prestige Electronics

USA . 5,573 parts In-Stock

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Corphita

USA . 4,228 parts In-Stock

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4,228

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Parana Technologies

USA . 637 parts In-Stock

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$2.506

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637

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$2.506

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Argo Parts USA

USA . 373 parts In-Stock

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373

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Bastille Electronics

Australia . 41 parts In-Stock

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Overview

Unlock limitless possibilities with the M27C512-10F1E by STMicroelectronics. Crafted with precision and expertise, this EPROM offers reliability and quality like no other. Ideal for a wide range of applications, this product provides seamless performance and unmatched durability. Experience the value of cutting-edge technology with the M27C512-10F1E, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic body material provides durability and reliability for long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing circuit designs.

Operating Mode: ASYNCHRONOUS

The asynchronous operation ensures efficient data retrieval without the need for synchronization.

Input/Output Type: COMMON

The common I/O type simplifies the interface with other components in the system.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard power sources.

Power Supplies (V): 5

The 5V power supply allows for consistent and reliable performance.

No. of Terminals: 28

The 28 terminals provide ample connectivity options for various applications.

Package Style (Meter): IN-LINE

The in-line package style offers space-saving benefits in compact designs.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70°C ensures stable performance in various environments.

Organization: 64KX8

The 64Kx8 organization allows for efficient storage and retrieval of data.

Output Characteristics: 3-STATE

The 3-state output characteristics offer flexibility in controlling data flow.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C guarantees reliable operation in cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance for extended product lifespan.

Terminal Position: DUAL

The dual terminal position enhances connectivity options for easy integration.

Maximum Seated Height: 5.72 mm

The low maximum seated height ensures compatibility with space-constrained designs.

Width: 15.24 mm

The 15.24mm width allows for compact placement on circuit boards.

Minimum Supply Voltage (Vsup): 4.5 V

The 4.5V minimum supply voltage ensures reliable operation even under slight power fluctuations.

Length: 36.92 mm

The 36.92mm length accommodates the necessary components for efficient memory storage.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance in standard operating conditions.

Technology: CMOS

The CMOS technology offers low power consumption and high speed for efficient data processing.

Parallel or Serial: PARALLEL

The parallel interface allows for simultaneous data transfer, improving overall system efficiency.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and reliable connections on the circuit board.

Maximum Supply Current: 30 mA

The 30mA maximum supply current ensures optimal power usage for consistent performance.

No. of Words: 65536

The 65536 words capacity allows for ample data storage and retrieval capabilities.

Memory Width: 8

The 8-bit memory width accommodates various data types for versatile applications.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy soldering and connection in standard PCB layouts.

No. of Words Code: 64K

The classification of 64K words simplifies memory organization and data management.

Maximum Supply Voltage (Vsup): 5.5 V

The 5.5V maximum supply voltage ensures safe operation within specified limits.

Memory Density: 524288 bit

The high memory density of 524288 bits offers ample storage capacity for extensive data.

Memory IC Type: UVPROM

The UVPROM memory IC type combines the advantages of UV erasable and programmable read-only memory.

Maximum Standby Current: 0.0001 Amp

The low maximum standby current of 0.0001 Amp minimizes power consumption during idle periods.

Maximum Access Time: 100 ns

The fast maximum access time of 100 ns allows for quick data retrieval and processing.

Technical Specifications

EPROM M27C512-10F1E attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e3

Length:

36.92 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C512-10F1E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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