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M27C1001-15F1

STMicroelectronics

M27C1001-15F1 by STMicroelectronics

M27C1001-15F1 EPROM by STMicroelectronics features 128KX8 organization, 150 ns access time, and 1048576 bit memory density. It is ideal for commercial applications requiring a parallel CMOS technology with a max supply voltage of 5.5 V and operating temperature range of 0 to 70°C.

Median Price

$3.200

Lifecycle Status

Suppliers In-Stock

56

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 136 parts In-Stock

1+ parts

$2.350

100+ parts

$2.820

1k+ parts

$2.326

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136

$2.350

$2.820

$2.326

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$2.529

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550

$2.529

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DF Sales Co.

USA . 44 parts In-Stock

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$3.200

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44

$3.200

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DF Sales Co.

USA . 44 parts In-Stock

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$3.200

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American Microsemiconductor Inc.

USA . 19 parts In-Stock

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$5.550

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19

$5.550

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Component Electronics Inc.

Canada . 19 parts In-Stock

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$6.150

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$4.620

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$4.000

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$6.150

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Forefront Electronics and Design

USA . 8 parts In-Stock

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$7.350

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Vyrian

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Digiode

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Q Components

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Bristol Electronics

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Atlantic Semiconductor

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Anansix

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Magnum Semiconductors LLP

India . 916 parts In-Stock

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J & M Industries LLC

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Chip Stock

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MRC Electronics

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Halfin

Belgium . 196 parts In-Stock

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Vectronix, Inc

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Prism Electronics

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Electronics Depot

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Electronic Expediters

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LWI Electronics Inc

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ECAB

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MISTER SPROCKETS

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First Choice Components Inc.

USA . 61 parts In-Stock

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Legend Electronics Inc.

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Holdelec - ElecDif-Pro

France . 47 parts In-Stock

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PC Components Company LLC

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Zilex Electronics Inc.

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SPM Sales

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R&J Components

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Pegasus Components GmbH

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Classic Components Corporation

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Fibra_Brandt Electronic GMBH

Germany . 25 parts In-Stock

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Beltway Electronics Company

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Jameco Electronics

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GES GmbH

Germany . 17 parts In-Stock

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Sea View Technologies

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Mentor Electronics Marketing, LLC

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ComSIT Distribution GmbH

Germany . 12 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 12 parts In-Stock

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Cyclops Electronics Ltd

UK . 12 parts In-Stock

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ABC Electronics Ltd.

UK . 12 parts In-Stock

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Speed Components Ltd

Israel . 12 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 11 parts In-Stock

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North Shore Components

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Resion

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EMSNET

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Distributors (Availability)

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Argo Parts USA

USA . 2,206 parts In-Stock

1+ parts

$2.529

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$2.529

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Continental Prestige Electronics

USA . 632 parts In-Stock

1+ parts

$2.529

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$2.478

632

$2.529

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$2.478

Netroflash

USA . 500 parts In-Stock

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$2.529

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500

$2.529

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IDEA Electronic Components Group

UK . 2,207 parts In-Stock

1+ parts

$3.013

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$2.712

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2,207

$3.013

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$2.712

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Corohmni

South Africa . 104 parts In-Stock

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$3.244

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104

$3.244

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Advanced Electronics

New Zealand . 400 parts In-Stock

1+ parts

$3.546

100+ parts

$3.369

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$3.369

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400

$3.546

$3.369

$3.369

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Ampacity Inc.

Singapore . 1,466 parts In-Stock

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$4.000

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1,466

$4.000

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Aztec Data Supply Inc.

USA . 826 parts In-Stock

1+ parts

$5.470

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826

$5.470

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MKK Technologies

India . 2,349 parts In-Stock

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$5.666

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2,349

$5.666

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DigiPath Technology Company

USA . 2,349 parts In-Stock

1+ parts

$5.666

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2,349

$5.666

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Microchip USA

USA . 465 parts In-Stock

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$6.612

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465

$6.612

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AZTECH Wire

Italy . 335 parts In-Stock

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$14.469

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335

$14.469

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Semicontronic

India . 1,067 parts In-Stock

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$15.000

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$14.625

1k+ parts

$14.550

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1,067

$15.000

$14.625

$14.550

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RC Electronics

USA . 44,912 parts In-Stock

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Lixinc

USA . 14,375 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,940 parts In-Stock

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Perfect Parts

USA . 2,247 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,960 parts In-Stock

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Parana Technologies

USA . 1,947 parts In-Stock

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$3.602

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Corphita

USA . 814 parts In-Stock

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 461 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 131 parts In-Stock

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Kepictronics

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Emar International I/E

Canada . 86 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 10 parts In-Stock

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Giza Technologies, Inc.

USA . 2 parts In-Stock

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Overview

Unlock a world of possibilities with the M27C1001-15F1 by STMicroelectronics. This high-quality EPROM offers reliability and precision, thanks to its manufacturer's stellar reputation. Ideal for a variety of applications, this product provides unmatched value and benefits to customers. Experience superior performance and seamless operation with the M27C1001-15F1, a game-changer in the world of memory technology.

Feature Benefit Bullets

Package Body Material:

CERAMIC, METAL-SEALED COFIRED - Provides durability and reliable performance.

No. of Functions:

1 - Simplifies design and operation of the product.

Package Shape:

RECTANGULAR - Allows for easy integration into electronic systems.

Operating Mode:

ASYNCHRONOUS - Enables independent operation without external clock signals.

Input/Output Type:

COMMON - Facilitates communication with other components in the system.

Nominal Supply Voltage / Vsup (V):

5 - Compatible with standard power sources for easy integration.

Power Supplies (V):

5 - Ensures stable and efficient power distribution.

No. of Terminals:

32 - Provides ample connection options for various applications.

Package Style (Meter):

IN-LINE, WINDOW - Offers flexibility in mounting and usage.

Maximum Operating Temperature:

70 °C - Ensures reliable performance in various environmental conditions.

Organization:

128KX8 - Provides a large memory capacity with efficient data organization.

Output Characteristics:

3-STATE - Enables multiple output states for versatile functionality.

Minimum Operating Temperature:

0 °C - Ensures reliable performance even in low temperature environments.

Terminal Finish:

MATTE TIN - Provides corrosion resistance and reliable electrical connections.

Terminal Position:

DUAL - Offers flexibility in circuit board layout and connection options.

Maximum Seated Height:

5.72 mm - Allows for compact and space-saving designs.

Width:

15.24 mm - Compact dimensions for easy integration in tight spaces.

Minimum Supply Voltage (Vsup):

4.5 V - Ensures operation even with slight fluctuations in power supply.

Peak Reflow Temperature °C:

245 - Withstands high-temperature assembly processes for reliability.

Length:

41.885 mm - Compact design for versatile integration options.

Temperature Grade:

COMMERCIAL - Suitable for standard commercial applications.

Technology:

CMOS - Offers low power consumption and high speed performance.

Parallel or Serial:

PARALLEL - Enables fast data transfer and processing.

Terminal Form:

THROUGH-HOLE - Provides secure and reliable connections on circuit boards.

Maximum Supply Current:

30 mA - Ensures efficient power consumption and operation.

No. of Words:

131072 words - Offers a large memory capacity for storing data.

Memory Width:

8 - Efficient data organization and processing.

Terminal Pitch:

2.54 mm - Standard spacing for easy connection and integration.

No. of Words Code:

128K - Simplifies memory capacity identification.

Maximum Supply Voltage (Vsup):

5.5 V - Tolerant to slight power supply fluctuations for reliable operation.

Memory Density:

1048576 bit - Provides ample storage space for data.

Memory IC Type:

UVPROM - Offers reliable and non-volatile memory storage.

Maximum Standby Current:

0.0001 Amp - Ensures minimal power consumption in standby mode.

Maximum Access Time:

150 ns - Provides fast data access for efficient operation.

Technical Specifications

EPROM M27C1001-15F1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T32

JESD-609 Code:

e3

Length:

41.885 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP32,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C1001-15F1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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