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M27C256B-12F6

STMicroelectronics

M27C256B-12F6 by STMicroelectronics

M27C256B-12F6 by STMicroelectronics is a 32KX8 EPROM with 3-STATE output, operating at 5V. It has a programming voltage of 12.75V and max access time of 120ns. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.287

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200

$2.287

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Component Electronics Inc.

Canada . 16 parts In-Stock

1+ parts

$4.620

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$3.460

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$3.000

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16

$4.620

$3.460

$3.000

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Forefront Electronics and Design

USA . 25 parts In-Stock

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$4.900

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25

$4.900

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TEDSS.com

USA . 5 parts In-Stock

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$5.500

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Chip Stock

USA . 11,354 parts In-Stock

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Vyrian

USA . 3,359 parts In-Stock

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Digiode

USA . 2,232 parts In-Stock

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Anansix

USA . 2,020 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 2,001 parts In-Stock

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Infinite Electronics LLP

India . 984 parts In-Stock

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LWI Electronics Inc

India . 409 parts In-Stock

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Martec Srl

Italy . 100 parts In-Stock

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Pegasus Components GmbH

Germany . 25 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 17 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 12 parts In-Stock

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Holdelec - ElecDif-Pro

France . 12 parts In-Stock

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Semi Source

USA . 10 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

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Manotoh

Italy . 7 parts In-Stock

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Greenchips

USA . 5 parts In-Stock

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5

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J2 Sourcing AB

Sweden . 4 parts In-Stock

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Extreme Components

USA . 4 parts In-Stock

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R&J Components

USA . 3 parts In-Stock

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GES GmbH

Germany . 3 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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Dark Horse Electronics

USA . 2 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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NAC Semi

USA . 1 parts In-Stock

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Inland Empire Components Inc.

USA . 1 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,905 parts In-Stock

1+ parts

$2.287

100+ parts

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1k+ parts

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10k+ parts

$2.241

5,905

$2.287

-

-

$2.241

Argo Parts USA

USA . 3,784 parts In-Stock

1+ parts

$2.287

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3,784

$2.287

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.287

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2,000

$2.287

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$2.333

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$2.333

1k+ parts

$2.333

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650

$2.333

$2.333

$2.333

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Corohmni

South Africa . 213 parts In-Stock

1+ parts

$2.976

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213

$2.976

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IDEA Electronic Components Group

UK . 2,101 parts In-Stock

1+ parts

$3.984

100+ parts

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$3.585

10k+ parts

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2,101

$3.984

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$3.585

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Semicontronic

India . 1,587 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

10k+ parts

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1,587

$4.000

$3.900

$3.880

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Aztec Data Supply Inc.

USA . 894 parts In-Stock

1+ parts

$5.020

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894

$5.020

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MKK Technologies

India . 1,952 parts In-Stock

1+ parts

$7.491

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1,952

$7.491

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DigiPath Technology Company

USA . 1,952 parts In-Stock

1+ parts

$7.491

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1,952

$7.491

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Ampacity Inc.

Singapore . 1,203 parts In-Stock

1+ parts

$10.000

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1,203

$10.000

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AZTECH Wire

Italy . 353 parts In-Stock

1+ parts

$13.657

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353

$13.657

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RC Electronics

USA . 32,219 parts In-Stock

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32,219

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,923 parts In-Stock

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5,923

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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5,880

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Alle Elektronik GmbH

Germany . 4,903 parts In-Stock

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Kepictronics

USA . 4,465 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,883 parts In-Stock

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Microchip USA

USA . 2,466 parts In-Stock

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2,466

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Parana Technologies

USA . 1,293 parts In-Stock

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$4.763

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$4.763

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Corphita

USA . 1,195 parts In-Stock

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Assy Fe

Spain . 1,019 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,002 parts In-Stock

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1,002

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Lixinc

USA . 368 parts In-Stock

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368

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Futuretech Components

Singapore . 100 parts In-Stock

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100

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S.R.D Solutions

India . 100 parts In-Stock

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100

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GreenTree Electronics

Israel . 35 parts In-Stock

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35

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A-Plus Industry Inc.

USA . 15 parts In-Stock

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15

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Schahn Electronic Components

Germany . 13 parts In-Stock

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13

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Overview

Unlock the power of innovation with the M27C256B-12F6 EPROM by STMicroelectronics. This high-quality memory IC offers reliable performance and unrivaled durability, thanks to its ceramic, metal-sealed co-fired package. Perfect for industrial applications, this 32Kx8 memory device provides fast access times and low standby current. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations and drives success in your projects. Discover the value and benefits of the M27C256B-12F6 EPROM today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material offers excellent durability and protection for the EPROM, ensuring reliable performance in harsh environments.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate the EPROM into existing systems.

No. of Words: 32768 words

With a high number of words, this EPROM provides ample storage capacity for data and program code, making it suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in this EPROM offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Technical Specifications

EPROM M27C256B-12F6 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

120 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T28

JESD-609 Code:

e3

Length:

36.92 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

12.75

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C256B-12F6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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