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M27C4001-12F1

STMicroelectronics

M27C4001-12F1 by STMicroelectronics

M27C4001-12F1 EPROM by STMicroelectronics features 512KX8 organization, 100 ns access time, and 524288 words capacity. Ideal for commercial applications requiring a memory density of 4194304 bit with a parallel interface. Operating at temperatures b/w 0 to 70 °C, it utilizes a common asynchronous mode with a supply voltage of 5V.

Median Price

$9.700

Lifecycle Status

Suppliers In-Stock

44

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$4.634

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$4.634

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DF Sales Co.

USA . 14 parts In-Stock

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$9.700

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14

$9.700

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DF Sales Co.

USA . 14 parts In-Stock

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$9.700

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14

$9.700

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Forefront Electronics and Design

USA . 25 parts In-Stock

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$9.800

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25

$9.800

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Component Electronics Inc.

Canada . 27 parts In-Stock

1+ parts

$15.380

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$11.540

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$10.000

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27

$15.380

$11.540

$10.000

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Chip Stock

USA . 6,350 parts In-Stock

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Vyrian

USA . 3,959 parts In-Stock

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Digiode

USA . 3,106 parts In-Stock

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Anansix

USA . 2,240 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,013 parts In-Stock

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MRC Electronics

USA . 758 parts In-Stock

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LWI Electronics Inc

India . 701 parts In-Stock

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Prism Electronics

USA . 148 parts In-Stock

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Q Components

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Corel Iberica Componentes, S.L.

Spain . 94 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 72 parts In-Stock

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Holdelec - ElecDif-Pro

France . 65 parts In-Stock

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ECAB

Sweden . 58 parts In-Stock

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Jameco Electronics

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Pegasus Components GmbH

Germany . 36 parts In-Stock

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Legend Electronics Inc.

USA . 34 parts In-Stock

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Dan-Mar Components

USA . 27 parts In-Stock

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Zilex Electronics Inc.

Canada . 25 parts In-Stock

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Inland Empire Components Inc.

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Connector Distribution Corp

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Right Parts Inc.

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R&J Components

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PC Components Company LLC

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Sinequanon

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Bristol Electronics

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Atlantic Semiconductor

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M&R Communications

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Fibra_Brandt Electronic GMBH

Germany . 12 parts In-Stock

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Speed Components Ltd

Israel . 10 parts In-Stock

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First Choice Components Inc.

USA . 9 parts In-Stock

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Electronic Expediters

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Electronics Depot

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Inventory MP

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Sea View Technologies

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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GES GmbH

Germany . 5 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

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Florida Circuit

USA . 3 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 396 parts In-Stock

1+ parts

$2.280

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396

$2.280

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Ampacity Inc.

Singapore . 507 parts In-Stock

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$3.000

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507

$3.000

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Aranea Global

USA . 1,000 parts In-Stock

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$4.541

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$4.360

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1,000

$4.541

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$4.360

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Continental Prestige Electronics

USA . 417 parts In-Stock

1+ parts

$4.634

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$4.541

417

$4.634

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$4.541

IDEA Electronic Components Group

UK . 1,683 parts In-Stock

1+ parts

$4.927

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$4.434

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1,683

$4.927

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$4.434

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Semicontronic

India . 1,006 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

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1,006

$5.000

$4.875

$4.850

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Aztec Data Supply Inc.

USA . 3,562 parts In-Stock

1+ parts

$5.080

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$5.080

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MKK Technologies

India . 1,370 parts In-Stock

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$9.264

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1,370

$9.264

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DigiPath Technology Company

USA . 1,370 parts In-Stock

1+ parts

$9.264

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1,370

$9.264

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Microchip USA

USA . 391 parts In-Stock

1+ parts

$14.110

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391

$14.110

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AZTECH Wire

Italy . 435 parts In-Stock

1+ parts

$15.701

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435

$15.701

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Lixinc

USA . 17,891 parts In-Stock

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RC Electronics

USA . 9,426 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,225 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,367 parts In-Stock

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1,367

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Alle Elektronik GmbH

Germany . 1,160 parts In-Stock

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Assy Fe

Spain . 1,132 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 888 parts In-Stock

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888

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Parana Technologies

USA . 717 parts In-Stock

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$5.890

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717

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$5.890

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Perfect Parts

USA . 197 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 48 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 9 parts In-Stock

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Eliminating Global Boundries, Inc

USA . 8 parts In-Stock

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Overview

Unlock endless possibilities with the M27C4001-12F1 EPROM by STMicroelectronics. Crafted with precision and reliability in mind, this memory IC is a game-changer for a wide range of applications. Whether you're in need of secure data storage or efficient programming solutions, this product delivers unparalleled performance. Experience seamless operation and peace of mind knowing that you're investing in top-tier quality. Upgrade your projects today with the M27C4001-12F1 EPROM and watch your ideas come to life like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability for the product.

Operating Mode: ASYNCHRONOUS

The asynchronous operation allows for flexibility in accessing and retrieving data without being tied to a clock signal.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with various systems.

Organization: 512KX8

With an organization of 512KX8, this product offers a large memory capacity which is ideal for storing data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient and reliable.

Memory IC Type: UVPROM

UVPROM (Ultra-Violet Programmable Read-Only Memory) offers non-volatile memory that can be reprogrammed when needed.

Technical Specifications

EPROM M27C4001-12F1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T32

JESD-609 Code:

e3

Length:

41.885 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP32,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C4001-12F1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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