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TMS2532-35JDL

Texas Instruments

TMS2532-35JDL by Texas Instruments

TMS2532-35JDL by Texas Instruments is a 4KX8 EPROM with 32768 bit memory density and 350 ns max access time. It has a temperature range of 0-70 °C, suitable for commercial applications requiring fast data retrieval in a compact IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,086 parts In-Stock

1+ parts

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6,086

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Digiode

USA . 2,332 parts In-Stock

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2,332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 581 parts In-Stock

1+ parts

$4.000

100+ parts

-

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581

$4.000

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Parana Technologies

USA . 2,102 parts In-Stock

1+ parts

$5.165

100+ parts

-

1k+ parts

$5.764

10k+ parts

-

2,102

$5.165

-

$5.764

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DigiPath Technology Company

USA . 85 parts In-Stock

1+ parts

$5.687

100+ parts

$5.232

1k+ parts

-

10k+ parts

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85

$5.687

$5.232

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IDEA Electronic Components Group

UK . 1,797 parts In-Stock

1+ parts

$5.803

100+ parts

-

1k+ parts

$5.223

10k+ parts

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1,797

$5.803

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$5.223

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ChromeModa Solutions

Germany . 1,222 parts In-Stock

1+ parts

$5.803

100+ parts

$4.758

1k+ parts

-

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1,222

$5.803

$4.758

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AZTECH Wire

Italy . 609 parts In-Stock

1+ parts

$7.851

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609

$7.851

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Corphita

USA . 190 parts In-Stock

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190

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Overview

Unlock a world of possibilities with the TMS2532-35JDL EPROM by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a product that exceeds expectations in the realm of memory storage. Ideal for a wide range of applications, this EPROM offers customers the value of fast access times, high memory density, and 3-state output characteristics. Experience the benefits of cutting-edge technology and seamless performance with the TMS2532-35JDL EPROM.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package body material provides durability and protection for the EPROM, making it resistant to heat and environmental factors.

No. of Terminals: 24

Having 24 terminals allows for efficient connectivity and communication within the EPROM system.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this EPROM can perform reliably in various environments without overheating.

Organization: 4KX8

The 4KX8 organization means that the EPROM can store 4096 words of 8 bits each, providing ample memory capacity for data storage.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexibility in controlling the output signals, enabling efficient data transfer and processing.

Technology: MOS

Using MOS technology ensures high-speed and reliable performance, making this EPROM a suitable choice for various applications.

Technical Specifications

EPROM TMS2532-35JDL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

350 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T24

Memory Density:

32768 bit

Memory Width:

8

No. of Terminals:

24

No. of Words:

4096 words

No. of Words Code:

4K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

EPROMs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2532-35JDL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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