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TMS27C240-150JL

Texas Instruments

TMS27C240-150JL by Texas Instruments

TMS27C240-150JL by Texas Instruments is a 256KX16 EPROM with 150 ns access time, operating at 5V. It features 3-STATE output characteristics and uses CMOS technology. Ideal for applications requiring fast memory access in commercial temperature environments.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,762 parts In-Stock

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Digiode

USA . 1,424 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 911 parts In-Stock

1+ parts

$3.649

100+ parts

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$4.156

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911

$3.649

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$4.156

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DigiPath Technology Company

USA . 321 parts In-Stock

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$4.018

100+ parts

$3.697

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321

$4.018

$3.697

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ChromeModa Solutions

Germany . 6,359 parts In-Stock

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$4.100

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$3.362

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$4.100

$3.362

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IDEA Electronic Components Group

UK . 897 parts In-Stock

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$4.100

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$3.690

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897

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AZTECH Wire

Italy . 574 parts In-Stock

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$14.936

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One Stop Electronics

USA . 1,408 parts In-Stock

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$17.000

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Corphita

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Overview

Upgrade your electronic devices with the TMS27C240-150JL EPROM from Texas Instruments, a leading manufacturer known for quality and reliability. This versatile component offers 256Kx16 organization, 3-state output characteristics, and a maximum access time of 150ns. Perfect for a wide range of applications, this EPROM provides a seamless user experience with its asynchronous operating mode and common input/output type. Trust Texas Instruments to deliver cutting-edge technology and superior performance in every product. Boost your project's efficiency and functionality with the TMS27C240-150JL EPROM today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the EPROM, ensuring reliable performance and longevity.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible and independent operation of the EPROM, making it suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies integration into existing systems.

No. of Terminals: 40

Having 40 terminals allows for efficient connectivity and communication within the EPROM, enabling seamless data transfer and storage.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in controlling the data output of the EPROM, allowing for efficient sharing of information with external devices.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high noise immunity, making the EPROM energy-efficient and reliable in various operating environments.

Technical Specifications

EPROM TMS27C240-150JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T40

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

40

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.907 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C240-150JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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