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TMS27C64-2JL4

Texas Instruments

TMS27C64-2JL4 by Texas Instruments

TMS27C64-2JL4 by Texas Instruments is an 8KX8 EPROM with 70°C max temp, 200 ns access time, and 5V supply. It's used in commercial applications for storing data with a memory density of 65536 bit and operates in parallel mode.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,754 parts In-Stock

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3,754

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Digiode

USA . 1,092 parts In-Stock

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1,092

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Distributors (Availability)

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Parana Technologies

USA . 1,604 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

$2.351

10k+ parts

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1,604

$1.790

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$2.351

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ChromeModa Solutions

Germany . 2,680 parts In-Stock

1+ parts

$2.011

100+ parts

$1.649

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2,680

$2.011

$1.649

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IDEA Electronic Components Group

UK . 579 parts In-Stock

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$2.011

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$1.810

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579

$2.011

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$1.810

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One Stop Electronics

USA . 1,628 parts In-Stock

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$5.000

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1,628

$5.000

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AZTECH Wire

Italy . 616 parts In-Stock

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$15.166

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616

$15.166

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Corphita

USA . 4,679 parts In-Stock

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DigiPath Technology Company

USA . 1,054 parts In-Stock

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$1.813

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$1.813

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Overview

Discover the power and reliability of the TMS27C64-2JL4 EPROM by Texas Instruments, a leading manufacturer in the industry. This versatile memory IC offers 8Kx8 organization and a fast access time of 200 ns, making it ideal for a wide range of applications. From embedded systems to industrial automation, this high-quality product delivers exceptional performance and durability. Trust in Texas Instruments to provide cutting-edge technology and innovative solutions for all your memory needs. Elevate your projects with the TMS27C64-2JL4 and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability in various operating conditions, making it a good choice for industrial applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with a wide range of systems and easy to integrate.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible timing and easy interfacing with different devices, enhancing versatility.

Output Characteristics: 3-STATE

3-state output enables efficient control of bus lines, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, creating a cost-effective and reliable solution.

Memory IC Type: UVPROM

UVPROM technology allows for erasing and reprogramming of data, providing flexibility and longevity to the memory storage.

Maximum Access Time: 200 ns

Fast access time ensures quick retrieval of data, suitable for applications requiring high-speed operation.

Technical Specifications

EPROM TMS27C64-2JL4 attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

200 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T28

Length:

36.83 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Programming Voltage (V):

12.5

Qualification:

Not Qualified

Maximum Seated Height:

4.907 mm

Maximum Standby Current:

.00025 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C64-2JL4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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