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TMS2532-30JDL

Texas Instruments

TMS2532-30JDL by Texas Instruments

TMS2532-30JDL by Texas Instruments is a 4KX8 EPROM with 3-STATE output, operating b/w 0°C to 70°C. Featuring a memory density of 32768 bits and max access time of 300 ns, it is ideal for commercial applications requiring fast data retrieval in a compact IN-LINE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,443

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-

-

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Digiode

USA . 294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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294

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 655 parts In-Stock

1+ parts

$4.147

100+ parts

-

1k+ parts

$4.595

10k+ parts

-

655

$4.147

-

$4.595

-

DigiPath Technology Company

USA . 1,474 parts In-Stock

1+ parts

$4.567

100+ parts

$4.201

1k+ parts

-

10k+ parts

-

1,474

$4.567

$4.201

-

-

ChromeModa Solutions

Germany . 401 parts In-Stock

1+ parts

$4.660

100+ parts

$3.821

1k+ parts

-

10k+ parts

-

401

$4.660

$3.821

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-

IDEA Electronic Components Group

UK . 345 parts In-Stock

1+ parts

$4.660

100+ parts

-

1k+ parts

$4.194

10k+ parts

-

345

$4.660

-

$4.194

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One Stop Electronics

USA . 141 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

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10k+ parts

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141

$5.000

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-

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AZTECH Wire

Italy . 513 parts In-Stock

1+ parts

$6.137

100+ parts

-

1k+ parts

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10k+ parts

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513

$6.137

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Corphita

USA . 1,901 parts In-Stock

1+ parts

-

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1,901

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TMS2532-30JDL EPROM. This cutting-edge product offers superior performance and durability in a variety of applications. With Texas Instruments' reputation for excellence in technology, you can trust that this EPROM will deliver outstanding results every time. Unlock the value and benefits of this innovative product today and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent durability and resistance to high temperatures, making the product suitable for harsh environments.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and installation in various electronic devices.

Input/Output Type: COMMON

Common input/output type simplifies integration with other components and devices.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting the EPROM to different parts of the electronic system.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the EPROM can perform reliably even in environments with elevated temperatures.

Organization: 4KX8

The 4KX8 organization allows for efficient and organized storage and retrieval of data.

Output Characteristics: 3-STATE

3-STATE output characteristics enable the EPROM to effectively control the flow of data, enhancing data management capabilities.

Memory Width: 8

Having a memory width of 8 provides sufficient capacity for storing data and instructions.

Maximum Access Time: 300 ns

With a fast maximum access time of 300 ns, the EPROM ensures quick retrieval and processing of data.

Technical Specifications

EPROM TMS2532-30JDL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

300 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T24

Memory Density:

32768 bit

Memory Width:

8

No. of Terminals:

24

No. of Words:

4096 words

No. of Words Code:

4K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

EPROMs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2532-30JDL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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