Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SMJ27C010-25JM by Texas Instruments is a 128KX8 EPROM with 125°C max temp, -55°C min temp, and 250 ns access time. Ideal for military applications due to its CMOS technology and 1048576 bit memory density.
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Provides durability and protection for the EPROM, ensuring long-term reliability.
Compatible with standard 5V power supplies, making it easy to integrate into existing systems.
Allows for independent operations without synchronization, increasing flexibility in usage.
Offers a high memory organization, suitable for storing a large amount of data efficiently.
Utilizes CMOS technology for low power consumption and high noise immunity, leading to efficient operation.
Provides fast access time, allowing for quick retrieval of data when needed.
EPROM SMJ27C010-25JM attributes and parameters. Explore more EPROM devices from Texas Instruments
Maximum Access Time:
Input/Output Type:
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Screening Level:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
SMJ27C010-25JM Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
2N2222A
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
Silicon Standard
Goodwork Semiconductor
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
SMBJ18CA
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
M27C1001-20XL3X
STMicroelectronics M27C1001-20XL3X is a 128Kx8 EPROM with 120ns access time, operating at 5V. It features a ceramic, metal-sealed co-fired package and is suitable for automotive applications due to its -40 to 125 °C temperature range. The device has a parallel interface with 32 terminals in a chip carrier package.
M27C1001-15F1
M27C1001-15F1 EPROM by STMicroelectronics features 128KX8 organization, 150 ns access time, and 1048576 bit memory density. It is ideal for commercial applications requiring a parallel CMOS technology with a max supply voltage of 5.5 V and operating temperature range of 0 to 70°C.
TMS2716-45JDL
Texas Instruments
TMS2716-45JDL by Texas Instruments is a 2KX8 EPROM with 3-STATE output, operating at 5V. It has a memory density of 16384 bit and max access time of 450 ns. Ideal for commercial applications requiring fast parallel memory access in devices with a supply voltage range of 4.75V to 5.25V.
TMS27C040-100JL4
TMS27C040-100JL4 by Texas Instruments is a 512KX8 EPROM with 100 ns access time. Operating at 5V, it features 3-STATE output and CMOS technology. Ideal for commercial applications requiring fast memory access in a rectangular ceramic package.
AM27C256-150DI
Spansion
Spansion's AM27C256-150DI is a 32KX8 EPROM with 262144 bit memory density. It operates at 5V, has a max access time of 150ns, and uses CMOS technology. Ideal for industrial applications requiring reliable non-volatile memory storage in a rectangular ceramic package.
TMS27C32-25JE
TMS27C32-25JE by Texas Instruments is a 4KX8 EPROM with 3-STATE output, operating at -40 to 85 °C. It has a supply voltage of 4.5-5.5V and max access time of 250ns. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
5962-8766103XA
The Texas Instruments 5962-8766103XA EPROM features a 16KX8 organization, CMOS technology, and 150 ns max access time. Ideal for military applications due to its MILITARY temperature grade and UVPROM memory IC type. Operating at a nominal voltage of 5V with a package style of IN-LINE, WINDOW.
TMS27C210A-12JE4
TMS27C210A-12JE4 by Texas Instruments is a 64KX16 EPROM with 120ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and INDUSTRIAL temperature grade. Commonly used in industrial applications requiring reliable non-volatile memory storage.
TMS27C32JL4
TMS27C32JL4 by Texas Instruments is a 4KX8 EPROM with 3-STATE output, operating at 5V. It features a max access time of 250ns and memory density of 32768 bit. Ideal for commercial applications requiring fast parallel memory access in a compact IN-LINE package.
TMS27C010-250JL
TMS27C010-250JL by Texas Instruments is a 128KX8 EPROM with 250 ns access time, 5V supply voltage, and 32 terminals. It is used in commercial applications for storing data in parallel format with a memory density of 1048576 bit.
M27C512-20XF1
M27C512-20XF1 EPROM by STMicroelectronics features 64KX8 organization, 200ns access time, and 5V nominal voltage. Ideal for applications requiring reliable non-volatile memory storage in commercial temperature environments.
NMC27C16BQ250
NMC27C16BQ250 by Texas Instruments is a 2Kx8 EPROM with 16384-bit memory density. It operates at 5V, has a max access time of 250ns, and uses CMOS technology. This UVPROM is ideal for applications requiring fast parallel data retrieval in commercial temperature environments.
5962-9175204MXA
Texas Instruments' 5962-9175204MXA EPROM features 512KX8 organization, CMOS technology, and 150 ns max access time. Ideal for military applications due to MIL temperature grade and UVPROM memory IC type.
TMS27C240-15JE
TMS27C240-15JE by Texas Instruments is a 256KX16 EPROM with 150 ns access time, 3-STATE output, and operates at -40 to 85 °C. It is used in industrial applications for storing data securely due to its UVPROM technology and common I/O type.
TMS27C010A-150JL4
TMS27C010A-150JL4 by Texas Instruments is a 128KX8 EPROM with 150 ns access time, 5V supply voltage, and 32 terminals. It operates in asynchronous mode with 3-STATE output characteristics. Commonly used for memory storage applications due to its high density and fast access time.
TMS27C400-15JE
TMS27C400-15JE by Texas Instruments is a 512KX8 EPROM with 150 ns access time, 3-STATE output, and operates at -40 to 85 °C. It is used in industrial applications for storing data parallelly with a memory density of 4194304 bit.
M27C256B-15F6
M27C256B-15F6 by STMicroelectronics is a 32KX8 EPROM with 150 ns access time, operating at 5V. It features a CMOS technology, asynchronous mode, and 3-STATE output. Commonly used in industrial applications for memory storage due to its 262144-bit density and parallel interface.
TMM27512AD-17
Toshiba
Toshiba TMM27512AD-17 EPROM features 64KX8 organization, 170 ns access time, and 524288 bit memory density. Ideal for commercial applications requiring a 5V supply voltage and asynchronous operation in a ceramic, glass-sealed package.
TMS27C210A-120JL
TMS27C210A-120JL by Texas Instruments is a 64KX16 EPROM with 120 ns access time, 5V supply voltage, and CMOS technology. It features a 3-STATE output and operates in parallel mode. Commonly used for memory storage applications due to its high density and fast access time.
TMS27C256-1JP4
TMS27C256-1JP4 by Texas Instruments is a 32KX8 EPROM with 262144 bit memory density. It operates at 5V, has a programming voltage of 12.5V, and offers a max access time of 170 ns. Commonly used in commercial applications requiring reliable non-volatile memory storage.
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LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
SMJ27C128-120JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Technology: CMOS;
SMJ27C010A-15J
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; No. of Words Code: 128K;
SMJ27C010-17JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
SMJ27C040-15JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
SMJ27C010A-20J
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
SMJ27C010A-12J
SMJ27C128-12JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
SMJ2532-35JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
SMJ27C010A-15JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
SMJ27C010-20JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, GLASS-SEALED;
SMJ27C040-12JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
SMJ27C010A-20JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Supply Current: 30 mA;
SMJ27C010-30JM
SMJ27C128-100JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SMJ2532-45JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
SMJ27C010A-12JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;
SMJ2532-30JM
EPROMs; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Technology: MOS;
SMJ2532-45JDM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 32768 bit;
SMJ27C040-10JM
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: WDIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
Rochester Electronics
UVPROM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
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