Loading...

SMJ2532-45JDM

Texas Instruments

SMJ2532-45JDM by Texas Instruments

The Texas Instruments SMJ2532-45JDM is a 4KX8 EPROM with 24 terminals, operating b/w -55 to 125°C. Featuring 3-STATE output, it offers a memory density of 32768 bit and max access time of 450 ns. Ideal for military-grade applications requiring reliable non-volatile memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,771

-

-

-

-

Digiode

USA . 503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

503

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,135 parts In-Stock

1+ parts

$3.970

100+ parts

-

1k+ parts

$4.440

10k+ parts

-

1,135

$3.970

-

$4.440

-

ChromeModa Solutions

Germany . 6,564 parts In-Stock

1+ parts

$4.461

100+ parts

$3.658

1k+ parts

-

10k+ parts

-

6,564

$4.461

$3.658

-

-

IDEA Electronic Components Group

UK . 1,045 parts In-Stock

1+ parts

$4.461

100+ parts

-

1k+ parts

$4.015

10k+ parts

-

1,045

$4.461

-

$4.015

-

AZTECH Wire

Italy . 633 parts In-Stock

1+ parts

$17.230

100+ parts

-

1k+ parts

-

10k+ parts

-

633

$17.230

-

-

-

One Stop Electronics

USA . 1,085 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,085

$27.000

-

-

-

Corphita

USA . 3,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,334

-

-

-

-

DigiPath Technology Company

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$4.022

1k+ parts

-

10k+ parts

-

3

-

$4.022

-

-

Overview

Unleash the power of cutting-edge technology with the SMJ2532-45JDM EPROM from Texas Instruments. Crafted with precision and expertise, this military-grade memory IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this UVPROM boasts 4Kx8 organization, 3-STATE output characteristics, and a lightning-fast maximum access time of 450 ns. Experience seamless operation in extreme temperatures ranging from -55°C to 125°C. Elevate your projects with the quality and innovation that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal conductivity and physical protection, making it a durable and reliable choice for EPROM applications.

Screening Level: 38535Q/M;38534H;883B

The high screening level ensures that the EPROM meets stringent quality standards and is suitable for use in military and aerospace applications.

Organization: 4KX8

With a 4Kx8 organization, this EPROM offers a good balance between memory capacity and access speed, making it suitable for a variety of applications.

Memory IC Type: UVPROM

UVPROM technology allows for electrical erasure of the memory, making this EPROM reprogrammable and versatile for various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the EPROM can withstand harsh environmental conditions and continue to function reliably.

Technical Specifications

EPROM SMJ2532-45JDM attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

450 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T24

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

4096 words

No. of Words Code:

4K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

4KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

EPROMs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SMJ2532-45JDM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19