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Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.

Programmable Logic Devices (PLD)

Available Parts 2,400+

Part RoHS Manufacturer Description Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines
EPM240T100C5N by Intel

EPM240T100C5N

Intel

FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FLASH PLD

OTHER

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

7.5 ns

YES

2.625 V

192

CMOS

80

2.5

1.5/3.3,2.5/3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

Programmable Logic Devices

YES

MACROCELL

2.375 V

.5 mm

85 Cel

0 DEDICATED INPUTS, 80 I/O

0

0 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQFP-G100

3

1.2 mm

14 mm

Not Qualified

IT CAN ALSO OPERATE AT 3.3V

e3

30

80

260

14 mm

YES

80

EPM570T100C5N by Intel

EPM570T100C5N

Intel

FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FLASH PLD

OTHER

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

8.7 ns

YES

2.625 V

440

CMOS

76

2.5

1.5/3.3,2.5/3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

Programmable Logic Devices

YES

MACROCELL

2.375 V

.5 mm

85 Cel

0 DEDICATED INPUTS, 76 I/O

0

0 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.2 mm

14 mm

Not Qualified

IT CAN ALSO OPERATE AT 3.3V

e3

30

76

260

14 mm

YES

76

XC2C128-6VQG100C by Xilinx

XC2C128-6VQG100C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FLASH PLD

COMMERCIAL

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

6 ns

YES

1.9 V

128

CMOS

80

PLA-TYPE

1.8

1.5/3.3,1.8

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

Programmable Logic Devices

YES

MACROCELL

1.7 V

.5 mm

70 Cel

0 DEDICATED INPUTS, 80 I/O

0

0 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.2 mm

14 mm

Not Qualified

YES

e3

152 MHz

30

80

260

14 mm

YES

80

EPM240T100I5N by Intel

EPM240T100I5N

Intel

FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; JTAG Boundary Scan Test: YES;

FLASH PLD

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

7.5 ns

YES

2.625 V

192

CMOS

80

2.5

1.5/3.3,2.5/3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

Programmable Logic Devices

YES

MACROCELL

2.375 V

.5 mm

100 Cel

0 DEDICATED INPUTS, 80 I/O

0

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQFP-G100

3

1.2 mm

14 mm

Not Qualified

IT CAN ALSO OPERATE AT 3.3V

e3

30

80

260

14 mm

YES

80

ATF22V10C-15PU by Microchip Technology

ATF22V10C-15PU

Microchip Technology

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

FLASH PLD

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

15 ns

NO

5.5 V

CMOS

22

PAL-TYPE

5

TUBE

5

IN-LINE

DIP24,.3

Programmable Logic Devices

MACROCELL

4.5 V

132

2.54 mm

85 Cel

10 DEDICATED INPUTS, 10 I/O

10

-40 Cel

MATTE TIN

DUAL

R-PDIP-T24

1

5.334 mm

7.62 mm

Not Qualified

e3

55.5 MHz

10

31.877 mm

10

XC9572XL-10VQG44C by Xilinx

XC9572XL-10VQG44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

FLASH PLD

COMMERCIAL

GULL WING

44

TQFP

SQUARE

PLASTIC/EPOXY

10 ns

YES

3.6 V

72

CMOS

34

3.3

2.5/3.3,3.3

FLATPACK, THIN PROFILE

TQFP44,.47SQ,32

Programmable Logic Devices

YES

MACROCELL

3 V

.8 mm

70 Cel

0 DEDICATED INPUTS, 34 I/O

0

0 Cel

MATTE TIN

QUAD

S-PQFP-G44

3

1.2 mm

10 mm

Not Qualified

72 MACROCELLS

e3

100 MHz

30

34

260

10 mm

YES

34

EPM1270T144I5N by Intel

EPM1270T144I5N

Intel

FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Technology Used: CMOS;

FLASH PLD

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

10 ns

YES

2.625 V

980

CMOS

116

2.5

1.5/3.3,2.5/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

Programmable Logic Devices

YES

MACROCELL

2.375 V

.5 mm

100 Cel

0 DEDICATED INPUTS, 116 I/O

0

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQFP-G144

3

1.6 mm

20 mm

Not Qualified

IT CAN ALSO OPERATE AT 3.3V

e3

30

116

260

20 mm

YES

116

ATF1504AS-10JU44 by Microchip Technology

ATF1504AS-10JU44

Microchip Technology

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

EE PLD

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

10 ns

YES

5.5 V

64

CMOS

32

5

TUBE

CHIP CARRIER

LDCC44,.7SQ

YES

MACROCELL

4.5 V

40

1.27 mm

85 Cel

0 DEDICATED INPUTS, 32 I/O

0

-40 Cel

MATTE TIN

QUAD

S-PQCC-J44

3

4.57 mm

16.5862 mm

Not Qualified

POWER -UP RESET; SECURITY FUSE

e3

125 MHz

40

32

245

16.5862 mm

YES

32

EPM1270T144C5N by Intel

EPM1270T144C5N

Intel

FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FLASH PLD

OTHER

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

10 ns

YES

2.625 V

980

CMOS

116

2.5

1.5/3.3,2.5/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

Programmable Logic Devices

YES

MACROCELL

2.375 V

.5 mm

85 Cel

0 DEDICATED INPUTS, 116 I/O

0

0 Cel

MATTE TIN

QUAD

S-PQFP-G144

3

1.6 mm

20 mm

Not Qualified

IT CAN ALSO OPERATE AT 3.3V

e3

30

116

260

20 mm

YES

116

XC2C64A-7VQG44C by Xilinx

XC2C64A-7VQG44C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

FLASH PLD

COMMERCIAL

GULL WING

44

TQFP

SQUARE

PLASTIC/EPOXY

7.5 ns

YES

1.9 V

64

CMOS

1.8

1.5/3.3,1.8

FLATPACK, THIN PROFILE

TQFP44,.47SQ,32

Programmable Logic Devices

YES

MACROCELL

1.7 V

.8 mm

70 Cel

0 DEDICATED INPUTS, 33 I/O

0

0 Cel

MATTE TIN

QUAD

S-PQFP-G44

3

1.2 mm

10 mm

Not Qualified

REAL DIGITAL DESIGN TECHNOLOGY

e3

200 MHz

30

260

10 mm

YES

33

XC2C128-7VQG100C by Xilinx

XC2C128-7VQG100C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FLASH PLD

COMMERCIAL

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

7.5 ns

YES

1.9 V

128

CMOS

80

PLA-TYPE

1.8

1.5/3.3,1.8

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

Programmable Logic Devices

YES

MACROCELL

1.7 V

.5 mm

70 Cel

0 DEDICATED INPUTS, 80 I/O

0

0 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.2 mm

14 mm

Not Qualified

YES

e3

119 MHz

30

80

260

14 mm

YES

80

ATF1508AS-10AU100 by Microchip Technology

ATF1508AS-10AU100

Microchip Technology

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

EE PLD

INDUSTRIAL

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

10 ns

YES

5.5 V

128

5

TRAY

3.3/5,5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

Programmable Logic Devices

YES

MACROCELL

4.5 V

.5 mm

85 Cel

0 DEDICATED INPUTS, 80 I/O

0

-40 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.2 mm

14 mm

Not Qualified

YES

e3

125 MHz

40

260

14 mm

YES

80

XC95144XL-10TQG144C by Xilinx

XC95144XL-10TQG144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FLASH PLD

COMMERCIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

10 ns

YES

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

Programmable Logic Devices

YES

MACROCELL

3 V

.5 mm

70 Cel

0 DEDICATED INPUTS, 117 I/O

0

0 Cel

MATTE TIN

QUAD

S-PQFP-G144

3

1.6 mm

20 mm

Not Qualified

YES

e3

138.88 MHz

30

117

260

20 mm

YES

117

EPM240T100C5NAH by Intel

EPM240T100C5NAH

Intel

FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Output Function: MACROCELL;

FLASH PLD

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

7.5 ns

YES

2.625 V

192

80

2.5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

YES

MACROCELL

2.375 V

.5 mm

85 Cel

0 DEDICATED INPUTS, 80 I/O

0

0 Cel

QUAD

S-PQFP-G100

1.2 mm

14 mm

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