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TIBPAL16R6-25CFN

Texas Instruments

TIBPAL16R6-25CFN by Texas Instruments

TIBPAL16R6-25CFN by Texas Instruments is a TTL technology PAL-type PLD with 25ns propagation delay, 10 inputs, and 64 product terms. It is used in applications requiring mixed output functions, operates at max clock frequency of 30MHz, and has a temp range of 0-75°C.

Median Price

$1.390

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 275 parts In-Stock

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-

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$1.390

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$1.150

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$1.030

275

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$1.150

$1.030

DigiKey

USA . 275 parts In-Stock

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$1.190

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Verical

USA . 267 parts In-Stock

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$1.438

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$1.288

267

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$1.288

Distributors (In-Stock)

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Freelance Electronics

USA . 10 parts In-Stock

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$0.948

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$0.948

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Digiode

USA . 2,553 parts In-Stock

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$1.083

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Vyrian

USA . 3,455 parts In-Stock

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Inland Empire Components Inc.

USA . 1,370 parts In-Stock

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Pride Electronics

USA . 485 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 143 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 76 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,906 parts In-Stock

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$1.026

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Parana Technologies

USA . 500 parts In-Stock

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$77.120

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$77.120

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DigiPath Technology Company

USA . 1,732 parts In-Stock

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$84.919

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$78.125

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$78.125

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ChromeModa Solutions

Germany . 6,815 parts In-Stock

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$86.652

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$71.055

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$86.652

$71.055

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IDEA Electronic Components Group

UK . 631 parts In-Stock

1+ parts

$86.652

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$82.319

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$77.987

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631

$86.652

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$77.987

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Assy Fe

Spain . 1,122 parts In-Stock

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Microchip USA

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Overview

Unlock the potential of your electronic designs with the TIBPAL16R6-25CFN from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their Programmable Logic Devices. Perfect for a wide range of applications, this PLD offers customers unmatched value and benefits. Whether you're working on digital circuits, telecommunications systems, or industrial automation, the TIBPAL16R6-25CFN provides the flexibility and performance you need to bring your projects to life. Trust Texas Instruments to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the device, ensuring long-term reliability.

Propagation Delay: 25 ns

Fast propagation delay enables quick processing of signals, making the device suitable for time-critical applications.

Surface Mount: YES

Ease of installation and integration into circuit boards, reducing assembly time and costs.

Maximum Supply Voltage: 5.25 V

Wide operating voltage range provides flexibility in power supply options for various applications.

Screening Level: MIL-STD-883

Meets stringent military standards for quality and reliability, ensuring high performance in demanding environments.

Technology Used: TTL

TTL technology offers low power consumption and fast switching speeds, making the device energy-efficient and responsive.

No. of Inputs: 10

Sufficient number of inputs for versatile input configurations and complex logic operations.

Package Shape: SQUARE

Compact and space-saving design that allows for efficient utilization of board space.

Form Of Terminal: J BEND

J bend terminals facilitate easy soldering and create secure connections, improving overall reliability.

Architecture: PAL-TYPE

Programmable Array Logic architecture provides flexibility in configuring logic functions to meet specific application requirements.

Nominal Supply Voltage (V): 5

Stable nominal supply voltage ensures consistent performance and reliable operation of the device.

Power Supplies (V): 5

Well-matched power supplies ensure proper functioning and prevent damage to internal components.

No. of Terminals: 20

Adequate number of terminals for versatile connectivity options and integration into various circuit layouts.

Programmable IC Type: OT PLD

Programmable IC type offers customization options for implementing specific logic functions as per application requirements.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides protection, compactness, and ease of handling during installation.

Output Function: MIXED

Mixed output function allows for versatile output configurations, enhancing the device's applicability across different applications.

No. of Product Terms: 64

Ample product terms for implementing complex logic functions and maximizing design flexibility.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage allows for operation in a wide range of voltage conditions, increasing versatility.

Maximum Operating Temperature: 75 °C

High maximum operating temperature tolerance ensures reliable performance even in elevated temperature environments.

Pitch Of Terminal: 1.27 mm

Standard pitch spacing for terminals allows for easy integration into existing circuit layouts and board designs.

Organization: 8 DEDICATED INPUTS, 2 I/O

Well-organized input and output configuration for efficient logic operations and signal processing.

No. of Dedicated Inputs: 8

Dedicated inputs for specific functions streamline logic operations and simplify circuit design.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature capability ensures reliable performance in cold environments or during startup conditions.

Finishing Of Terminal Used: NICKEL PALLADIUM GOLD

High-quality terminal finishing for enhanced durability, corrosion resistance, and long-term reliability.

Position Of Terminal: QUAD

Quad positioning of terminals allows for efficient soldering and secure connections, ensuring stable operation.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates a moderate level of sensitivity, suitable for most assembly and operating environments.

Maximum Seated Height: 4.57 mm

Low seated height for compact and space-saving device integration in limited clearance applications.

Width: 8.965 mm

Narrow width for efficient board space utilization and compact system design.

Maximum Clock Frequency: 30 MHz

High maximum clock frequency for fast signal processing and responsive operation in time-critical applications.

No. of Outputs: 6

Adequate number of outputs for versatile signal routing and output options, catering to diverse application needs.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time allowance at peak reflow temperature for proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 245

High peak reflow temperature tolerance for safe and effective soldering during assembly processes.

Length: 8.965 mm

Optimal length for compact and space-efficient device placement on circuit boards.

No. of I/O Lines: 2

Adequate number of input/output lines for versatile signal processing and connectivity options.

Grading Of Temperature: COMMERCIAL EXTENDED

Commercial extended temperature grading for reliability in a wide range of operating conditions, catering to various application environments.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R6-25CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 2 I/O

No. of Outputs:

6

Output Function:

Mixed

No. of Inputs:

10

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

2

Maximum Clock Frequency:

30 MHz

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Width:

8.965 mm

Length:

8.965 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e4

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

TIBPAL16R6-25CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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