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TIBPAL16L8-10CN

Texas Instruments

TIBPAL16L8-10CN by Texas Instruments

TIBPAL16L8-10CN by Texas Instruments is a TTL technology-based PAL-type PLD with 10 ns propagation delay and 5.25 V max supply voltage. It features 16 inputs, 64 product terms, and supports up to 55.5 MHz clock frequency. Ideal for applications requiring combinatorial output functions in commercial extended temperature environments.

Median Price

$22.220

Lifecycle Status

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38

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Component Electronics Inc.

Canada . 168 parts In-Stock

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Forefront Electronics and Design

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Sunrise Surplus Inc.

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Manoshevitz Elec. Sales

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Legend Electronics Inc.

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Connect4Technologies Inc.

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Prism Electronics

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Zilex Electronics Inc.

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Speed Components Ltd

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Inventory MP

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Distributors (Availability)

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Component Stockers USA

USA . 3,215 parts In-Stock

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$2.720

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$2.590

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$2.510

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AZTECH Wire

Italy . 538 parts In-Stock

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

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$102.266

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ChromeModa Solutions

Germany . 4,470 parts In-Stock

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IDEA Electronic Components Group

UK . 838 parts In-Stock

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Corphita

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Lixinc

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Microchip USA

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of programmable logic devices with the TIBPAL16L8-10CN by Texas Instruments. Manufactured using top-quality materials and cutting-edge technology, this PAL-type device offers lightning-fast 10ns propagation delay and versatile combinatorial output functions. With 16 inputs, 8 outputs, and 64 product terms, this PLD is perfect for a wide range of applications, from industrial automation to telecommunications. Experience the reliability and performance that Texas Instruments is known for, while enjoying the value and flexibility that the TIBPAL16L8-10CN brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay: 10 ns

Fast propagation delay allows for quick signal processing and efficient operation.

Maximum Supply Voltage: 5.25 V

Wide range of supply voltage allows for flexibility in powering the device.

Technology Used: TTL

TTL technology offers reliable operation and compatibility with other TTL devices.

No. of Inputs: 16

High number of inputs allows for complex logic configurations and versatile functionality.

Package Shape: RECTANGULAR

Rectangular shape provides ease of handling and integration into electronic systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals offer secure connection and stability in circuit board mounting.

Architecture: PAL-TYPE

PAL-type architecture provides programmable logic capabilities for customization and adaptability.

Nominal Supply Voltage (V): 5

Standard nominal supply voltage ensures compatibility with common power sources.

Power Supplies (V): 5

Consistent power supply voltage for reliable performance and operation.

No. of Terminals: 20

Adequate number of terminals for connecting to external components and circuitry.

Programmable IC Type: OT PLD

Programmable IC type enables customization of logic functions and configurations.

Package Style (Meter): IN-LINE

In-line package style for streamlined integration and space-saving design.

Output Function: COMBINATORIAL

Combinatorial output function for creating various logic outputs based on input signals.

No. of Product Terms: 64

High number of product terms for complex logic design and implementation.

Minimum Supply Voltage: 4.75 V

Provides a lower limit for supply voltage to ensure optimal performance and reliability.

Maximum Operating Temperature: 75 °C

Wide operating temperature range for versatility in different environmental conditions.

Pitch Of Terminal: 2.54 mm

Standard pitch of terminals for compatibility with widely used connectors and sockets.

Organization: 10 DEDICATED INPUTS, 6 I/O

Dedicated inputs and I/O lines for specific functions and signal routing.

No. of Dedicated Inputs: 10

Specific inputs for dedicated functions and logic configurations.

Minimum Operating Temperature: 0 °C

Lowest operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish for corrosion resistance and long-term durability.

Position Of Terminal: DUAL

Dual terminal positions for flexibility in circuit board mounting and connectivity.

Maximum Seated Height: 5.08 mm

Low seated height for compact design and space-saving installation.

Width: 7.62 mm

Compact width for easy integration and space efficiency in electronic systems.

Maximum Clock Frequency: 55.5 MHz

High maximum clock frequency for rapid signal processing and efficient operation.

No. of Outputs: 8

Sufficient number of outputs for versatile logic function and signal routing.

Length: 24.325 mm

Optimal length for fitting into standard electronic enclosures and mounting configurations.

No. of I/O Lines: 6

I/O lines for input and output connectivity with external devices and circuitry.

Grading Of Temperature: COMMERCIAL EXTENDED

Commercial extended temperature grading for reliability in varied operating conditions.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-10CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

55.5 MHz

Propagation Delay:

10 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.325 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL16L8-10CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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