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TIBPAL16L8-10MFK

Texas Instruments

TIBPAL16L8-10MFK by Texas Instruments

TIBPAL16L8-10MFK by Texas Instruments is a TTL technology PAL-type PLD with 12ns propagation delay, 64 product terms, and 52.5MHz clock frequency. Ideal for military applications requiring high-speed combinatorial output functions in a ceramic chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,741 parts In-Stock

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Vyrian

USA . 3,078 parts In-Stock

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3,078

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Distributors (Availability)

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One Stop Electronics

USA . 363 parts In-Stock

1+ parts

$11.000

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363

$11.000

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AZTECH Wire

Italy . 864 parts In-Stock

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$19.267

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864

$19.267

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Parana Technologies

USA . 316 parts In-Stock

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$49.050

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316

$49.050

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DigiPath Technology Company

USA . 1,452 parts In-Stock

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$54.010

100+ parts

$49.689

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1,452

$54.010

$49.689

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ChromeModa Solutions

Germany . 2,365 parts In-Stock

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$55.112

100+ parts

$45.192

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2,365

$55.112

$45.192

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IDEA Electronic Components Group

UK . 651 parts In-Stock

1+ parts

$55.112

100+ parts

$52.356

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$49.601

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651

$55.112

$52.356

$49.601

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Corphita

USA . 3,468 parts In-Stock

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Overview

Unlock the power of programmable logic with the TIBPAL16L8-10MFK by Texas Instruments. Crafted with precision and expertise, this PAL-type device offers fast propagation delay of 12 ns and a maximum clock frequency of 52.5 MHz. Ideal for military-grade applications, this versatile PLD boasts 10 dedicated inputs and 6 I/O lines, making it perfect for a wide range of projects. Experience the reliability and innovation that Texas Instruments is known for, and elevate your designs to new heights with the TIBPAL16L8-10MFK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and reliability for the PLD, making it suitable for harsh environments.

Propagation Delay: 12 ns

The fast propagation delay of 12 ns ensures quick response times and efficient operation of the PLD.

Technology Used: TTL

The TTL technology used in this PLD provides compatibility with other TTL devices and ensures reliable communication and signal integrity.

No. of Inputs: 16

With 16 inputs, this PLD can handle a wide range of input signals and provide greater flexibility in its functionality.

Output Function: COMBINATORIAL

The combinatorial output function allows for logic operations to be performed based on the input signals, enabling complex operations and decision-making processes.

Maximum Clock Frequency: 52.5 MHz

The high maximum clock frequency of 52.5 MHz enables fast processing and execution of logic functions, making this PLD suitable for high-speed applications.

Grading Of Temperature: MILITARY

The military-grade temperature grading ensures that this PLD can operate reliably in extreme temperature conditions, making it ideal for military and aerospace applications.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-10MFK attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

52.5 MHz

Propagation Delay:

12 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC20,.35SQ

Width:

8.89 mm

Length:

8.89 mm

Maximum Seated Height:

2.03 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-N20

Qualified:

No

Trade Compliance

TIBPAL16L8-10MFK Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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