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TIBPAD16N8-7CN

Texas Instruments

TIBPAD16N8-7CN by Texas Instruments

TIBPAD16N8-7CN by Texas Instruments is a TTL technology Programmable Logic Device with 10 ns propagation delay and 5.25 V max supply voltage. It features 16 inputs, 8 outputs, and is ideal for applications requiring combinatorial output functions in commercial extended temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 7,064 parts In-Stock

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Digiode

USA . 4,081 parts In-Stock

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Bristol Electronics

USA . 127 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 115 parts In-Stock

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R&J Components

USA . 30 parts In-Stock

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Electronic Expediters

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AZTECH Wire

Italy . 827 parts In-Stock

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$8.477

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827

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Ampacity Inc.

Singapore . 1,393 parts In-Stock

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$14.000

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One Stop Electronics

USA . 875 parts In-Stock

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$21.000

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Parana Technologies

USA . 242 parts In-Stock

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$83.934

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DigiPath Technology Company

USA . 2,120 parts In-Stock

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$92.422

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$85.028

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ChromeModa Solutions

Germany . 4,262 parts In-Stock

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$94.308

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$77.333

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IDEA Electronic Components Group

UK . 480 parts In-Stock

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$89.593

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Corphita

USA . 1,927 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Unlock the power of cutting-edge technology with the TIBPAD16N8-7CN by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in every product they offer. The TIBPAD16N8-7CN falls under the Programmable Logic Devices category, making it versatile for a wide range of applications. With fast propagation delay and a wide range of operating temperatures, this PLD is perfect for projects that require precision and efficiency. Experience seamless performance and unmatched value with the TIBPAD16N8-7CN, your go-to solution for all your programmable logic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a durable and cost-effective package for the PLD.

Propagation Delay: 10 ns

The fast propagation delay of 10 ns ensures quick processing of signals, making it suitable for time-sensitive applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V allows for a wider range of operating conditions.

Technology Used: TTL

The use of TTL technology offers compatibility with a wide range of devices and systems.

No. of Inputs: 16

With 16 inputs, the PLD can handle a large number of input signals for complex logic functions.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the PLD into existing circuit designs.

Form Of Terminal: THROUGH-HOLE

The through-hole terminals provide secure connections and ease of soldering during PCB assembly.

Architecture: PAD-TYPE

The pad-type architecture simplifies the design and layout process, improving overall efficiency.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V is commonly used in many electronic systems, ensuring compatibility.

Power Supplies (V): 5

The consistent power supply of 5 V ensures stable operation of the PLD.

No. of Terminals: 20

With 20 terminals, the PLD offers flexibility in connecting to other components and peripherals.

Programmable IC Type: OT PLD

Being an OTP PLD, it offers a one-time programmable solution for custom logic functions.

Package Style (Meter): IN-LINE

The in-line package style helps in seamless integration and space-saving on the PCB.

Output Function: COMBINATORIAL

The combinatorial output function allows for complex logic operations to be performed efficiently.

No. of Product Terms: 16

With 16 product terms, the PLD can implement a variety of logic functions and configurations.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage of 4.75 V ensures efficient power usage and flexibility in different voltage scenarios.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75°C, the PLD can withstand high temperature environments.

Pitch Of Terminal: 2.54 mm

The standard pitch of 2.54 mm makes the PLD compatible with commonly used connectors and sockets.

Organization: 10 DEDICATED INPUTS, 6 I/O

The organization of 10 dedicated inputs and 6 I/O lines allows for a structured and efficient logic design.

No. of Dedicated Inputs: 10

Having 10 dedicated inputs provides specific input channels for key logic functions, improving performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation even in colder environments.

Position Of Terminal: DUAL

The dual position of terminals offers flexibility in PCB layout and component placement.

Maximum Seated Height: 5.08 mm

The low maximum seated height of 5.08 mm saves space and allows for compact system designs.

Width: 7.62 mm

The compact width of 7.62 mm enables the PLD to be used in space-constrained applications.

No. of Outputs: 8

With 8 outputs, the PLD can drive multiple external devices with ease.

Length: 24.325 mm

The length of 24.325 mm provides a balanced form factor for easy integration in various system layouts.

No. of I/O Lines: 6

With 6 I/O lines, the PLD can interface with external devices and peripherals efficiently.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures reliable performance in a wide range of operating conditions.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAD16N8-7CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

16

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Propagation Delay:

10 ns

Technology:

TTL

Architecture:

PAD-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.325 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-PDIP-T20

Qualified:

No

Trade Compliance

TIBPAD16N8-7CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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