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TIBPAD18N8-6CFN

Texas Instruments

TIBPAD18N8-6CFN by Texas Instruments

TIBPAD18N8-6CFN by Texas Instruments is a PLD with 6ns propagation delay, TTL technology, and 18 inputs. It is used for combinatorial output functions in applications requiring programmable ICs with 10 dedicated inputs and 8 I/O lines.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,341 parts In-Stock

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Digiode

USA . 3,784 parts In-Stock

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3,784

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Distributors (Availability)

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AZTECH Wire

Italy . 579 parts In-Stock

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$8.626

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579

$8.626

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One Stop Electronics

USA . 1,000 parts In-Stock

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$19.000

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$19.000

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Parana Technologies

USA . 2,313 parts In-Stock

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$82.652

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DigiPath Technology Company

USA . 1,938 parts In-Stock

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$91.010

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$83.729

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ChromeModa Solutions

Germany . 3,212 parts In-Stock

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$92.867

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$76.151

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IDEA Electronic Components Group

UK . 2,127 parts In-Stock

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$92.867

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$88.224

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$83.580

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2,127

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Corphita

USA . 4,029 parts In-Stock

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Overview

Unlock endless possibilities with the TIBPAD18N8-6CFN programmable logic device by Texas Instruments. Crafted with precision and expertise, this PLD offers lightning-fast propagation delay of 6 ns and a maximum supply voltage of 5.25 V for seamless performance. Ideal for a wide range of applications, from industrial automation to consumer electronics, this chip carrier-style device boasts 18 inputs and 8 outputs, providing unparalleled versatility. Embrace innovation and efficiency with Texas Instruments' cutting-edge technology, powering your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the PLD.

Propagation Delay: 6 ns

The low propagation delay allows for fast processing of signals, making this PLD suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and assembly easier, saving time and effort during production.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage provides flexibility in power requirements and compatibility with a wide range of systems.

Technology Used: TTL

TTL technology ensures compatibility with older systems and provides reliable logic operation for the PLD.

No. of Inputs: 18

Having a large number of inputs allows for more complex logic functions to be implemented using this PLD.

Package Shape: SQUARE

The square package shape makes it easier to handle and install the PLD, contributing to a more efficient assembly process.

Form Of Terminal: J BEND

The J bend terminals provide secure connections and easy soldering, enhancing the reliability of the PLD in operation.

Architecture: PAD-TYPE

The pad-type architecture simplifies the interfacing of the PLD with other components, making it versatile for various applications.

Nominal Supply Voltage (V): 5

The consistent nominal supply voltage ensures stable performance of the PLD in different operating conditions.

Power Supplies (V): 5

Having multiple power supply options allows for flexibility in setting up the PLD in different systems or configurations.

No. of Terminals: 20

Having a sufficient number of terminals enables easy connectivity and integration of the PLD into the overall circuit design.

Programmable IC Type: OT PLD

The OT PLD type offers programmability, allowing for customization of logic functions based on specific requirements.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and thermal efficiency, making the PLD suitable for space-constrained applications.

Output Function: COMBINATORIAL

The combinatorial output function enables the creation of complex logic functions using simple building blocks, enhancing the versatility of the PLD.

No. of Product Terms: 8

The presence of multiple product terms allows for the implementation of various logic functions, making this PLD versatile in application.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources and reduces the risk of overvoltage damage.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature range allows this PLD to function reliably in a variety of environmental conditions.

Pitch Of Terminal: 1.27 mm

The standard pitch of terminals simplifies the integration of the PLD into existing circuit designs and facilitates efficient assembly.

Organization: 10 DEDICATED INPUTS, 8 I/O

The dedicated inputs and I/O lines offer flexibility in configuring the PLD for specific logic functions and interface requirements.

No. of Dedicated Inputs: 10

Having dedicated inputs allows for specific signal conditioning and processing, enhancing the precision and complexity of logic operations.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance of the PLD even in cold environments or during startup conditions.

Position Of Terminal: QUAD

The quad position of terminals provides easy access and connection points for integrating the PLD into a wider circuit layout.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for compact and space-efficient integration of the PLD into electronic systems or PCB designs.

Width: 8.9662 mm

The narrow width of the PLD contributes to space-saving design considerations and enables denser packing of components on a circuit board.

No. of Outputs: 8

Having multiple outputs allows for the PLD to drive multiple external devices or logic functions, increasing the overall functionality of the system.

Length: 8.9662 mm

The compact length of the PLD enables easy integration into circuit designs with minimal space requirements.

No. of I/O Lines: 8

The input/output lines provide bidirectional communication capabilities, allowing the PLD to interact with external devices or systems efficiently.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures that this PLD can operate reliably in a wide range of temperature conditions typically encountered in commercial applications.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAD18N8-6CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 8 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

18

No. of Product Terms:

8

No. of Dedicated Inputs:

10

No. of I/O Lines:

8

Propagation Delay:

6 ns

Technology:

TTL

Architecture:

PAD-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Width:

8.9662 mm

Length:

8.9662 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J20

Qualified:

No

Trade Compliance

TIBPAD18N8-6CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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