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TIBPAL16L8-12MJ

Texas Instruments

TIBPAL16L8-12MJ by Texas Instruments

TIBPAL16L8-12MJ by Texas Instruments is a TTL technology PAL-type PLD with 14ns propagation delay, 5.5V max supply voltage, and 64 product terms. Ideal for military applications, it features 10 dedicated inputs, 6 I/O lines, and operates b/w -55°C to 125°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,479 parts In-Stock

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Digiode

USA . 4,990 parts In-Stock

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4,990

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Distributors (Availability)

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AZTECH Wire

Italy . 447 parts In-Stock

1+ parts

$10.553

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447

$10.553

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One Stop Electronics

USA . 327 parts In-Stock

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$34.000

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327

$34.000

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Parana Technologies

USA . 729 parts In-Stock

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$151.299

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729

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DigiPath Technology Company

USA . 1,806 parts In-Stock

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$166.599

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$153.271

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1,806

$166.599

$153.271

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ChromeModa Solutions

Germany . 5,921 parts In-Stock

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$169.999

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$139.399

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5,921

$169.999

$139.399

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IDEA Electronic Components Group

UK . 153 parts In-Stock

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$169.999

100+ parts

$161.499

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$152.999

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153

$169.999

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$152.999

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Corphita

USA . 1,557 parts In-Stock

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1,557

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Overview

Unleash the power of cutting-edge technology with the TIBPAL16L8-12MJ by Texas Instruments. Crafted with precision and expertise, this programmable logic device offers unparalleled performance and reliability in various applications. From aerospace to industrial automation, the TIBPAL16L8-12MJ provides a seamless solution for complex digital designs. Elevate your projects with the superior quality and innovative design of Texas Instruments, and experience the value and efficiency that only top-tier technology can deliver. Upgrade to the TIBPAL16L8-12MJ today and witness the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and reliability to the product, ensuring it can withstand harsh conditions.

Propagation Delay: 14 ns

Low propagation delay allows for fast and efficient processing of signals, making this product suitable for time-sensitive applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle higher power requirements and voltages, making it versatile for various systems.

Technology Used: TTL

TTL technology is known for its high-speed operation and reliability, making this product ideal for applications requiring quick response times.

No. of Inputs: 16

With 16 inputs, this product offers flexibility in accepting multiple input signals, allowing for complex logic operations.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact design, saving space in circuit layouts and enabling efficient integration into systems.

Architecture: PAL-TYPE

PAL-type architecture offers programmability and versatility, allowing users to customize logic functions to suit specific application requirements.

Output Function: COMBINATORIAL

Combinatorial output function provides the ability to create complex logic operations without the need for sequential processing, simplifying circuit design.

Maximum Clock Frequency: 48 MHz

High maximum clock frequency enables rapid data processing and execution, making this product suitable for high-performance applications.

Grading Of Temperature: MILITARY

Designed to meet military-grade temperature standards, ensuring reliability and performance in extreme environmental conditions.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-12MJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

48 MHz

Propagation Delay:

14 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.195 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Trade Compliance

TIBPAL16L8-12MJ Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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