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TIBPAL16L8-25CFN

Texas Instruments

TIBPAL16L8-25CFN by Texas Instruments

TIBPAL16L8-25CFN by Texas Instruments is a TTL technology PAL-type PLD with 16 inputs, 8 outputs, and 64 product terms. It operates at a max clock frequency of 30 MHz with a propagation delay of 25 ns. Ideal for applications requiring combinatorial output functions in commercial extended temperature environments.

Median Price

$1.438

Lifecycle Status

Suppliers In-Stock

27

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1k+

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Rochester

USA . 36,470 parts In-Stock

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$1.390

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DigiKey

USA . 36,470 parts In-Stock

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Verical

USA . 36,470 parts In-Stock

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$1.438

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$1.288

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$1.288

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

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Component Electronics Inc.

Canada . 438 parts In-Stock

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American Microsemiconductor Inc.

USA . 184 parts In-Stock

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Vyrian

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Electronic Expediters

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Q Components

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Atlantic Semiconductor

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Prism Electronics

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PC Components Company LLC

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Maverick Electronics, Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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LWI Electronics Inc

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Inland Empire Components Inc.

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Electronics Depot

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Florida Circuit

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Lantek

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ACDS - Activité Composants Distribution Service

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Classic Components Corporation

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Flex Direct, LLC

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Bristol Electronics

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J & M Industries LLC

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Elcom Components

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Distributors (Availability)

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Ampacity Inc.

Singapore . 36,858 parts In-Stock

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$0.970

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Continental Prestige Electronics

USA . 4,991 parts In-Stock

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Argo Parts USA

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Netroflash

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Corphita

USA . 3,917 parts In-Stock

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Parana Technologies

USA . 1,711 parts In-Stock

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$124.822

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$11,591.580

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$112.339

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DigiPath Technology Company

USA . 400 parts In-Stock

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$137.444

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$126.448

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IDEA Electronic Components Group

UK . 2,316 parts In-Stock

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$140.249

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$133.237

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$126.224

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ChromeModa Solutions

Germany . 218 parts In-Stock

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A-Z Elektronik GmbH

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Perfect Parts

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Microchip USA

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ChipstoGo Electronic ltd

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GreenTree Electronics

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Glotronic Ltd.

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Overview

Discover the TIBPAL16L8-25CFN by Texas Instruments, a high-quality Programmable Logic Device that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this PLD is perfect for a wide range of applications. With fast propagation delays and versatile output functions, this chip provides exceptional value and benefits to customers looking for efficient and dependable programmable logic solutions. Upgrade your projects with the TIBPAL16L8-25CFN and experience the advantages of cutting-edge technology in a compact package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environments.

Propagation Delay: 25 ns

Fast propagation delay allows for quick signal processing, improving overall performance.

Surface Mount: YES

Easy to integrate into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

Handles higher supply voltages, increasing the flexibility of the product.

Technology Used: TTL

Utilizes TTL technology known for its reliability and compatibility with a wide range of systems.

No. of Inputs: 16

Offers a high number of inputs for versatility in designing complex logic circuits.

Package Shape: SQUARE

Space-efficient design that can easily fit into compact electronic devices.

Architecture: PAL-TYPE

Utilizes PAL-type architecture which is known for its flexibility and reconfigurability.

Nominal Supply Voltage (V): 5

Operates at a standard voltage level, ensuring compatibility with most power sources.

No. of Terminals: 20

A sufficient number of terminals for connecting to other components in a circuit.

Programmable IC Type: OT PLD

Offers programmable logic functions, allowing for customization based on specific requirements.

Output Function: COMBINATORIAL

Capable of generating all possible output combinations, providing flexibility in logic operations.

No. of Product Terms: 64

Higher number of product terms offer more logic flexibility and functionality.

Maximum Operating Temperature: 75 °C

Can operate in relatively high-temperature environments without performance degradation.

No. of Outputs: 8

Multiple output options for diverse logic signal requirements.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-25CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

30 MHz

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Width:

8.965 mm

Length:

8.965 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e4

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

TIBPAL16L8-25CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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