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TIBPAL16L8-10MJ

Texas Instruments

TIBPAL16L8-10MJ by Texas Instruments

TIBPAL16L8-10MJ by Texas Instruments is a TTL technology-based PAL-type PLD with 12ns propagation delay and 5.5V max supply voltage. It features 16 inputs, 64 product terms, and supports up to 52.5MHz clock frequency. Ideal for military applications requiring combinatorial output functions in a ceramic package with through-hole terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,950 parts In-Stock

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Vyrian

USA . 3,092 parts In-Stock

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3,092

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Distributors (Availability)

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AZTECH Wire

Italy . 759 parts In-Stock

1+ parts

$6.018

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759

$6.018

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One Stop Electronics

USA . 649 parts In-Stock

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$29.000

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649

$29.000

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Parana Technologies

USA . 1,612 parts In-Stock

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$50.414

100+ parts

$4,681.709

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$45.373

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1,612

$50.414

$4,681.709

$45.373

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DigiPath Technology Company

USA . 1,084 parts In-Stock

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$55.512

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1,084

$55.512

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ChromeModa Solutions

Germany . 5,505 parts In-Stock

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$56.645

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$46.449

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5,505

$56.645

$46.449

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IDEA Electronic Components Group

UK . 641 parts In-Stock

1+ parts

$56.645

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$53.813

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$50.980

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641

$56.645

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Corphita

USA . 4,027 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the TIBPAL16L8-10MJ Programmable Logic Device. Ideal for a wide range of applications, this PAL-type device offers a seamless combination of performance and efficiency. With 64 product terms and a maximum clock frequency of 52.5 MHz, this PLD delivers unmatched value and flexibility. Trust in Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the TIBPAL16L8-10MJ today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Propagation Delay: 12 ns

Low propagation delay allows for fast signal processing and response times, suitable for time-critical applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in powering the device and compatibility with a range of systems.

Technology Used: TTL

TTL technology offers high-speed operation and low power consumption, making the device efficient and reliable.

No. of Inputs: 16

Having a high number of inputs provides versatility in accepting multiple input signals for processing.

Output Function: COMBINATORIAL

The combinational output function allows for logical expressions to be implemented, expanding the device's functionality.

Maximum Clock Frequency: 52.5 MHz

With a high clock frequency, the device can handle complex operations and processing tasks efficiently.

No. of Outputs: 8

Having multiple outputs enables the device to drive multiple components or signals simultaneously.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-10MJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

52.5 MHz

Propagation Delay:

12 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.195 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T20

Qualified:

No

Trade Compliance

TIBPAL16L8-10MJ Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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