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5M570ZF256C5N

Intel

5M570ZF256C5N by Intel

The Intel 5M570ZF256C5N is a FLASH PLD with 440 macro cells, 159 I/O lines, and a max clock frequency of 118.3 MHz. It is used in applications requiring programmable logic devices with low profile grid array package style for surface mount technology. The device offers fast propagation delay of 17.7 ns and operates at temperatures ranging from 0 to 85°C.

Median Price

$16.390

Lifecycle Status

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Arrow

USA . 90 parts In-Stock

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DigiKey

USA . 127 parts In-Stock

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Mouser Electronics

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Verical

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Digiode

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Nova Conductors

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Cyclops Electronics Ltd

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Vyrian

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Touchstone Systems

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ComSIT Distribution GmbH

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EZ Electronic Parts

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 473 parts In-Stock

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Semicontronic

India . 77 parts In-Stock

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Ampacity Inc.

Singapore . 58 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Andel Nordic

Denmark . 207 parts In-Stock

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Modulus Dynamics

Lithuania . 1,578 parts In-Stock

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Microchip USA

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MARBEL Systems

Belgium . 600 parts In-Stock

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Texas Native Microelectronics

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Corohmni

South Africa . 162 parts In-Stock

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Kenton Components

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Advanced Electronics

New Zealand . 3,971 parts In-Stock

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Qasali Group International

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Authorized Procurement Solutions

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Argo Parts USA

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GreenTree Electronics

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Glotronic Ltd.

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Supply Digital

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Perfect Parts

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Futuretech Components

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Lucentia Tech

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Overview

Elevate your projects to the next level with the Intel 5M570ZF256C5N Programmable Logic Device. Manufactured by industry leader Intel, this PLD offers unparalleled quality and reliability for a wide range of applications. With its cutting-edge technology and innovative design, this flash PLD provides customers with a versatile solution that delivers exceptional performance. Say goodbye to limitations and hello to endless possibilities with the Intel 5M570ZF256C5N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and durable, making it suitable for various applications.

Propagation Delay: 17.7 ns

The low propagation delay ensures fast response times and high-speed performance in data processing.

Surface Mount: YES

Being surface mountable makes the device easy to integrate onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.89 V

The low maximum supply voltage helps in reducing power consumption and extends the operational lifespan of the device.

No. of Macro Cells: 440

Having 440 macro cells allows for complex logic designs and programmability, making it versatile for a wide range of applications.

Technology Used: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Package Shape: SQUARE

The square package shape provides uniformity and ease of handling during assembly processes.

Form Of Terminal: BALL

The use of ball terminals enables reliable connections and facilitates efficient heat dissipation during operation.

Nominal Supply Voltage (V): 1.8

A stable nominal supply voltage of 1.8V ensures consistent performance and reliability of the device.

Power Supplies (V): 1.8,1.2/3.3

Support for multiple power supply voltages (1.8V, 1.2V, and 3.3V) allows for flexible integration into different systems.

No. of Terminals: 256

Having 256 terminals provides ample I/O options for connectivity and interfacing with external devices.

Programmable IC Type: FLASH PLD

The FLASH PLD type enables in-system programmability, allowing users to reconfigure the logic functions as needed.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low-profile package style offer high density mounting capabilities and efficient use of space on PCBs.

In-System Programmable: YES

Support for in-system programmability enables easy updates and modifications to the device's logic functions without requiring physical reprogramming.

Output Function: MACROCELL

The macrocell output function allows for custom logic designs and sequential operations, enhancing the device's versatility.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures reliable operation even under low-power conditions, improving the device's robustness.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures reliable performance in demanding environmental conditions.

Pitch Of Terminal: 1 mm

The 1mm terminal pitch offers compatibility with standard PCB layouts and facilitates easy soldering during assembly.

Organization: 159 I/O

Having 159 I/O options provides extensive connectivity for interfacing with external devices and peripherals.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the device can function in a wide range of temperature environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper finishing on terminals offers excellent conductivity and corrosion resistance for long-term reliability.

Position Of Terminal: BOTTOM

The bottom terminal position facilitates easy mounting on PCBs and ensures secure connections for stable operation.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the device's resistance to moisture absorption, enhancing its reliability in humid conditions.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55mm enables compact designs and efficient use of space in electronic systems.

Width: 17 mm

The 17mm width provides a compact form factor for easy integration into various electronic devices and systems.

Maximum Clock Frequency: 118.3 MHz

Support for a high maximum clock frequency of 118.3MHz enables fast data processing and real-time operation in high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C offers reliable solder joints and ensures the integrity of connections during assembly.

Length: 17 mm

The 17mm length provides a compact footprint for space-constrained applications and ensures easy integration into electronic systems.

JTAG Boundary Scan Test: YES

Support for JTAG boundary scan testing enables efficient debugging and testing of the device's functionality, ensuring quality control.

No. of I/O Lines: 159

Having 159 I/O lines provides extensive connectivity options for interfacing with external devices and peripherals, enhancing the device's versatility.

Technical Specifications

Programmable Logic Devices (PLD) 5M570ZF256C5N attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

159 I/O

Output Function:

Macrocell

No. of Macro Cells:

440

No. of I/O Lines:

159

Maximum Clock Frequency:

118.3 MHz

Propagation Delay:

17.7 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

1.89 V

Power Supplies (V):

1.8,1.2/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array, Low Profile

Package Code:

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Width:

17 mm

Length:

17 mm

Maximum Seated Height:

1.55 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

1 mm

Terminal Finish:

Tin/Silver/Copper

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

5M570ZF256C5N Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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