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Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.

Heat Sinks

Available Parts 307

Part RoHS Manufacturer Description Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)
258 by Wakefield Thermal Solutions

258

Wakefield Thermal Solutions

HEAT SINK; Profile: U; Body Material: ALUMINUM; Length: 12.7 mm; Width: 6.4 mm; Color: BLACK;

HEAT SINK

U

ALUMINUM

8.6 mm

6.4 mm

ANODIZED

BLACK

.82 g

12.7 mm

HS201DR by Crydom

HS201DR

Crydom

HEAT SINK; Profile: SCREW; Body Material: ALUMINUM ALLOY; Device Used On: RELAY; Fin Orientation: LONGITUDINAL; Height: 80 mm;

HEAT SINK

SCREW

ALUMINUM ALLOY

RELAY

LONGITUDINAL

2 ohm

80 mm

45 mm

353 g

81 mm

573300D00010G by Boyd

573300D00010G

Boyd

HEAT SINK; Profile: U; Construction: EXTRUDED; Height: 10.16 mm; Width: 12.7 mm; Packing Method: TR,13 INCH;

HEAT SINK

U

EXTRUDED

10.16 mm

12.7 mm

SN/NI

GRAY

TR,13 INCH

26.16 mm

DA-T263-101E-TR by Ohmite Manufacturing

DA-T263-101E-TR

Ohmite Manufacturing

HEAT SINK; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: EXTRUDED; Packing Method: TR, 13 INCH; Color: BLACK;

HEAT SINK

ALUMINUM

TRANSISTOR

EXTRUDED

10.16 mm

12.7 mm

ANODIZED

BLACK

TR, 13 INCH

3.8 g

25.91 mm

FK24413D2PAK by Fischer Elektronik & Kg

FK24413D2PAK

Fischer Elektronik & Kg

HEAT SINK; Body Material: COPPER; Device Used On: IC; Width: 13 mm; Length: 26 mm; Packing Method: BULK;

HEAT SINK

COPPER

IC

10 mm

13 mm

BULK

3.6 g

26 mm

576802B04000G by Boyd

576802B04000G

Boyd

HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: CLIP; Length: 14.48 mm;

HEAT SINK

U

ALUMINUM

TRANSISTOR

CLIP

27.3 ohm

19.05 mm

12.7 mm

ANODIZED

BLACK

14.48 mm

FK220SA220 by Fischer Elektronik & Kg

FK220SA220

Fischer Elektronik & Kg

HEAT SINK; Body Material: ALUMINUM ALLOY; Device Used On: TRANSISTOR; Fin Orientation: TRANSVERSE; Color: BLACK; Height: 20.5 mm;

HEAT SINK

ALUMINUM ALLOY

TRANSISTOR

TRANSVERSE

25 ohm

20.5 mm

7 mm

ANODIZED

BLACK

25 mm

HS202DR by Crydom

HS202DR

Crydom

HEAT SINK;

HEAT SINK

ICKBGA35X35 by Fischer Elektronik & Kg

ICKBGA35X35

Fischer Elektronik & Kg

HEAT SINK; Device Used On: IC; Construction: FIN; Length: 35 mm; Height: 6 mm; Width: 35 mm;

HEAT SINK

IC

FIN

6 mm

35 mm

BLACK ANODIZED

35 mm

FK24413D2PAKTR by Fischer Elektronik & Kg

FK24413D2PAKTR

Fischer Elektronik & Kg

HEAT SINK; Body Material: COPPER; Device Used On: IC; Packing Method: TAPE AND REEL; Weight: 3.6 g; Length: 26 mm;

HEAT SINK

COPPER

IC

10 mm

13 mm

TAPE AND REEL

3.6 g

26 mm

507302B00000G by Boyd

507302B00000G

Boyd

HEAT SINK; Profile: SCREW; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: TRANSVERSE;

HEAT SINK

SCREW

ALUMINUM

TRANSISTOR

FIN

TRANSVERSE

24 ohm

9.65 mm

19.05 mm

ANODIZED

BLACK

LOW PROFILE

19.05 mm

576802B00000G by Boyd

576802B00000G

Boyd

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: CLIP; Fin Orientation: TRANSVERSE; Width: 12.7 mm;

HEAT SINK

U

ALUMINUM

CLIP

TRANSVERSE

27.3 ohm

19.05 mm

12.7 mm

ANODIZED

BLACK

14.48 mm

FK24408D2PAK by Fischer Elektronik & Kg

FK24408D2PAK

Fischer Elektronik & Kg

HEAT SINK; Body Material: COPPER; Device Used On: IC; Height: 10 mm; Packing Method: BULK; Weight: 2.2 g;

HEAT SINK

COPPER

IC

10 mm

8 mm

BULK

2.2 g

26 mm

V6534E1-T by Assmann Wsw Components

V6534E1-T

Assmann Wsw Components

Heat Sinks;

WA-T247-101E by Ohmite Manufacturing

WA-T247-101E

Ohmite Manufacturing

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM ALLOY; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL;

HEAT SINK

CLIP

ALUMINUM ALLOY

TRANSISTOR

EXTRUDED

LONGITUDINAL

11 ohm

30.5 mm

16 mm

ANODIZED

BLACK

BULK

12 g

23.1 mm

FK24413D3PAK by Fischer Elektronik & Kg

FK24413D3PAK

Fischer Elektronik & Kg

HEAT SINK; Body Material: COPPER; Device Used On: IC; Length: 13 mm; Width: 31 mm; Height: 10 mm;

HEAT SINK

COPPER

IC

10 mm

31 mm

TIN LEAD

3.9 g

13 mm

FK224MI2201 by Fischer Elektronik & Kg

FK224MI2201

Fischer Elektronik & Kg

HEAT SINK; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Thermal Resistance: 18 ohm; Width: 25 mm; Length: 29.4 mm;

HEAT SINK

ALUMINUM

TRANSISTOR

18 ohm

8.3 mm

25 mm

29.4 mm

FK237SA220V by Fischer Elektronik & Kg

FK237SA220V

Fischer Elektronik & Kg

HEAT SINK; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Height: 12.7 mm; Finish: ANODIZED; Length: 19.05 mm;

HEAT SINK

ALUMINUM

TRANSISTOR

12.7 mm

14.5 mm

ANODIZED

BLACK

19.05 mm

7109DG/TR by Boyd

7109DG/TR

Boyd

HEAT SINK; Body Material: COPPER; Device Used On: IC; Fin Orientation: FOLDEDBACK; Width: 19.38 mm; Height: 11.43 mm;

HEAT SINK

COPPER

IC

FOLDEDBACK

11 ohm

11.43 mm

19.38 mm

TIN

TAPE AND REEL

25.4 mm

7109DG by Boyd

7109DG

Boyd

HEAT SINK; Body Material: COPPER; Device Used On: IC; Fin Orientation: FOLDEDBACK; Finish: TIN; Height: 19.38 mm;

HEAT SINK

COPPER

IC

FOLDEDBACK

11 ohm

19.38 mm

11.43 mm

TIN

25.4 mm

581002B02500G by Boyd

581002B02500G

Boyd

HEAT SINK; Body Material: ALUMINUM; Device Used On: IC; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Finish: ANODIZED;

HEAT SINK

ALUMINUM

IC

EXTRUDED

LONGITUDINAL

17.4 ohm

25.4 mm

16.26 mm

ANODIZED

BLACK

16.26 mm

FK237SA220H by Fischer Elektronik & Kg

FK237SA220H

Fischer Elektronik & Kg

HEAT SINK; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: FIN; Color: BLACK; Length: 19.05 mm;

HEAT SINK

ALUMINUM

TRANSISTOR

FIN

12.7 mm

14.5 mm

ANODIZED

BLACK

19.05 mm

RA-T2X-51E by Ohmite Manufacturing

RA-T2X-51E

Ohmite Manufacturing

HEAT SINK; Body Material: ALUMINUM; Fin Orientation: OMNIDIRECT; Finish: ANODIZED; Weight: 51 g; Color: BLACK;

HEAT SINK

ALUMINUM

OMNIDIRECT

50.8 mm

25 mm

ANODIZED

BLACK

51 g

42 mm

FK24413DPAKTR by Fischer Elektronik & Kg

FK24413DPAKTR

Fischer Elektronik & Kg

HEAT SINK; Body Material: COPPER; Device Used On: IC; Width: 13 mm; Packing Method: TAPE AND REEL; Weight: 3.3 g;

HEAT SINK

COPPER

IC

10 mm

13 mm

TAPE AND REEL

3.3 g

23 mm

WF210000 by Celduc Relais

WF210000

Celduc Relais

HEAT SINK;

HEAT SINK

ICKPGA6X6X14 by Fischer Elektronik & Kg

ICKPGA6X6X14

Fischer Elektronik & Kg

HEAT SINK; Profile: ADHESIVE; Device Used On: IC; Fin Orientation: OMNIDIRECT; Finish: ANODIZED; Thermal Resistance: 20 ohm;

HEAT SINK

ADHESIVE

IC

OMNIDIRECT

20 ohm

14 mm

14 mm

ANODIZED

BLACK

14 mm

576802B03100G by Boyd

576802B03100G

Boyd

HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Thermal Resistance: 27.3 ohm; Finish: ANODIZED; Height: 12.7 mm;

HEAT SINK

ALUMINUM

CLIP

27.3 ohm

12.7 mm

14.48 mm

ANODIZED

BLACK

19.05 mm

WF151200 by Celduc Relais

WF151200

Celduc Relais

HEAT SINK;

HEAT SINK

HS151DR by Crydom

HS151DR

Crydom

HEAT SINK;

HEAT SINK

RA-T2X-25E by Ohmite Manufacturing

RA-T2X-25E

Ohmite Manufacturing

HEAT SINK; Body Material: ALUMINUM; Fin Orientation: OMNIDIRECT; Height: 25.4 mm; Finish: ANODIZED; Length: 42 mm;

HEAT SINK

ALUMINUM

OMNIDIRECT

25.4 mm

25 mm

ANODIZED

BLACK

25 g

42 mm

680-5A by Wakefield-vette

680-5A

Wakefield-vette

HEAT SINK; Body Material: ALUMINUM; Fin Orientation: OMNIDIRECT; Height: 12.7 mm; Width: 46 mm; Length: 46 mm;

HEAT SINK

ALUMINUM

OMNIDIRECT

12.7 mm

46 mm

ANODIZED

BLACK

31.75 g

46 mm

7106DG/TR by Boyd

7106DG/TR

Boyd

HEAT SINK; Profile: SOLDER; Body Material: COPPER; Device Used On: IC; Height: 9.52 mm; Packing Method: TR;

HEAT SINK

SOLDER

COPPER

IC

15 ohm

9.52 mm

14.99 mm

TIN

TR

25.91 mm

V-1100-SMD/AL by Assmann Wsw Components

V-1100-SMD/AL

Assmann Wsw Components

Heat Sinks;

530613B00000G by Boyd

530613B00000G

Boyd

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Height: 29.97 mm;

HEAT SINK

U

ALUMINUM

FIN

TRANSVERSE

16.7 ohm

29.97 mm

12.7 mm

ANODIZED

BLACK

25.4 mm

274-1AB by Ohmite Manufacturing

274-1AB

Ohmite Manufacturing

HEAT SINK; Body Material: ALUMINUM; Length: 19.1 mm; Width: 13.2 mm; Finish: ANODIZED; Height: 9.5 mm;

HEAT SINK

ALUMINUM

9.5 mm

13.2 mm

ANODIZED

BLACK

19.1 mm

WA-T220-101E by Ohmite Manufacturing

WA-T220-101E

Ohmite Manufacturing

HEAT SINK;

HEAT SINK

531002B00000G by Boyd

531002B00000G

Boyd

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Length: 34.9 mm; Finish: ANODIZED;

HEAT SINK

ALUMINUM

EXTRUDED

RADIAL

13.4 ohm

25.4 mm

12.7 mm

ANODIZED

BLACK

34.9 mm

1542618-2 by TE Connectivity

1542618-2

TE Connectivity

HEAT SINK; Profile: CLIP; Body Material: COLD-FORGED ALUMINUM,ALUMINUM; Device Used On: TRANSCEIVER; Fin Orientation: PIN FIN; Finish: NICKEL;

HEAT SINK

CLIP

COLD-FORGED ALUMINUM,ALUMINUM

TRANSCEIVER

PIN FIN

CSA, UL

6.5 mm

18 mm

NICKEL

57.25 mm

15 W

574502B03300G by Boyd

574502B03300G

Boyd

HEAT SINK; Body Material: ALUMINUM; Construction: SLIDE ON; Fin Orientation: FOLDEDBACK; Finish: ANODIZED; Length: 20.57 mm;

HEAT SINK

ALUMINUM

SLIDE ON

FOLDEDBACK

21.2 ohm

19.05 mm

9.9 mm

ANODIZED

BLACK

20.57 mm

423K by Wakefield-vette

423K

Wakefield-vette

HEAT SINK; Construction: EXTRUDED; Width: 120.7 mm; Height: 66.7 mm; Length: 140.2 mm; Weight: 530.71 g;

HEAT SINK

EXTRUDED

66.7 mm

120.7 mm

530.71 g

140.2 mm

637-15ABEP by Ohmite Manufacturing

637-15ABEP

Ohmite Manufacturing

HEAT SINK; Body Material: ALUMINUM; Construction: FLARED; Fin Orientation: RADIAL; Finish: ANODIZED; Height: 38.1 mm;

HEAT SINK

ALUMINUM

FLARED

RADIAL

38.1 mm

12.7 mm

ANODIZED

BLACK

15.88 g

34.9 mm

RA-T2X-38E by Ohmite Manufacturing

RA-T2X-38E

Ohmite Manufacturing

HEAT SINK; Body Material: ALUMINUM; Fin Orientation: OMNIDIRECT; Width: 25 mm; Color: BLACK; Weight: 38 g;

HEAT SINK

ALUMINUM

OMNIDIRECT

38.1 mm

25 mm

ANODIZED

BLACK

38 g

42 mm

374324B00035G by Boyd

374324B00035G

Boyd

HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Height: 10 mm;

HEAT SINK

PIN FIN ARRAY

ALUMINUM

FIN

OMNIDIRECT

10 mm

27 mm

ANODIZED

BLACK

27 mm

908-35-2-23-2-B-0 by Wakefield Thermal Solutions

908-35-2-23-2-B-0

Wakefield Thermal Solutions

HEAT SINK; Profile: CLIP; Body Material: ALUMINIUM ALLOY; Device Used On: IC; Construction: EXTRUDED; Fin Orientation: PIN FIN;

HEAT SINK

CLIP

ALUMINIUM ALLOY

IC

EXTRUDED

PIN FIN

10.03 ohm

12 mm

35 mm

BLACK ANODIZED

35 mm

7G0011A by TDK

7G0011A

TDK

HEAT SINK; Device Used On: CONVERTER; Construction: FIN PIN; Fin Orientation: OMNIDIRECT; Weight: 14.6 g; Height: 5.7 mm;

HEAT SINK

CONVERTER

FIN PIN

OMNIDIRECT

8.24 ohm

5.7 mm

37.4 mm

14.6 g

50 mm

7106DG by Boyd

7106DG

Boyd

HEAT SINK; Body Material: COPPER; Device Used On: TRANSISTOR; Thermal Resistance: 15 ohm; Width: 14.99 mm; Height: 9.52 mm;

HEAT SINK

COPPER

TRANSISTOR

15 ohm

9.52 mm

14.99 mm

TIN

25.91 mm

647-10ABEP by Wakefield-vette

647-10ABEP

Wakefield-vette

HEAT SINK; Construction: EXTRUDED; Weight: 24.95 g; Length: 41.9 mm; Width: 25.4 mm; Height: 25.4 mm;

HEAT SINK

EXTRUDED

25.4 mm

25.4 mm

24.95 g

41.9 mm

FK24408D3PAK by Fischer Elektronik & Kg

FK24408D3PAK

Fischer Elektronik & Kg

HEAT SINK; Body Material: COPPER; Device Used On: IC; Length: 31 mm; Width: 8 mm; Packing Method: BULK;

HEAT SINK

COPPER

IC

10 mm

8 mm

BULK

2.5 g

31 mm