Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Ohmite FA-T220-38E Heat Sink, 38.1mm H, 25mm W, 41.6mm L, ALUM Body, ANOD Finish. Weighs 27g with OMNIDIR fins. Ideal for cooling electronic components in various applications.
Median Price
$3.354
Lifecycle Status
Suppliers In-Stock
11
In-Stock Inventory
1k+
Farnell
1+ parts
$2.030
100+ parts
$1.600
1k+ parts
-
10k+ parts
RS Americas
$2.590
$2.070
Verical
$3.338
$2.574
$2.268
$2.200
DigiKey
$3.370
$2.636
$2.350
$2.300
Chip1Stop
$3.590
$2.800
$2.310
$2.050
Element14
$175.370
$156.370
Distrelec
Nova Conductors
TME
$3.740
$3.150
$3.040
Electro Sonic
$2.210
$2.020
$1.730
Vyrian
Ampacity Inc.
$1.310
Semicontronic
$1.277
$1.271
Component Stockers USA
$1.690
$1.890
Continental Prestige Electronics
$1.776
$1.740
Argo Parts USA
Netroflash
$2.156
Allen Electronics Distributors
$2.440
AZTECH Wire
$13.540
Perfect Parts
Corohmni
Aztec Data Supply Inc.
Advanced Electronics
Having a dedicated heat sink ensures efficient heat dissipation, keeping the components cool and functioning optimally.
The moderate height allows for effective heat transfer while maintaining a compact size for easy installation in various devices.
The anodized finish provides a durable and corrosion-resistant coating, enhancing the longevity and performance of the heat sink.
The narrow width allows for versatile placement options in tight spaces, making it suitable for a wide range of electronic equipment.
The sleek black color adds a professional aesthetic to the heat sink and blends well with different device designs.
The lightweight design makes the heat sink easy to handle and reduces additional strain on the device it is installed in.
The omnidirectional fin orientation ensures efficient heat dissipation from all sides, providing uniform cooling for improved thermal management.
Aluminum's excellent thermal conductivity helps in efficient heat transfer, making it an ideal material choice for heat sinks to effectively dissipate heat.
The optimal length provides sufficient surface area for heat dissipation, enhancing the overall cooling performance of the heat sink.
Heat Sinks FA-T220-38E attributes and parameters. Explore more Heat Sinks devices from Ohmite Manufacturing
Fin Orientation:
Height:
Width:
Length:
Weight:
Finish:
Body Material Composition:
Color:
Device Type:
PCN Design/Specification - FA-T220-38E Dimensional 09/Oct/2012
measuring instruments.
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
C0603X104K5RACAUTO
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
SS14
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Micropac Industries
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
DS18B20U
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
WV-T220-101E
Ohmite Manufacturing
HEAT SINK;
SV-LED-125E
518-95AB
WAKEFIELD-VETTE INC
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Finish: ANODIZED; Height: 24.1 mm; Width: 57.9 mm;
530613B00000G
Boyd
Boyd 530613B00000G Heat Sink has Thermal Resistance of 16.7 ohm, U Profile, and Aluminum Body Material. Ideal for cooling electronic components in compact spaces with its dimensions of 25.4mm x 12.7mm x 29.97mm.
ATSEU-077D-C2-R0
Advanced Thermal Solutions
ICKBGA14X14
Fischer Elektronik & Kg
ICKBGA14X14 by Fischer Elektronik & Kg is a 6mm tall, black anodized heat sink with fin construction. It measures 14mm in width and length, designed for IC devices. Ideal for dissipating heat efficiently in electronic applications.
SK10438,1STS
SK10438,1STS by Fischer Elektronik & Kg is a black anodized heat sink measuring 38.1mm in height, 12.7mm in width, and 34.9mm in length. Its extruded construction with staggered fin orientation makes it ideal for cooling electronic components efficiently in various applications.
320205B00000G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Diameter: 7.75 mm; Color: BLACK; Height: 6.35 mm;
3-1542003-4
TE Connectivity
TE Connectivity 3-1542003-4 Heat Sink, UL approved with 15W power rating. Aluminum body, radial fin orientation for IC devices. Clip profile for efficient heat dissipation in various applications.
421K
421K by Wakefield-vette is a Heat Sink measuring 66.7mm in height, 120.7mm in width, and 76.2mm in length. Constructed using extruded material, it weighs 285.77g making it ideal for thermal management applications in various electronic devices and systems.
DV-T263-201E
577002B00000G
Boyd 577002B00000G Heat Sink has Thermal Resistance of 32Ω, U Profile with Height 19.05mm, and Longitudinal Fin Orientation. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.
Y92B-N50
Omron
7106DG/TR
Boyd's 7106DG/TR heat sink has a thermal resistance of 15 ohm, made of copper with solder profile. It is 9.52mm high, 14.99mm wide, and 25.91mm long, finished with tin plating. Designed for ICs to efficiently dissipate heat in electronic devices.
7109DG
HEAT SINK; Body Material: COPPER; Device Used On: IC; Fin Orientation: FOLDEDBACK; Height: 19.38 mm; Thermal Resistance: 11 ohm;
DA-T263-101E-TR
DA-T263-101E-TR by Ohmite Manufacturing is a heat sink with dimensions of 10.16mm x 12.7mm x 25.91mm and a weight of 3.8g. It is made of anodized aluminum and is used on transistors for thermal management purposes.
1542618-2
TE Connectivity's 1542618-2 heat sink, with a height of 6.5mm and width of 18mm, is approved by CSA and UL for up to 15W power rating. Made of cold-forged aluminum, it is ideal for use on transceivers due to its pin fin orientation and clip profile.
V4330N
Assmann Wsw Components
V4330N by Assmann Wsw Components is a 12mm tall black anodized aluminum heat sink with thermal resistance of 12 ohm. Ideal for applications requiring efficient heat dissipation, such as in electronic devices or computer components due to its longitudinal fin orientation and compact size of 20x29 mm.
637-15ABEP
HEAT SINK; Body Material: ALUMINUM; Construction: FLARED; Fin Orientation: RADIAL; Color: BLACK; Length: 34.9 mm;
PF433G
HEAT SINK; Body Material: ALUMINUM; Construction: CLIP; Height: 13 mm; Length: 19.5 mm; Finish: ANODIZED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
FA-T220-25E
HEAT SINK; Body Material: ALUMINUM; Fin Orientation: OMNIDIRECT; Color: BLACK; Finish: ANODIZED; Weight: 17.5 g;
FA-T220-51E
HEAT SINK; Body Material: ALUMINUM; Fin Orientation: OMNIDIRECT; Color: BLACK; Length: 41.6 mm; Height: 50.8 mm;
FA-T220-64E
HEAT SINK; Body Material: ALUMINUM; Fin Orientation: OMNIDIRECT; Height: 63.5 mm; Color: BLACK; Finish: ANODIZED;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved