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908-35-2-23-2-B-0

Wakefield Thermal Solutions

908-35-2-23-2-B-0 by Wakefield Thermal Solutions

Wakefield Thermal Solutions' 908-35-2-23-2-B-0 heat sink features a thermal resistance of 10.03 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device is 35mm wide, 12mm high, and used on ICs for effective heat dissipation in various electronic applications.

Median Price

$10.170

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 175 parts In-Stock

1+ parts

$10.170

100+ parts

$7.964

1k+ parts

$7.239

10k+ parts

$6.976

175

$10.170

$7.964

$7.239

$6.976

Mouser Electronics

USA . 64 parts In-Stock

1+ parts

$10.180

100+ parts

$8.160

1k+ parts

$7.320

10k+ parts

-

64

$10.180

$8.160

$7.320

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Verical

USA . 210 parts In-Stock

1+ parts

-

100+ parts

$9.518

1k+ parts

-

10k+ parts

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210

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$9.518

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$6.825

100+ parts

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10

$6.825

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Vyrian

USA . 8,774 parts In-Stock

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8,774

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Electro Sonic

Canada . 210 parts In-Stock

1+ parts

-

100+ parts

$7.620

1k+ parts

$6.870

10k+ parts

$6.460

210

-

$7.620

$6.870

$6.460

IBS Electronics

USA . 210 parts In-Stock

1+ parts

-

100+ parts

$10.517

1k+ parts

$9.620

10k+ parts

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210

-

$10.517

$9.620

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,045 parts In-Stock

1+ parts

$6.580

100+ parts

-

1k+ parts

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10k+ parts

$6.448

3,045

$6.580

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$6.448

Netroflash

USA . 50 parts In-Stock

1+ parts

$6.825

100+ parts

$6.688

1k+ parts

-

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50

$6.825

$6.688

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AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$13.963

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894

$13.963

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Neutron USA

USA . 50 parts In-Stock

1+ parts

$43.430

100+ parts

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50

$43.430

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Argo Parts USA

USA . 4,694 parts In-Stock

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4,694

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Overview

Wakefield Thermal Solutions presents the 908-35-2-23-2-B-0 Heat Sink, a premium product offering superior thermal resistance and efficient heat dissipation for IC devices. Manufactured by Wakefield Thermal Solutions, known for their high-quality and reliable products, this heat sink features a sleek black anodized finish and an extruded aluminum alloy construction with pin fin orientation. Ideal for a wide range of applications, this heat sink provides unmatched value, benefits, and advantages to customers seeking optimal thermal management solutions. Trust Wakefield Thermal Solutions for all your thermal needs.

Feature Benefit Bullets

Thermal Resistance: 10.03 ohm

Lower thermal resistance means better heat dissipation, making this heat sink efficient at cooling the device it is used on.

Thermal Device Type: HEAT SINK

Being specifically designed as a heat sink ensures that it is optimized for heat dissipation and thermal management.

Profile: CLIP

The clip profile allows for easy installation and removal of the heat sink, making it user-friendly and convenient.

Height: 12 mm

With a compact height, this heat sink can be used in space-constrained environments without compromising on cooling performance.

Finish: BLACK ANODIZED

The black anodized finish not only enhances the aesthetics of the heat sink but also improves its corrosion resistance and durability.

Width: 35 mm

The width of 35 mm provides sufficient surface area for heat dissipation, ensuring effective cooling of the device.

Construction: EXTRUDED

The extruded construction offers good strength and thermal conductivity, making this heat sink a reliable choice for cooling applications.

Fin Orientation: PIN FIN

The pin fin orientation maximizes the surface area for heat dissipation, improving the overall cooling efficiency of the heat sink.

Body Material: ALUMINIUM ALLOY

Aluminum alloy is lightweight, has good thermal conductivity, and is corrosion-resistant, making it an ideal material for heat sink construction.

Length: 35 mm

The length of 35 mm provides a balanced size for effective heat dissipation while still fitting within most device configurations.

Device Used On: IC

Designed for use on integrated circuits, this heat sink can efficiently cool electronic components, ensuring optimal performance and longevity.

Technical Specifications

Heat Sinks 908-35-2-23-2-B-0 attributes and parameters. Explore more Heat Sinks devices from Wakefield Thermal Solutions

Device Specifications

Construction:

Profile:

Fin Orientation:

Physical Specifications

Height:

0.472 in (12 mm)

Width:

1.378 in (35 mm)

Length:

1.378 in (35 mm)

Material and Finish

Finish:

Black Anodized

Body Material Composition:

Thermal Specifications

Thermal Resistance:

10.03 Ω

Usage and Compatibility

Device Type:

Compatible Device:

IC

Manufacturer Highlights

Wakefield Thermal Solutions

Wakefield Thermal has been in continuous operations since 1957, providing thermal solutions across multiple industries, from international Fortune 50 companies to small and medium sized businesses. Industries served include Power Conversion, Information Technology, Renewable Energy, Telecommunications, Transportation, Aerospace/Defense, LED Lighting, Factory Automation, Consumer, and Medical. The thermal solutions Wakefield Thermal manufactures comprise a wide array of products, including thermal extrusions, LED heat sinks, heat frames and pipes, fans, heat exchangers, coolant distribution units, liquid cold plates, etc., making Wakefield Thermal unique in its ability to deliver the increasingly complex thermal solutions required to meet the thermal engineering challenges of today's ever-higher electronics packaging densities.

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