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PF750G

Boyd

PF750G by Boyd

Boyd's PF750G Heat Sink features a Thermal Resistance of 20.3 ohm, Copper Body Material, and U Profile. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or industrial equipment.

Median Price

$5.400

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,176 parts In-Stock

1+ parts

$3.710

100+ parts

$2.840

1k+ parts

$2.550

10k+ parts

$2.500

4,176

$3.710

$2.840

$2.550

$2.500

DigiKey

USA . 1,787 parts In-Stock

1+ parts

$5.400

100+ parts

$4.229

1k+ parts

$3.882

10k+ parts

$3.605

1,787

$5.400

$4.229

$3.882

$3.605

Element14

Singapore . 10,245 parts In-Stock

1+ parts

$5.962

100+ parts

$5.228

1k+ parts

$4.123

10k+ parts

$3.738

10,245

$5.962

$5.228

$4.123

$3.738

Newark

USA . 6,147 parts In-Stock

1+ parts

$5.970

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6,147

$5.970

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Farnell

UK . 5,732 parts In-Stock

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$9.320

100+ parts

$5.420

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$9.320

$5.420

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Arrow

USA . 32,000 parts In-Stock

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$4.000

32,000

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$4.000

Future Electronics

Canada . 4,188 parts In-Stock

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$3.350

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$3.280

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4,188

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$3.350

$3.280

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Master Electronics

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$4.010

1k+ parts

$3.670

10k+ parts

$3.520

520

-

$4.010

$3.670

$3.520

Verical

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$9.898

1k+ parts

$8.712

10k+ parts

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520

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$9.898

$8.712

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Adafruit Industries

USA . 270 parts In-Stock

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270

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.859

100+ parts

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10

$4.859

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Vyrian

USA . 7,634 parts In-Stock

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7,634

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NAC Semi

USA . 4,000 parts In-Stock

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$6.330

4,000

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$6.330

Electro Sonic

Canada . 990 parts In-Stock

1+ parts

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100+ parts

$9.930

1k+ parts

$5.090

10k+ parts

$3.430

990

-

$9.930

$5.090

$3.430

IBS Electronics

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$5.133

1k+ parts

$4.754

10k+ parts

$4.572

520

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$5.133

$4.754

$4.572

Component Sense

UK . 183 parts In-Stock

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Greenchips

USA . 151 parts In-Stock

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Holdelec - ElecDif-Pro

France . 41 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

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Ashlea Components Ltd

UK . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.859

100+ parts

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2,000

$4.859

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Continental Prestige Electronics

USA . 2,100 parts In-Stock

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$8.840

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$8.840

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Perfect Parts

USA . 56,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Argo Parts USA

USA . 1,398 parts In-Stock

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Aztec Data Supply Inc.

USA . 278 parts In-Stock

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278

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Advanced Electronics

New Zealand . 270 parts In-Stock

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270

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Overview

Elevate your cooling game with the PF750G by Boyd. Crafted with precision and top-notch quality, this heat sink offers unmatched thermal resistance for efficient heat dissipation. Made by industry leader Boyd, known for their innovative designs and reliable products, the PF750G is a game-changer in the world of heat sinks. Perfect for a variety of applications, this sleek and durable product will keep your devices running smoothly and cool to the touch. Upgrade to the PF750G today and experience the difference in performance and reliability that only Boyd can deliver.

Feature Benefit Bullets

Thermal Resistance: 20.3 ohm

Low thermal resistance ensures efficient heat dissipation, making it ideal for cooling applications.

Thermal Device Type: HEAT SINK

Designed specifically for heat dissipation, ensuring optimal thermal management for electronic components.

Profile: U

U-shaped profile allows for better airflow and heat dissipation, improving overall cooling performance.

Height: 22 mm

Compact height ensures compatibility with tight spaces while still providing effective heat dissipation.

Finish: TIN

TIN finish improves corrosion resistance and longevity, making it a durable option for cooling solutions.

Width: 11 mm

Narrow width allows for easy installation in restricted spaces without compromising on cooling efficiency.

Body Material: COPPER

Copper material offers excellent thermal conductivity, ensuring effective heat transfer and cooling performance.

Length: 22 mm

Balanced length provides adequate surface area for heat dissipation, making it a reliable choice for cooling electronic devices.

Technical Specifications

Heat Sinks PF750G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Profile:

U

Physical Specifications

Height:

0.866 in (22 mm)

Width:

0.433 in (11 mm)

Length:

0.866 in (22 mm)

Material and Finish

Finish:

Tin

Body Material Composition:

Thermal Specifications

Thermal Resistance:

20.3 Ω

Usage and Compatibility

Device Type:

Trade Compliance

PF750G Thermal Devices trade compliance attributes, and parameters.

NSN

5999-01-633-2051, 5999016332051

NIIN

016332051

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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