Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SK6875SA by Fischer Elektronik & Kg is a 33x46x75mm heat sink with thermal resistance of 5.85Ω, ideal for transistors. Featuring anodized finish and extruded construction, it offers efficient heat dissipation in black color with longitudinal fin orientation.
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Low thermal resistance indicates efficient heat dissipation, ensuring proper cooling for the transistor.
The use of a heat sink ensures effective heat transfer away from the transistor, preventing overheating.
Screw profile allows for easy installation and secure attachment to the transistor, enhancing thermal conductivity.
Optimal height for heat sink, providing sufficient surface area for heat dissipation while fitting in compact spaces.
Anodized finish increases resistance to corrosion and wear, extending the lifespan of the heat sink.
A well-balanced width that allows for efficient cooling without occupying too much space in the electronic setup.
Extruded construction offers uniform thermal conductivity and structural integrity, enhancing the overall performance of the heat sink.
Black color is often used for heat sinks as it absorbs and dissipates heat efficiently, making it a suitable choice for thermal management.
Longitudinal fin orientation promotes better airflow and heat dissipation, maintaining the optimal operating temperature of the transistor.
A suitable length for the heat sink to effectively dissipate heat without adding excessive bulk to the electronic device.
Designed specifically for use with transistors, ensuring compatibility and efficient heat dissipation for enhanced performance.
Heat Sinks SK6875SA attributes and parameters. Explore more Heat Sinks devices from Fischer Elektronik & Kg
Construction:
Profile:
Fin Orientation:
Height:
Width:
Length:
Finish:
Color:
Thermal Resistance:
Device Type:
Compatible Device:
1N4148
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1552200253
Molex
WIRE AND CABLE;
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
Sangdest Microelectronics (Nanjing)
2N7002
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
Hy Electronic
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
SMBJ18CA
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
International Semiconductor
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
FK245MI247V
Fischer Elektronik & Kg
HEAT SINK;
ICKPGA17X17X12
274-1AB
WAKEFIELD-VETTE INC
HEAT SINK; Body Material: ALUMINUM; Color: BLACK; Height: 9.5 mm; Finish: ANODIZED; Width: 13.2 mm;
658-60AB
Ohmite Manufacturing
The Ohmite Manufacturing 658-60AB heat sink features a pin fin array profile with dimensions of 27.9mm x 27.9mm x 15.2mm and weighs 14.17g. It is anodized in black, constructed with omnidirectional fins, and commonly used for thermal management in electronic devices.
531102B00000G
Boyd
Boyd's 531102B00000G Heat Sink has a Thermal Resistance of 10.4 ohm, Height of 38.1mm, and Length of 34.92mm. Ideal for cooling electronic components in compact spaces with its extruded aluminum construction and radial fin orientation.
528-45AB
The Ohmite Manufacturing 528-45AB Heat Sink is an extruded aluminum device with dimensions of 61x57.9x11.4mm (LxWxH). It features an anodized black finish and is designed for thermal management in electronic applications. Ideal for dissipating heat efficiently while maintaining a compact form factor.
517-95AB-MS4
517-95AB-MS4 by Wakefield-vette is a black anodized aluminum heat sink measuring 24.1mm in height, 57.9mm in width, and 61mm in length. Ideal for cooling electronic components in various applications due to its extruded construction and efficient thermal dissipation capabilities.
WV-T220-101E
574602B03300G
Boyd's 574602B03300G heat sink has a thermal resistance of 21.6 ohm, U profile, and aluminum body material. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or LED lighting systems.
908-35-2-23-2-B-0
Wakefield Thermal Solutions
Wakefield Thermal Solutions' 908-35-2-23-2-B-0 heat sink features a thermal resistance of 10.03 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device is 35mm wide, 12mm high, and used on ICs for effective heat dissipation in various electronic applications.
374424B00035G
Aavid Thermalloy
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Width: 27 mm;
527-24AB-MS4
527-24AB-MS4 by Wakefield-vette is a black anodized aluminum heat sink measuring 61x57.9x6.1mm (LxWxH). It is extruded for efficient thermal dissipation, ideal for cooling electronic components in various applications.
DA-T263-201E-TR
ATS-61300K-C1-R0
Advanced Thermal Solutions
1829905-2
TE Connectivity
TE Connectivity 1829905-2 is a clip-type heat sink made of aluminum with pin fin orientation. It has a power rating of 15W and is used on transceivers for effective heat dissipation in electronic devices.
SK481000SA
SK481000SA by Fischer Elektronik & Kg is a 1000mm long, 20mm high black anodized heat sink with thermal resistance of 3.5 ohm. It is used on transistors for effective heat dissipation due to its extruded construction and longitudinal fin orientation.
7023BG
Boyd's 7023BG Heat Sink has a Thermal Resistance of 4.4 ohm, Height of 44.45mm, and Width of 24.13mm. Ideal for cooling electronic components in compact spaces due to its folded back fin orientation and aluminum body material.
507002B00000G
Boyd 507002B00000G Heat Sink features Thermal Resistance of 15.6 ohm, U Profile with Height 17.78mm, and Longitudinal Fin Orientation. Ideal for cooling applications in electronics due to its Aluminum construction and Anodized finish, measuring 44.45mm in Length and 9.52mm in Width.
573100D00000G
HEAT SINK; Body Material: COPPER; Height: 10.16 mm; Finish: TIN; Length: 22.86 mm; Thermal Resistance: 15 ohm;
ATS-1178-C1-R0
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SK681000SA
SK681000SA by Fischer Elektronik & Kg is a heat sink with a thermal resistance of 5.85 ohm. It has a screw profile, measuring 33mm in height and 46mm in width. This extruded heat sink, with a length of 1000mm, is commonly used on transistors for effective heat dissipation.
SK68100SA
HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Color: BLACK;
SK6850AL
HEAT SINK; Profile: SCREW; Body Material: ALUMINIUM ALLOY; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL;
SK6837.5ME
HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Length: 37.5 mm;
SK6850ME
HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Color: NATURAL;
SK6837.5AL
SK6875ME
SK6894SA
HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Thermal Resistance: 5.85 ohm;
SK681000AL
SK6894ME
SK6875AL
SK6894AL
SK68100AL
SK681000ME
HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Height: 33 mm;
SK68100ME
HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Length: 100 mm;
SK6837.5SA
SK6850SA
Supply Digital Components
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