Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Heat Sinks FK245MI247V attributes and parameters. Explore more Heat Sinks devices from Fischer Elektronik & Kg
Device Type:
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Wuxi Xuyang Electronic
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
LM555CN
Texas Instruments
LM555CN by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular package IC has dual terminals and uses bipolar technology for pulse generation in various electronic circuits.
Diotec Semiconductor Ag
OPA2277UA
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
APA501-60-001
Artesyn Embedded Technologies
Artesyn Embedded Technologies' APA501-60-001 heat sink features a pin fin array profile with dimensions of 15x57.5x59 mm (HxWxL). It is constructed with longitudinal fins and designed for thermal management applications in various electronic devices.
242-125ABE-22
WAKEFIELD-VETTE INC
242-125ABE-22 by Wakefield-vette is a black anodized aluminum heat sink with staggered fins, measuring 32.6mm in height, 6.4mm in width, and 22.2mm in length. Ideal for cooling electronic components in compact spaces like PCBs due to its efficient fin construction.
WV-T220-101E
Ohmite Manufacturing
531002B00000G
Aavid Thermalloy
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Thermal Resistance: 13.4 ohm; Width: 12.7 mm;
518-95AB
The Ohmite Manufacturing 518-95AB Heat Sink is an extruded aluminum device with dimensions of 61x57.9x24.1mm (LxWxH). It features an anodized black finish and is commonly used in electronic applications for thermal management due to its efficient heat dissipation capabilities.
7G0020A
TDK
The TDK 7G0020A heat sink has a thermal resistance of 10 ohm, with dimensions of 5.6mm x 24.2mm x 49.8mm and weight of 9.49g. It is designed for use on converters, featuring an omnidirectional fin orientation for efficient heat dissipation in electronic devices.
WA400-11P
Schaffner Holding Ag
WA400-11P by Schaffner Holding Ag is a U-shaped HEAT SINK with dimensions 25x11x16 mm. It has a low Thermal Resistance of 18 ohm, ideal for cooling TRANSISTOR devices efficiently. Suitable for various electronic applications requiring compact and effective heat dissipation solutions.
6399BG
Boyd
Boyd's 6399BG heat sink has a thermal resistance of 3.3 ohm, height of 50.8mm, and width of 25.4mm. Ideal for transistors, this extruded aluminum device with radial fin orientation is anodized in black finish for efficient heat dissipation in electronic applications.
ATS-61300K-C1-R0
Advanced Thermal Solutions
507302B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: TRANSVERSE;
658-35AB
Ohmite Manufacturing's 658-35AB heat sink features PIN FIN ARRAY profile, 8.9mm height, and anodized finish. Ideal for applications requiring efficient thermal dissipation in compact spaces like electronic devices or LED lighting systems.
ATSEU-077B-C1-R0
HS00110
The TDK HS00110 Heat Sink has a thermal resistance of 3.5 ohm and measures 38.1mm in height, 61mm in width, and 101.6mm in length. It is constructed with fin pin design for efficient heat dissipation and weighs 158g. Ideal for use on converters due to its omnidirectional fin orientation.
658-60AB-T3
Wakefield-vette's 658-60AB-T3 is a PIN FIN ARRAY HEAT SINK with dimensions 27.9mm x 27.9mm x 15.2mm and weight of 14.17g, featuring anodized finish and omnidirectional fin orientation. Ideal for cooling electronic components in compact spaces due to its efficient heat dissipation capabilities.
6032DG
HEAT SINK; Body Material: COPPER; Fin Orientation: STAGGERED; Height: 50.8 mm; Thermal Resistance: 8.3 ohm; Finish: TIN;
ATS-1039-C1-R0
ATS-1039-C1-R0 by Advanced Thermal Solutions is a 15mm high, 40mm wide, and 53mm long heat sink with pin fin array profile. Anodized in green, it features omnidirectional fin orientation for efficient thermal management. Ideal for applications requiring compact cooling solutions.
SW50-4G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Height: 50 mm;
7106DG/TR
Boyd's 7106DG/TR heat sink has a thermal resistance of 15 ohm, made of copper with solder profile. It is 9.52mm high, 14.99mm wide, and 25.91mm long, finished with tin plating. Designed for ICs to efficiently dissipate heat in electronic devices.
TEN-HS4
Traco Electronic Ag
7109DG/TR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Fin Orientation: FOLDEDBACK; Thermal Resistance: 11 ohm; Width: 19.38 mm;
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FK24413D2PAK
Fischer Elektronik & Kg
FK24413D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10mm and weighing 3.6g. Primarily used on ICs, it efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability.
FK24413D2PAKTR
FK24413D2PAKTR by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10 mm and weighing 3.6g. Designed for ICs, it comes in tape and reel packaging, making it ideal for thermal management in electronic devices.
FK24413D3PAK
FK24413D3PAK by Fischer Elektronik & Kg is a 10mm tall, 31mm wide, and 13mm long heat sink made of copper. Weighing 3.9g with a TIN LEAD finish, it is designed for use on ICs to dissipate heat efficiently in electronic devices.
FK24408D2PAK
FK24408D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x8x10mm and weighing 2.2g. Primarily used on ICs, it efficiently dissipates heat to prevent overheating in electronic devices. Ideal for bulk packaging applications due to its compact size and lightweight design.
FK24413DPAKTR
FK24413DPAKTR by Fischer Elektronik & Kg is a 10x13x23mm copper heat sink weighing 3.3g, suitable for ICs. It comes in tape and reel packaging, ideal for thermal management applications due to its compact size and efficient heat dissipation capabilities.
FK24408D3PAK
FK24408D3PAK by Fischer Elektronik & Kg is a copper heat sink measuring 31x8x10mm and weighing 2.5g. Primarily used on ICs, it comes in bulk packaging and offers efficient thermal dissipation for electronic components.
FK24413DPAK
FK24413DPAK by Fischer Elektronik & Kg is a 10x13x23 mm copper heat sink weighing 3.3g, designed for ICs. It efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability in various applications.
FK24413D3PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Height: 10 mm; Width: 13 mm; Length: 31 mm;
FK24408D2PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Width: 8 mm; Weight: 2.2 g; Height: 10 mm;
FK24408DPAK
HEAT SINK; Body Material: COPPER; Device Used On: IC; Length: 23 mm; Packing Method: BULK; Height: 10 mm;
FK24408DPAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Weight: 2 g; Width: 8 mm; Packing Method: TAPE AND REEL;
FK24408D3PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Packing Method: TAPE AND REEL; Weight: 2.5 g; Width: 8 mm;
FK243MI247H
HEAT SINK; Profile: CLIP; Body Material: COPPER; Device Used On: TRANSISTOR; Fin Orientation: FIN PIN; Width: 20 mm;
FK245MI247H
FK245MI247H by Fischer Elektronik & Kg is a copper heat sink with thermal resistance of 20.5 ohm, ideal for transistors. Featuring a clip profile, it measures 9mm in height, 20mm in width, and 27mm in length with transverse fin orientation.
FK247220MI
FK242SA220VL
HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Fin Orientation: FOLDEDBACK; Length: 21.59 mm;
Supply Digital Components
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