Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FK24408DPAK by Fischer Elektronik & Kg is a copper heat sink measuring 23x8x10mm and weighing 2g. Primarily used on ICs, it efficiently dissipates heat in electronic devices. Packed in bulk, this thermal device is ideal for compact applications requiring effective thermal management.
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Having a heat sink as the thermal device type ensures efficient heat dissipation, making it ideal for keeping electronic components cool and preventing overheating.
The compact height of 10 mm allows for easy installation in confined spaces without compromising on performance.
The narrow width of 8 mm makes this heat sink suitable for use in applications where space is limited.
Being available in bulk packaging enables cost-effective purchasing of multiple units for large-scale applications.
The lightweight design of 2 g ensures minimal added weight to the electronic device while still providing effective heat dissipation.
Copper is known for its excellent thermal conductivity, making it an ideal material for heat sinks as it efficiently transfers heat away from the source.
The length of 23 mm provides sufficient surface area for heat dissipation, ensuring optimal cooling for the electronic component it is used on.
Designed for use on integrated circuits (ICs), this heat sink is tailored to provide targeted cooling for sensitive electronic components, ensuring their longevity and performance.
Heat Sinks FK24408DPAK attributes and parameters. Explore more Heat Sinks devices from Fischer Elektronik & Kg
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Device Type:
Compatible Device:
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
ABS25-32.768KHZ-T
Abracon
Abracon's ABS25-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency, such as IoT devices and precision timing systems in industrial settings.
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
1554216004
Molex
WIRE AND CABLE;
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
USB2514BI-AEZG
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Goodwork Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
568303B00000G
Aavid Thermalloy
HEAT SINK; Height: 31.75 mm; Finish: ANODIZED; Length: 45.97 mm; Thermal Resistance: 5.4 ohm; Width: 45.97 mm;
320205B00000G
Boyd
Boyd 320205B00000G Heat Sink is an extruded aluminum device with a height of 6.35mm and diameter of 7.75mm, finished in black anodized color. Ideal for cooling electronic components in compact spaces due to its small form factor and efficient heat dissipation capabilities.
HF20G
Boyd's HF20G heat sink boasts a low thermal resistance of 13.1 ohm, ideal for dissipating heat efficiently. With a height of 27.94mm and extruded aluminum construction, it is suitable for compact electronic devices requiring effective cooling. The anodized finish and black color add to its aesthetic appeal in various applications.
SK48100SA
Fischer Elektronik & Kg
SK48100SA by Fischer Elektronik & Kg is a 100mm long, 65mm wide, and 20mm high heat sink with thermal resistance of 3.5 ohm. It is an anodized black extruded construction suitable for transistors due to its longitudinal fin orientation.
576802B03100G
Boyd 576802B03100G Heat Sink has Thermal Resistance of 27.3 ohm, Height 12.7mm, and Width 14.48mm. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.
WF210000
Celduc Relais
HEAT SINK;
V5618C
Assmann Wsw Components
374424B00035G
374424B00035G by Boyd is a PIN FIN ARRAY heat sink with dimensions of 27mm x 27mm x 18mm. It features anodized black aluminum construction and omnidirectional fin orientation. This heat sink is ideal for applications requiring efficient thermal management in electronic devices.
518-95AB
Ohmite Manufacturing
The Ohmite Manufacturing 518-95AB Heat Sink is an extruded aluminum device with dimensions of 61x57.9x24.1mm (LxWxH). It features an anodized black finish and is commonly used in electronic applications for thermal management due to its efficient heat dissipation capabilities.
FK24408D2PAKTR
FK24408D2PAKTR by Fischer Elektronik & Kg is a 10x8x26mm copper heat sink weighing 2.2g, suitable for ICs. Packed in tape and reel, it efficiently dissipates heat in electronic devices. Ideal for compact applications requiring effective thermal management.
577002B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 19.05 mm;
PF527G
HEAT SINK; Body Material: ALUMINUM; Finish: ANODIZED; Height: 25 mm; Color: BLACK; Thermal Resistance: 7.4 ohm;
V7236C
Heat Sinks;
374724B60024G
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: OMNIDIRECT; Finish: ANODIZED;
ATSEU-077B-C3-R0
Advanced Thermal Solutions
ATS-1146-C1-R0
ATS-1146-C1-R0 by Advanced Thermal Solutions is a 22.9mm tall, 59mm wide heat sink with gold anodized finish. Constructed from extruded chromate material, it features longitudinal fin orientation for efficient thermal dissipation. Ideal for applications requiring compact cooling solutions in electronic devices.
7106D/TRG
Boyd's 7106D/TRG heat sink, made of copper, measures 25.91mm in length, 14.99mm in width, and 9.52mm in height with a solder profile and tin finish. Primarily used on ICs, it comes packed in TR,13 INCH format for efficient thermal management applications.
WA-T220-101E
DV-T263-301E-TR
904-27-1-23-2-B-0
Wakefield Thermal Solutions
Wakefield Thermal Solutions' 904-27-1-23-2-B-0 heat sink has thermal resistance of 12.93 ohm, elliptical fin orientation, and black anodized finish. It is a clip-profile extruded aluminum alloy device used on ICs for efficient heat dissipation.
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FK24413D2PAK
FK24413D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10mm and weighing 3.6g. Primarily used on ICs, it efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability.
FK24413D2PAKTR
FK24413D2PAKTR by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10 mm and weighing 3.6g. Designed for ICs, it comes in tape and reel packaging, making it ideal for thermal management in electronic devices.
FK24413D3PAK
FK24413D3PAK by Fischer Elektronik & Kg is a 10mm tall, 31mm wide, and 13mm long heat sink made of copper. Weighing 3.9g with a TIN LEAD finish, it is designed for use on ICs to dissipate heat efficiently in electronic devices.
FK24408D2PAK
FK24408D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x8x10mm and weighing 2.2g. Primarily used on ICs, it efficiently dissipates heat to prevent overheating in electronic devices. Ideal for bulk packaging applications due to its compact size and lightweight design.
FK24413DPAKTR
FK24413DPAKTR by Fischer Elektronik & Kg is a 10x13x23mm copper heat sink weighing 3.3g, suitable for ICs. It comes in tape and reel packaging, ideal for thermal management applications due to its compact size and efficient heat dissipation capabilities.
FK24408D3PAK
FK24408D3PAK by Fischer Elektronik & Kg is a copper heat sink measuring 31x8x10mm and weighing 2.5g. Primarily used on ICs, it comes in bulk packaging and offers efficient thermal dissipation for electronic components.
FK24413DPAK
FK24413DPAK by Fischer Elektronik & Kg is a 10x13x23 mm copper heat sink weighing 3.3g, designed for ICs. It efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability in various applications.
FK24413D3PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Height: 10 mm; Width: 13 mm; Length: 31 mm;
HEAT SINK; Body Material: COPPER; Device Used On: IC; Width: 8 mm; Weight: 2.2 g; Height: 10 mm;
FK24408DPAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Weight: 2 g; Width: 8 mm; Packing Method: TAPE AND REEL;
FK245MI247V
FK24408D3PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Packing Method: TAPE AND REEL; Weight: 2.5 g; Width: 8 mm;
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