Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FK24408D3PAK by Fischer Elektronik & Kg is a copper heat sink measuring 31x8x10mm and weighing 2.5g. Primarily used on ICs, it comes in bulk packaging and offers efficient thermal dissipation for electronic components.
Median Price
$1.014
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
1k+
DigiKey
1+ parts
-
100+ parts
$0.990
1k+ parts
10k+ parts
Master Electronics
$1.037
$0.998
$0.918
Nova Conductors
$1.238
Vyrian
Rutronik
$0.780
$0.759
Continental Prestige Electronics
$1.194
$1.170
Argo Parts USA
Netroflash
$1.214
AZTECH Wire
$18.900
$18.150
$17.790
$17.430
Aztec Data Supply Inc.
Perfect Parts
Robosynatics
Having a heat sink as a thermal device ensures efficient heat dissipation, which is essential for maintaining the optimal temperature of the IC.
The low height of 10 mm allows for easy installation in compact spaces where vertical clearance is limited.
The narrow width of 8 mm makes this heat sink suitable for ICs that are closely positioned or densely packed on a circuit board.
Being packed in bulk quantities makes this heat sink a cost-effective choice for mass production or projects requiring multiple units.
With a lightweight design of only 2.5 g, this heat sink adds minimal additional weight to the overall system, making it suitable for applications where weight is a critical factor.
The use of copper as the body material offers excellent thermal conductivity, ensuring efficient heat transfer from the IC to the heat sink.
The length of 31 mm provides sufficient surface area for heat dissipation, making this heat sink effective in cooling the IC effectively.
Designed specifically for use on ICs, this heat sink is tailored to meet the thermal needs of integrated circuits, ensuring optimal performance and reliability.
Heat Sinks FK24408D3PAK attributes and parameters. Explore more Heat Sinks devices from Fischer Elektronik & Kg
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Compatible Device:
LM2931Z-5.0RPG
Onsemi
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MBRA340T3G
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
LM358M
Texas Instruments
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Hy Electronic
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
FDLL4148
Fairchild Semiconductor
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
TM4C1294NCPDTI3
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
Motorola
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; JESD-609 Code: e0;
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
Nexperia
658-35AB
WAKEFIELD-VETTE INC
HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Weight: 6.7 g; Color: BLACK;
DA-T263-101E-TR
Ohmite Manufacturing
DA-T263-101E-TR by Ohmite Manufacturing is a heat sink with dimensions of 10.16mm x 12.7mm x 25.91mm and a weight of 3.8g. It is made of anodized aluminum and is used on transistors for thermal management purposes.
ATS-1143-C1-R0
Advanced Thermal Solutions
HEAT SINK;
SV-LED-176E
6399BG
Aavid Thermalloy
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: EXTRUDED; Height: 50.8 mm; Color: BLACK;
577202B04000G
Boyd
Boyd's 577202B04000G Heat Sink has a Thermal Resistance of 24.4 ohm, U Profile, and Aluminum Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or LED lighting systems.
V-1100-SMD/AL
Assmann Wsw Components
Heat Sinks;
578622B03200G
Boyd 578622B03200G Heat Sink has Thermal Resistance of 13.2 ohm, U Profile, and Aluminum Body Material. Ideal for TRANSISTOR devices due to its efficient heat dissipation capabilities in a compact size (37.59mm x 12.7mm x 25.4mm).
320205B00000G
Boyd 320205B00000G Heat Sink is an extruded aluminum device with a height of 6.35mm and diameter of 7.75mm, finished in black anodized color. Ideal for cooling electronic components in compact spaces due to its small form factor and efficient heat dissipation capabilities.
C220-050-2AE
374324B00035G
The Boyd 374324B00035G heat sink features a pin fin array design with a height of 10mm and width of 27mm. Constructed from black anodized aluminum, it is ideal for applications requiring efficient heat dissipation in compact spaces. The omnidirectional fin orientation enhances thermal performance, making it suitable for various electronic devices.
V7236C
518-95AB
The Ohmite Manufacturing 518-95AB Heat Sink is an extruded aluminum device with dimensions of 61x57.9x24.1mm (LxWxH). It features an anodized black finish and is commonly used in electronic applications for thermal management due to its efficient heat dissipation capabilities.
FK24413D2PAK
Fischer Elektronik & Kg
FK24413D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10mm and weighing 3.6g. Primarily used on ICs, it efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability.
908-35-2-23-2-B-0
Wakefield Thermal Solutions
Wakefield Thermal Solutions' 908-35-2-23-2-B-0 heat sink features a thermal resistance of 10.03 ohm, aluminum alloy construction with black anodized finish, and pin fin orientation. This clip-profiled device is 35mm wide, 12mm high, and used on ICs for effective heat dissipation in various electronic applications.
FA-T220-64E
The Ohmite FA-T220-64E is a black anodized aluminum heat sink measuring 41.6mm x 25mm x 63.5mm and weighing 46g. With omnidirectional fin orientation, it efficiently dissipates heat in various applications like power electronics and LED lighting systems. Ideal for thermal management due to its compact size and lightweight design.
SK10425.4STS
V4330N
V4330N by Assmann Wsw Components is a 12mm tall black anodized aluminum heat sink with thermal resistance of 12 ohm. Ideal for applications requiring efficient heat dissipation, such as in electronic devices or computer components due to its longitudinal fin orientation and compact size of 20x29 mm.
302NN
302NN by Wakefield-vette is a black anodized heat sink made of aluminum, with dimensions of 50.8mm x 50.8mm x 38.1mm and weighing 60.33g. Ideal for cooling electronic components in various applications due to its efficient thermal dissipation capabilities and durable construction.
577102B04000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Color: BLACK;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
FK24413D2PAKTR
FK24413D2PAKTR by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10 mm and weighing 3.6g. Designed for ICs, it comes in tape and reel packaging, making it ideal for thermal management in electronic devices.
FK24413D3PAK
FK24413D3PAK by Fischer Elektronik & Kg is a 10mm tall, 31mm wide, and 13mm long heat sink made of copper. Weighing 3.9g with a TIN LEAD finish, it is designed for use on ICs to dissipate heat efficiently in electronic devices.
FK24408D2PAK
FK24408D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x8x10mm and weighing 2.2g. Primarily used on ICs, it efficiently dissipates heat to prevent overheating in electronic devices. Ideal for bulk packaging applications due to its compact size and lightweight design.
FK24413DPAKTR
FK24413DPAKTR by Fischer Elektronik & Kg is a 10x13x23mm copper heat sink weighing 3.3g, suitable for ICs. It comes in tape and reel packaging, ideal for thermal management applications due to its compact size and efficient heat dissipation capabilities.
FK24413DPAK
FK24413DPAK by Fischer Elektronik & Kg is a 10x13x23 mm copper heat sink weighing 3.3g, designed for ICs. It efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability in various applications.
FK24413D3PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Height: 10 mm; Width: 13 mm; Length: 31 mm;
FK24408D2PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Width: 8 mm; Weight: 2.2 g; Height: 10 mm;
FK24408DPAK
HEAT SINK; Body Material: COPPER; Device Used On: IC; Length: 23 mm; Packing Method: BULK; Height: 10 mm;
FK24408DPAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Weight: 2 g; Width: 8 mm; Packing Method: TAPE AND REEL;
FK245MI247V
FK24408D3PAKTR
HEAT SINK; Body Material: COPPER; Device Used On: IC; Packing Method: TAPE AND REEL; Weight: 2.5 g; Width: 8 mm;
Supply Digital Components
$106.00
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