Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Boyd's 573300D00010G Heat Sink, with U profile, is 10.16mm high and 12.7mm wide. Constructed through extrusion, it has a SN/NI finish and comes in gray color. Ideal for applications requiring efficient heat dissipation in compact spaces due to its small dimensions and effective thermal properties.
Median Price
$0.950
Lifecycle Status
Suppliers In-Stock
54
In-Stock Inventory
1k+
RS (Exports)
1+ parts
$0.410
100+ parts
-
1k+ parts
10k+ parts
Mouser Electronics
Newark
$1.470
Element14
$3.420
DigiKey
$4.570
$3.576
$3.212
$3.012
Farnell
$11.412
$5.994
Avnet
Future Electronics
$0.460
$0.450
Heilind Electronics
$0.703
$0.680
Sager
Interstate Connecting
$0.669
$0.629
Verical
$0.873
RS Americas
$6.250
Master Electronics
$0.398
$0.351
Arrow
$3.097
Component Electronics Inc.
$0.580
$0.430
$0.380
PUI
$0.780
$0.670
$0.610
Nova Conductors
$5.627
IBS Electronics
$0.729
$0.722
NAC Semi
$0.792
Diverse Electronics
Vyrian
Electro Sonic
$0.814
$0.702
J2 Sourcing AB
Bristol Electronics
Atlantic Semiconductor
Semi Source
Tectiva GmbH
Inventory MP
Connector Distribution Corp
Right Parts Inc.
Prism Electronics
Semtec, LLC
Sensible Micro Corp
LIBRA Elektronik GmbH
Component Sense
QIE Inc.
ComSIT Distribution GmbH
Elcom Components
Connect4Technologies Inc.
Technoshack Inc.
EPE Components Inc.
Flex Direct, LLC
Q Components
Sea View Technologies
Electronics Depot
North Shore Components
Contempo Components LLC
ACDS - Activité Composants Distribution Service
Holdelec - ElecDif-Pro
Astute Electronics Inc
Resion
Sunrise Surplus Inc.
Speed Components Ltd
Component Stockers USA
$0.740
$0.660
$0.480
Advanced Electronics
$0.791
$0.751
Argo Parts USA
$1.973
Allen Electronics Distributors
$5.550
$4.700
Continental Prestige Electronics
$8.980
Perfect Parts
GreenTree Electronics
Glotronic Ltd.
Abacus Technologies
Aztec Data Supply Inc.
Eastek
Kepictronics
Netroflash
$5.514
$5.346
$5.233
Authorized Procurement Solutions
A specifically designed heat sink ensures efficient heat dissipation from electronic components, preventing overheating and improving overall performance.
U-shaped profiles provide better airflow and thermal conductivity, allowing for enhanced cooling capabilities.
The compact height makes this heat sink suitable for applications with limited space while still offering effective heat dissipation.
The SN (tin) and NI (nickel) finish provides corrosion resistance and improves the overall durability of the heat sink.
A moderate width allows for efficient cooling without taking up too much space in the electronic device.
Extruded construction offers uniformity and consistency in heat dissipation, ensuring reliable performance over time.
The gray color is neutral and blends well with various electronic components, providing a clean and professional look.
The TR packing method ensures safe transportation and storage of the heat sink, while the 13-inch size makes it convenient for handling and installation.
An appropriate length allows for sufficient surface area for heat dissipation, effectively reducing the temperature of the electronic component it is attached to.
Heat Sinks 573300D00010G attributes and parameters. Explore more Heat Sinks devices from Boyd
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Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
Texas Instruments
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NXP Semiconductors
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
Multicomp Pro
Weitronic Enterprise
374724B60024G
Boyd
374724B60024G by Boyd is a PIN FIN ARRAY HEAT SINK with dimensions of 35mm x 35mm x 18mm. Constructed from black anodized aluminum, it features omnidirectional fin orientation. Ideal for applications requiring efficient heat dissipation in compact spaces.
7136DG
Aavid Thermalloy
HEAT SINK; Profile: U; Body Material: COPPER; Construction: CLIP; Fin Orientation: TRANSVERSE; Finish: TIN;
WV-T220-101E
Ohmite Manufacturing
HEAT SINK;
625-25AB-T4E
WAKEFIELD-VETTE INC
625-25AB-T4E by Wakefield-vette is a heat sink with pin fin array profile, 6.4mm height, and anodized finish. Ideal for cooling applications in electronics due to its aluminum construction, omnidirectional fin orientation, and compact dimensions of 25x25 mm. Weighing only 5.45g, it offers efficient heat dissipation in various devices.
SW25-2G
Boyd's SW25-2G is a 25mm high, 12.5mm wide, and 34.5mm long heat sink with a thermal resistance of 13 ohm. It is an extruded aluminum body with a black anodized finish, designed for radial fin orientation. Ideal for applications requiring efficient heat dissipation in electronic devices.
6399BG
HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Construction: EXTRUDED; Height: 50.8 mm; Color: BLACK;
576802B03100G
Boyd 576802B03100G Heat Sink has Thermal Resistance of 27.3 ohm, Height 12.7mm, and Width 14.48mm. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.
SK46375SA
Fischer Elektronik & Kg
EV-T220-38E
Ohmite Manufacturing's EV-T220-38E heat sink has thermal resistance of 11.4 ohm, height 38.1mm, and width 12.7mm. Ideal for transistors, this aluminum alloy device weighs 18g and is used to dissipate heat efficiently in electronic applications.
V5220L
Assmann Wsw Components
Heat Sinks;
SK52515
SK52515 by Fischer Elektronik & Kg is a 13.3 ohm HEAT SINK with dimensions of 28mm x 19.4mm x 15mm, ideal for TRANSISTOR applications. Constructed using EXTRUDED aluminum with LONGITUDINAL fin orientation, it efficiently dissipates heat in electronic devices.
ATS-61300K-C1-R0
Advanced Thermal Solutions
FK24413D3PAK
FK24413D3PAK by Fischer Elektronik & Kg is a 10mm tall, 31mm wide, and 13mm long heat sink made of copper. Weighing 3.9g with a TIN LEAD finish, it is designed for use on ICs to dissipate heat efficiently in electronic devices.
507002B00000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Length: 44.45 mm;
532702B02500G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Width: 25.4 mm; Thermal Resistance: 4.8 ohm;
SW50-4G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Height: 50 mm;
218-40CTE5
218-40CTE5 by Wakefield-vette is a black anodized aluminum heat sink with U profile, folded back fins, and dimensions of 26.2mm x 12.7mm x 10.2mm. Ideal for cooling electronic components in compact spaces like laptops, routers, and LED lighting systems.
527-45AB
Ohmite Manufacturing's 527-45AB heat sink is 11.4mm tall, 57.9mm wide, and 61mm long with an anodized black finish. Constructed from extruded aluminum, it efficiently dissipates heat in electronic devices. Ideal for applications requiring compact cooling solutions.
401K
The Ohmite Manufacturing 401K is an extruded heat sink with dimensions of 31.8mm x 120.7mm x 38.1mm and a weight of 68.04g. It is designed for thermal management applications in various industries, providing efficient heat dissipation capabilities.
FA-T220-51E
The Ohmite FA-T220-51E is a black anodized aluminum heat sink measuring 41.6mm x 25mm x 50.8mm and weighing 37g. With omnidirectional fin orientation, it efficiently dissipates heat in various applications like electronics cooling systems. Ideal for compact spaces requiring effective thermal management.
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573300D00010G
HEAT SINK; Profile: U; Construction: EXTRUDED; Width: 12.7 mm; Height: 10.16 mm; Packing Method: TAPE AND REEL;
573300D00000G
HEAT SINK; Profile: U; Body Material: COPPER; Construction: FIN; Finish: TIN; Thermal Resistance: 18 ohm;
Boyd 573300D00000G Heat Sink has Thermal Resistance of 18Ω, U Profile, and Copper Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces.
573300D00000
HEAT SINK; Profile: U; Body Material: COPPER; Construction: EXTRUDED; Weight: 3.1 g; Length: 26.16 mm;
573300D00010
HEAT SINK; Profile: U; Body Material: COPPER; Construction: EXTRUDED; Height: 10.16 mm; Width: 12.7 mm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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