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RF/Microwave Mixers

RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.

RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.

RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.

RF/Microwave Mixers

Available Parts 680

Part RoHS Manufacturer Description RF or Microwave Device Type Mounting Feature No. of Terminals Package Body Material Technology Screening Level Maximum Input Power (CW) Maximum Voltage Standing Wave Ratio Maximum Supply Current Construction Power Supplies (V) Package Equivalence Code Characteristic Impedance Sub-Category Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Maximum Conversion Loss Additional Features JESD-609 Code Minimum Operating Frequency Maximum Operating Frequency
LTC5541IUH#PBF by Analog Devices

LTC5541IUH#PBF

Analog Devices

DOUBLE BALANCED; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel; Terminal Finish: Matte Tin (Sn) - annealed; Maximum Operating Frequency: 2300 MHz; JESD-609 Code: e3;

DOUBLE BALANCED

15 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

e3

1300 MHz

2300 MHz

LTC5541IUH#TRPBF by Analog Devices

LTC5541IUH#TRPBF

Analog Devices

DOUBLE BALANCED; Construction: COMPONENT; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 2300 MHz;

DOUBLE BALANCED

15 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

e3

1300 MHz

2300 MHz

AD8342ACPZ-REEL7 by Analog Devices

AD8342ACPZ-REEL7

Analog Devices

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;

DOUBLE BALANCED

SURFACE MOUNT

16

PLASTIC/EPOXY

BIPOLAR

12 dBm

113 mA

COMPONENT

5

LCC16,.12SQ,20

50 ohm

RF/Microwave Mixers

85 Cel

-40 Cel

MATTE TIN

e3

50 MHz

2400 MHz

LTC5549IUDB#TRMPBF by Analog Devices

LTC5549IUDB#TRMPBF

Analog Devices

DOUBLE BALANCED; Maximum Input Power (CW): 20 dBm; Maximum Operating Temperature: 105 Cel; JESD-609 Code: e3; Construction: COMPONENT; Additional Features: CMOS COMPATIBLE;

DOUBLE BALANCED

20 dBm

COMPONENT

50 ohm

105 Cel

-40 Cel

MATTE TIN

CMOS COMPATIBLE

e3

2000 MHz

14000 MHz

CMY210 by Infineon Technologies

CMY210

Infineon Technologies

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 5; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Conversion Loss: 7 dB;

DOUBLE BALANCED

SURFACE MOUNT

5

PLASTIC/EPOXY

GAAS

17 dBm

COMPONENT

3

TSOP5/6,.11,37

50 ohm

RF/Microwave Mixers

7 dB

500 MHz

2500 MHz

AD8343ARUZ-REEL7 by Analog Devices

AD8343ARUZ-REEL7

Analog Devices

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 14; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Package Equivalence Code: TSSOP14,.25;

DOUBLE BALANCED

SURFACE MOUNT

14

PLASTIC/EPOXY

BIPOLAR

2

75 mA

COMPONENT

5

TSSOP14,.25

50 ohm

RF/Microwave Mixers

85 Cel

-40 Cel

MATTE TIN

e3

0 MHz

2500 MHz

MAMX-011023-TR3000 by M/a-com Technology Solutions

MAMX-011023-TR3000

M/a-com Technology Solutions

RF/Microwave Mixers;

SA602AD/01-T by NXP Semiconductors

SA602AD/01-T

NXP Semiconductors

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; JESD-609 Code: e4;

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

2.8 mA

6

SOP8,.25

RF/Microwave Mixers

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

e4

HMC560ALM3TR by Analog Devices

HMC560ALM3TR

Analog Devices

DOUBLE BALANCED; Maximum Operating Frequency: 38000 MHz; Maximum Conversion Loss: 15 dB; Minimum Operating Temperature: -40 Cel; Maximum Input Power (CW): 25 dBm; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED

25 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

15 dB

22000 MHz

38000 MHz

LTC5510IUF#PBF by Analog Devices

LTC5510IUF#PBF

Analog Devices

DOUBLE BALANCED; Construction: COMPONENT; Minimum Operating Frequency: 1 MHz; Maximum Operating Temperature: 105 Cel; JESD-609 Code: e3; Maximum Input Power (CW): 15 dBm;

DOUBLE BALANCED

15 dBm

COMPONENT

50 ohm

105 Cel

-40 Cel

MATTE TIN

e3

1 MHz

6000 MHz

CMY210E6327 by Infineon Technologies

CMY210E6327

Infineon Technologies

DOUBLE BALANCED; Minimum Operating Frequency: 500 MHz; Construction: COMPONENT; Maximum Operating Frequency: 2500 MHz; Maximum Input Power (CW): 10 dBm; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED

10 dBm

COMPONENT

50 ohm

500 MHz

2500 MHz

HMC8191LC4 by Analog Devices

HMC8191LC4

Analog Devices

IMAGE REJECTION; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel; Maximum Conversion Loss: 11.5 dB; Maximum Operating Frequency: 26500 MHz; JESD-609 Code: e4;

IMAGE REJECTION

24 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

11.5 dB

e4

6000 MHz

26500 MHz

HMC560ALM3 by Analog Devices

HMC560ALM3

Analog Devices

DOUBLE BALANCED; Construction: COMPONENT; Maximum Input Power (CW): 25 dBm; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Maximum Conversion Loss: 15 dB;

DOUBLE BALANCED

25 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

15 dB

22000 MHz

38000 MHz

HMC558ALC3BTR by Analog Devices

HMC558ALC3BTR

Analog Devices

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: CERAMIC; Maximum Conversion Loss: 9.5 dB; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED

SURFACE MOUNT

12

CERAMIC

25 dBm

COMPONENT

LCC12,.12SQ,20

50 ohm

85 Cel

-40 Cel

Tungsten/Nickel/Gold (W/Ni/Au)

9.5 dB

5500 MHz

14000 MHz

RMS-30 by Mini-circuits

RMS-30

Mini-circuits

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: CERAMIC; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED

SURFACE MOUNT

6

CERAMIC

17 dBm

2.16

COMPONENT

DILCC6,.25

RF/Microwave Mixers

85 Cel

-40 Cel

TIN LEAD

9.8 dB

e0

200 MHz

3000 MHz

RMS-30+ by Mini-circuits

RMS-30+

Mini-circuits

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: CERAMIC; Package Equivalence Code: DILCC6,.25; Maximum Conversion Loss: 9.8 dB;

DOUBLE BALANCED

SURFACE MOUNT

6

CERAMIC

17 dBm

2.16

COMPONENT

DILCC6,.25

RF/Microwave Mixers

85 Cel

-40 Cel

GOLD OVER NICKEL

9.8 dB

e4

200 MHz

3000 MHz

DB0226HA1 by L-3 Narda-miteq

DB0226HA1

L-3 Narda-miteq

DOUBLE BALANCED; Additional Features: HIGH RELIABILITY, HIGH DYNAMIC RANGE; Minimum Operating Frequency: 2000 MHz; Maximum Operating Frequency: 26000 MHz; Maximum Conversion Loss: 10 dB; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED

1.5

85 Cel

-54 Cel

10 dB

HIGH RELIABILITY, HIGH DYNAMIC RANGE

2000 MHz

26000 MHz

HMC8191LC4TR-R5 by Analog Devices

HMC8191LC4TR-R5

Analog Devices

IMAGE REJECTION; Maximum Operating Temperature: 85 Cel; Maximum Conversion Loss: 11.5 dB; JESD-609 Code: e4; Minimum Operating Frequency: 6000 MHz; Maximum Operating Frequency: 26500 MHz;

IMAGE REJECTION

24 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

11.5 dB

e4

6000 MHz

26500 MHz

HMC787ALC3BTR by Analog Devices

HMC787ALC3BTR

Analog Devices

TRIPLE BALANCED; Terminal Finish: GOLD OVER NICKEL; Maximum Input Power (CW): 28 dBm; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 10000 MHz; Minimum Operating Temperature: -40 Cel;

TRIPLE BALANCED

28 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

GOLD OVER NICKEL

11 dB

e4

3000 MHz

10000 MHz

HMC8191LC4TR by Analog Devices

HMC8191LC4TR

Analog Devices

IMAGE REJECTION; Construction: COMPONENT; JESD-609 Code: e4; Maximum Conversion Loss: 11.5 dB; Maximum Operating Temperature: 85 Cel; Minimum Operating Frequency: 6000 MHz;

IMAGE REJECTION

24 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

Gold/Nickel (Au/Ni)

11.5 dB

e4

6000 MHz

26500 MHz

LTC5549IUDB#PBF by Analog Devices

LTC5549IUDB#PBF

Analog Devices

DOUBLE BALANCED; Terminal Finish: Matte Tin (Sn) - annealed; Additional Features: CMOS COMPATIBLE; Construction: COMPONENT; JESD-609 Code: e3; Maximum Input Power (CW): 20 dBm;

DOUBLE BALANCED

20 dBm

COMPONENT

50 ohm

105 Cel

-40 Cel

Matte Tin (Sn) - annealed

CMOS COMPATIBLE

e3

2000 MHz

14000 MHz

HMC207AS8ETR by Analog Devices

HMC207AS8ETR

Analog Devices

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: SOP8,.25;

DOUBLE BALANCED

SURFACE MOUNT

8

PLASTIC/EPOXY

GAAS

SOP8,.25

RF/Microwave Mixers

85 Cel

-40 Cel

HMC520ALC4 by Analog Devices

HMC520ALC4

Analog Devices

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Maximum Operating Temperature: 85 Cel;

IMAGE REJECTION

SURFACE MOUNT

24

CERAMIC

GAAS

20 dBm

COMPONENT

LCC24,.16SQ,20

50 ohm

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

10 dB

e4

6000 MHz

10000 MHz

HMC213BMS8ETR by Analog Devices

HMC213BMS8ETR

Analog Devices

DOUBLE BALANCED; Minimum Operating Temperature: -40 Cel; JESD-609 Code: e3; Maximum Conversion Loss: 11 dB; Maximum Input Power (CW): 13 dBm; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED

13 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

MATTE TIN

11 dB

e3

1500 MHz

4500 MHz

LTC5549IUDB#TRPBF by Analog Devices

LTC5549IUDB#TRPBF

Analog Devices

DOUBLE BALANCED; Minimum Operating Temperature: -40 Cel; Minimum Operating Frequency: 2000 MHz; Characteristic Impedance: 50 ohm; Additional Features: CMOS COMPATIBLE; JESD-609 Code: e3;

DOUBLE BALANCED

20 dBm

COMPONENT

50 ohm

105 Cel

-40 Cel

MATTE TIN

CMOS COMPATIBLE

e3

2000 MHz

14000 MHz

JMS-2LH by Mini-circuits

JMS-2LH

Mini-circuits

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: CERAMIC; JESD-609 Code: e0; Package Equivalence Code: SMDIP6,.3;

DOUBLE BALANCED

SURFACE MOUNT

6

CERAMIC

17 dBm

2.67

COMPONENT

SMDIP6,.3

RF/Microwave Mixers

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

9 dB

e0

20 MHz

1000 MHz

JMS-2LH+ by Mini-circuits

JMS-2LH+

Mini-circuits

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: CERAMIC; Maximum Operating Temperature: 85 Cel; Terminal Finish: Tin (Sn) - with Nickel (Ni) barrier;

DOUBLE BALANCED

SURFACE MOUNT

6

CERAMIC

17 dBm

2.67

COMPONENT

SMDIP6,.3

RF/Microwave Mixers

85 Cel

-40 Cel

Tin (Sn) - with Nickel (Ni) barrier

9 dB

e3

20 MHz

1000 MHz

HMC520ALC4TR by Analog Devices

HMC520ALC4TR

Analog Devices

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Minimum Operating Frequency: 6000 MHz;

IMAGE REJECTION

SURFACE MOUNT

24

CERAMIC

GAAS

20 dBm

COMPONENT

LCC24,.16SQ,20

50 ohm

85 Cel

-40 Cel

Gold (Au) - with Nickel (Ni) barrier

10 dB

e4

6000 MHz

10000 MHz

HMC787ALC3BTR-R5 by Analog Devices

HMC787ALC3BTR-R5

Analog Devices

TRIPLE BALANCED; Maximum Input Power (CW): 28 dBm; Maximum Operating Temperature: 85 Cel; Terminal Finish: GOLD OVER NICKEL; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 3000 MHz;

TRIPLE BALANCED

28 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

GOLD OVER NICKEL

11 dB

e4

3000 MHz

10000 MHz

HMC521ALC4TR by Analog Devices

HMC521ALC4TR

Analog Devices

IMAGE REJECTION; Construction: COMPONENT; Maximum Operating Frequency: 13500 MHz; Minimum Operating Temperature: -40 Cel; Maximum Input Power (CW): 20 dBm; Minimum Operating Frequency: 8500 MHz;

IMAGE REJECTION

20 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

9.5 dB

8500 MHz

13500 MHz

HMC521ALC4TR-R5 by Analog Devices

HMC521ALC4TR-R5

Analog Devices

IMAGE REJECTION; Construction: COMPONENT; Maximum Conversion Loss: 9.5 dB; Minimum Operating Temperature: -40 Cel; Maximum Operating Frequency: 13500 MHz; Characteristic Impedance: 50 ohm;

IMAGE REJECTION

20 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

9.5 dB

8500 MHz

13500 MHz

HMC525LC4TR by Analog Devices

HMC525LC4TR

Analog Devices

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;

IMAGE REJECTION

SURFACE MOUNT

24

CERAMIC

20 dBm

COMPONENT

LCC24,.16SQ,20

50 ohm

RF/Microwave Mixers

85 Cel

-55 Cel

Gold (Au) - with Nickel (Ni) barrier

11 dB

e4

4000 MHz

8500 MHz

HMC787ALC3B by Analog Devices

HMC787ALC3B

Analog Devices

TRIPLE BALANCED; Technology: GAAS; Maximum Operating Temperature: 85 Cel; Maximum Conversion Loss: 11 dB; Maximum Operating Frequency: 10000 MHz; Minimum Operating Frequency: 3000 MHz;

TRIPLE BALANCED

GAAS

28 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

TUNGSTEN NICKEL GOLD

11 dB

3000 MHz

10000 MHz

LRMS-30J+ by Mini-circuits

LRMS-30J+

Mini-circuits

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: CERAMIC; Maximum Operating Frequency: 3000 MHz; Terminal Finish: Tin (Sn) - with Nickel (Ni) barrier;

DOUBLE BALANCED

SURFACE MOUNT

6

CERAMIC

17 dBm

6.26

COMPONENT

SMDIP6,.4

RF/Microwave Mixers

85 Cel

-40 Cel

Tin (Sn) - with Nickel (Ni) barrier

9.8 dB

e3

200 MHz

3000 MHz

LRMS-30J by Mini-circuits

LRMS-30J

Mini-circuits

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: CERAMIC; Maximum Conversion Loss: 9.8 dB; Terminal Finish: TIN LEAD;

DOUBLE BALANCED

SURFACE MOUNT

6

CERAMIC

17 dBm

6.26

COMPONENT

SMDIP6,.4

RF/Microwave Mixers

85 Cel

-40 Cel

TIN LEAD

9.8 dB

e0

200 MHz

3000 MHz

HMC292ALC3B by Analog Devices

HMC292ALC3B

Analog Devices

DOUBLE BALANCED; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Construction: COMPONENT; Minimum Operating Frequency: 14000 MHz; Maximum Input Power (CW): 18 dBm;

DOUBLE BALANCED

18 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

12.5 dB

14000 MHz

30000 MHz

HMC521ALC4 by Analog Devices

HMC521ALC4

Analog Devices

IMAGE REJECTION; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm; Maximum Conversion Loss: 9.5 dB; JESD-609 Code: e4; Maximum Operating Frequency: 13500 MHz;

IMAGE REJECTION

20 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

GOLD OVER NICKEL

9.5 dB

e4

8500 MHz

13500 MHz

HMC521LC4TR by Analog Devices

HMC521LC4TR

Analog Devices

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Minimum Operating Temperature: -55 Cel;

IMAGE REJECTION

SURFACE MOUNT

24

CERAMIC

GAAS

LCC24,.16SQ,20

RF/Microwave Mixers

85 Cel

-55 Cel

LTC5552IUDB#TRMPBF by Analog Devices

LTC5552IUDB#TRMPBF

Analog Devices

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Maximum Operating Frequency: 20000 MHz; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED

SURFACE MOUNT

12

PLASTIC/EPOXY

20 dBm

150 mA

COMPONENT

3.3

LCC12,.08X.12,20

50 ohm

105 Cel

-40 Cel

MATTE TIN

e3

3000 MHz

20000 MHz

LTC5553IUDB#TRMPBF by Analog Devices

LTC5553IUDB#TRMPBF

Analog Devices

DOUBLE BALANCED; Maximum Operating Temperature: 105 Cel; Minimum Operating Frequency: 3000 MHz; Terminal Finish: MATTE TIN; Minimum Operating Temperature: -40 Cel; Maximum Operating Frequency: 20000 MHz;

DOUBLE BALANCED

20 dBm

COMPONENT

50 ohm

105 Cel

-40 Cel

MATTE TIN

e3

3000 MHz

20000 MHz

HMC220AMS8ETR by Analog Devices

HMC220AMS8ETR

Analog Devices

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Construction: COMPONENT;

DOUBLE BALANCED

SURFACE MOUNT

8

PLASTIC/EPOXY

GAAS

13 dBm

COMPONENT

TSOP8,.19

50 ohm

RF/Microwave Mixers

85 Cel

-40 Cel

MATTE TIN

10.5 dB

e3

5000 MHz

12000 MHz

HMC219BMS8GETR by Analog Devices

HMC219BMS8GETR

Analog Devices

DOUBLE BALANCED; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel; Maximum Conversion Loss: 11 dB; JESD-609 Code: e3; Construction: COMPONENT;

DOUBLE BALANCED

25 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

MATTE TIN

11 dB

e3

2500 MHz

7000 MHz

HMC557ALC4 by Analog Devices

HMC557ALC4

Analog Devices

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Package Equivalence Code: LCC24,.16SQ,20;

DOUBLE BALANCED

SURFACE MOUNT

24

CERAMIC

GAAS

LCC24,.16SQ,20

RF/Microwave Mixers

85 Cel

-40 Cel

Tungsten/Nickel/Gold (W/Ni/Au)

HMC774ALC3BTR by Analog Devices

HMC774ALC3BTR

Analog Devices

DOUBLE BALANCED; Maximum Operating Frequency: 34000 MHz; Maximum Input Power (CW): 21 dBm; Construction: COMPONENT; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED

21 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

15.5 dB

7000 MHz

34000 MHz

HMC774ALC3BTR-R5 by Analog Devices

HMC774ALC3BTR-R5

Analog Devices

DOUBLE BALANCED; Maximum Input Power (CW): 21 dBm; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED

21 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

15.5 dB

7000 MHz

34000 MHz

IAM-82008 by Agilent Technologies

IAM-82008

Agilent Technologies

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; JESD-609 Code: e0;

SURFACE MOUNT

8

PLASTIC/EPOXY

BIPOLAR

65 mA

10

SOP8,.25

RF/Microwave Mixers

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

e0

HMC774ALC3B by Analog Devices

HMC774ALC3B

Analog Devices

DOUBLE BALANCED; Minimum Operating Temperature: -40 Cel; Construction: COMPONENT; Maximum Conversion Loss: 15.5 dB; Maximum Input Power (CW): 21 dBm; Minimum Operating Frequency: 7000 MHz;

DOUBLE BALANCED

21 dBm

COMPONENT

50 ohm

85 Cel

-40 Cel

15.5 dB

7000 MHz

34000 MHz

LRMS-1MH by Mini-circuits

LRMS-1MH

Mini-circuits

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: CERAMIC; Maximum Operating Frequency: 500 MHz; Minimum Operating Frequency: 2 MHz;

DOUBLE BALANCED

SURFACE MOUNT

6

CERAMIC

23 dBm

1.96

COMPONENT

GWDIP6,.4

RF/Microwave Mixers

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

8 dB

e0

2 MHz

500 MHz