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TFF1013HN/N1,115

NXP Semiconductors

TFF1013HN/N1,115 by NXP Semiconductors

TFF1013HN/N1,115 by NXP Semiconductors is an RF/microwave mixer designed for surface mount applications. It operates b/w -40 °C and 85 °C with a 5V power supply and features 16 terminals. Ideal for communication systems, it ensures reliable performance in various environments.

Median Price

$1.983

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.983

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-

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10

$1.983

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Vyrian

USA . 6,849 parts In-Stock

1+ parts

-

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6,849

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Digiode

USA . 2,680 parts In-Stock

1+ parts

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2,680

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Anansix

USA . 1,862 parts In-Stock

1+ parts

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1,862

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 169 parts In-Stock

1+ parts

$13.950

100+ parts

-

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169

$13.950

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One Stop Electronics

USA . 343 parts In-Stock

1+ parts

$36.000

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343

$36.000

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Component Stockers USA

USA . 648 parts In-Stock

1+ parts

$99.990

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648

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 7,567 parts In-Stock

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7,567

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UNI Independent Distributors

Spain . 3,223 parts In-Stock

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3,223

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Corphita

USA . 2,775 parts In-Stock

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2,775

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Overview

Unlock superior performance with the TFF1013HN/N1,115 RF/Microwave Mixer from NXP Semiconductors. Renowned for its quality, NXP combines cutting-edge technology with robust reliability, making this mixer ideal for a variety of applications from telecommunications to industrial systems. Enjoy enhanced efficiency and durability in extreme temperatures, all within a compact surface-mount design that simplifies integration. Elevate your projects with a trusted component that delivers exceptional value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making the mixer reliable for various applications.

Power Supplies (V): 5

Operating at a low voltage of 5V ensures energy efficiency and makes integration into low-power systems easier, enhancing the versatility of the mixer.

No. of Terminals: 16

The 16 terminals offer ample connectivity options for various configurations, facilitating easy incorporation into complex circuits.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures stable performance in high-temperature environments, making this mixer suitable for demanding applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this mixer can function reliably in extreme cold conditions, broadening its application range.

Mounting Feature: SURFACE MOUNT

The surface mount design allows for a compact footprint and simplifies assembly on PCBs, ideal for modern, space-constrained electronics.

Technical Specifications

RF/Microwave Mixers TFF1013HN/N1,115 attributes and parameters. Explore more RF/Microwave Mixers devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC16,.1X.14,20

Power Supplies (V):

5

Sub-Category:

RF/Microwave Mixers

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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