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Digital Transmission Support

Digital Transmission Support refers to the various tools and technologies used to ensure the efficient and reliable transmission of digital signals over communication networks. These tools and technologies are designed to address issues such as signal interference, transmission errors, and network congestion, which can degrade the quality and speed of digital transmission.

One important aspect of Digital Transmission Support is the use of error detection and correction techniques. These techniques involve adding redundancy to the transmitted data, allowing the receiver to detect and correct any errors that may occur during transmission. Error detection and correction techniques are commonly used in communication protocols such as TCP/IP and Ethernet, and can help to ensure reliable data transmission even in the presence of noise or other transmission errors.

Another important aspect of Digital Transmission Support is the use of network congestion control techniques. These techniques are designed to prevent network congestion, which can occur when too many data packets are transmitted simultaneously, leading to delays and dropped packets. Network congestion control techniques include methods such as packet queuing, traffic shaping, and flow control, which help to regulate the flow of data over the network and prevent congestion.

Digital Transmission Support also includes technologies such as encryption and compression, which are used to protect data privacy and reduce transmission bandwidth. Encryption involves encoding data in such a way that it can only be decoded by authorized parties, while compression involves reducing the size of data by removing redundant or unnecessary information.

Digital Transmission Support

Available Parts 21

Part RoHS Manufacturer Description Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Carrier Type-2 Carrier Type-1 Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length
ZL30136GGG2 by Microchip Technology

ZL30136GGG2

Microchip Technology

ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE;

ELASTIC BUFFER

INDUSTRIAL

BALL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

1

153 mA

1.8 V

1.8,3.3

GRID ARRAY

BGA64,8X8,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

1.72 mm

9 mm

Not Qualified

ALSO REQUIRED 3.3V SUPPLY

e1

9 mm

MT9041BP1 by Microchip Technology

MT9041BP1

Microchip Technology

ELASTIC BUFFER; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;

ELASTIC BUFFER

MATTE TIN

3

e3

DS2176QN/T&R by Maxim Integrated

DS2176QN/T&R

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

ELASTIC BUFFER

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

2.048 Mbps

S-PQCC-J28

1

4.57 mm

T-1(DS1)

CEPT PCM-30/E-1

11.505 mm

Not Qualified

e0

11.505 mm

DS2175SN+T&R by Maxim Integrated

DS2175SN+T&R

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.016 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e3

10.3 mm

DS2176Q/T&R by Maxim Integrated

DS2176Q/T&R

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

ELASTIC BUFFER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

2.048 Mbps

S-PQCC-J28

1

4.57 mm

T-1(DS1)

CEPT PCM-30/E-1

11.505 mm

Not Qualified

e0

11.505 mm

DS2175SN/T&R by Maxim Integrated

DS2175SN/T&R

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.016 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e0

10.3 mm

DS2175SN by Maxim Integrated

DS2175SN

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.016 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e0

10.3 mm

DS2176QN by Maxim Integrated

DS2176QN

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

ELASTIC BUFFER

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

2.048 Mbps

S-PQCC-J28

1

4.57 mm

T-1(DS1)

CEPT PCM-30/E-1

11.505 mm

Not Qualified

e0

11.505 mm

DS2175S/T&R by Maxim Integrated

DS2175S/T&R

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.016 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e0

10.3 mm

DS2175+ by Maxim Integrated

DS2175+

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.016 mA

5 V

5

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDIP-T16

1

4.572 mm

7.62 mm

Not Qualified

e3

30

260

19.175 mm

DS2176 by Maxim Integrated

DS2176

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.01 mA

5 V

5

IN-LINE

DIP24,.3

Digital Transmission Interfaces

2.54 mm

70 Cel

0 Cel

TIN LEAD

DUAL

2.048 Mbps

R-PDIP-T24

1

4.572 mm

T-1(DS1)

CEPT PCM-30/E-1

7.62 mm

Not Qualified

e0

245

30.545 mm

DS2175SN+ by Maxim Integrated

DS2175SN+

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.016 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e3

30

260

10.3 mm

DS2176Q+ by Maxim Integrated

DS2176Q+

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

ELASTIC BUFFER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-J28

1

4.57 mm

11.5062 mm

Not Qualified

e3

245

11.5062 mm

DS2175S+ by Maxim Integrated

DS2175S+

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.016 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e3

30

260

10.3 mm

DS2176N by Maxim Integrated

DS2176N

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.01 mA

5 V

5

IN-LINE

DIP24,.3

Digital Transmission Interfaces

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

2.048 Mbps

R-PDIP-T24

1

4.572 mm

T-1(DS1)

CEPT PCM-30/E-1

7.62 mm

Not Qualified

e0

245

30.545 mm

DS2175S+T&R by Maxim Integrated

DS2175S+T&R

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.016 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e3

30

260

10.3 mm

DS2176+ by Maxim Integrated

DS2176+

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.01 mA

5 V

5

IN-LINE

DIP24,.3

Digital Transmission Interfaces

2.54 mm

70 Cel

0 Cel

MATTE TIN

DUAL

2.048 Mbps

R-PDIP-T24

1

4.572 mm

T-1(DS1)

CEPT PCM-30/E-1

7.62 mm

Not Qualified

e3

30

260

30.545 mm

DS2175 by Maxim Integrated

DS2175

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.016 mA

5 V

5

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDIP-T16

1

4.572 mm

7.62 mm

Not Qualified

e0

19.175 mm

DS2176Q by Maxim Integrated

DS2176Q

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

ELASTIC BUFFER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

2.048 Mbps

S-PQCC-J28

1

4.57 mm

T-1(DS1)

CEPT PCM-30/E-1

11.505 mm

Not Qualified

e0

11.505 mm

DS2175S by Maxim Integrated

DS2175S

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.016 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Not Qualified

e0

10.3 mm

DS2175N by Maxim Integrated

DS2175N

Maxim Integrated

ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

ELASTIC BUFFER

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.016 mA

5 V

5

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T16

1

4.572 mm

7.62 mm

Not Qualified

e0

19.175 mm