Loading...

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.

Digital Transmission Controllers

Available Parts 505

Part RoHS Manufacturer Description Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Maximum Supply Current Nominal Supply Voltage Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Output High Voltage Maximum Output Low Voltage Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Reference Point Moisture Sensitivity Level (MSL) Maximum Seated Height Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length
PEF22554HTV31SLL6Z by Intel

PEF22554HTV31SLL6Z

Intel

FRAMER;

FRAMER

DS2141AQ+ by Maxim Integrated

DS2141AQ+

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

FRAMER

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-J44

3

4.57 mm

16.585 mm

Not Qualified

e3

30

260

16.585 mm

DS2141AQ by Maxim Integrated

DS2141AQ

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

FRAMER

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Digital Transmission Controllers

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQCC-J44

3

4.57 mm

16.585 mm

Not Qualified

e0

16.585 mm

PEF22554HTV31 by Intel

PEF22554HTV31

Intel

FRAMER;

FRAMER

MT9076BB1 by Microchip Technology

MT9076BB1

Microchip Technology

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G80

1.6 mm

14 mm

Not Qualified

e3

14 mm

DS2155L by Maxim Integrated

DS2155L

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

FRAMER

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

BGA100,10X10,32

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G100

3

1.6 mm

T-1(DS1)

CEPT PCM-30/E-1

14 mm

Not Qualified

e0

14 mm

DS2155L+ by Maxim Integrated

DS2155L+

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

FRAMER

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

BGA100,10X10,32

Other Telecom ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

T-1(DS1)

CEPT PCM-30/E-1

14 mm

Not Qualified

e3

30

260

14 mm

DS2155LN by Maxim Integrated

DS2155LN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

BGA100,10X10,32

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G100

3

1.6 mm

T-1(DS1)

CEPT PCM-30/E-1

14 mm

Not Qualified

e0

14 mm

DS2155LN+ by Maxim Integrated

DS2155LN+

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

BGA100,10X10,32

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

T-1(DS1)

CEPT PCM-30/E-1

14 mm

Not Qualified

e3

30

260

14 mm

82V2108PXG8 by Renesas Electronics

82V2108PXG8

Renesas Electronics

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

FRAMER

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, FINE PITCH

QFP128,.67X.93,20

Digital Transmission Controllers

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3.4 mm

14 mm

Not Qualified

e3

20 mm

DS2143Q by Maxim Integrated

DS2143Q

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

FRAMER

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQCC-J44

3

4.57 mm

CEPT PCM-30/E-1

16.585 mm

Not Qualified

e0

245

16.585 mm

DS2143Q+ by Maxim Integrated

DS2143Q+

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

FRAMER

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

CHIP CARRIER

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-J44

3

4.57 mm

16.585 mm

Not Qualified

e3

30

260

16.585 mm

IDT82V2108PXG8 by Renesas Electronics

IDT82V2108PXG8

Renesas Electronics

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

FRAMER

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, FINE PITCH

QFP128,.67X.93,20

Digital Transmission Controllers

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3.4 mm

14 mm

Not Qualified

e3

20 mm

DS3112N by Maxim Integrated

DS3112N

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

GRID ARRAY

BGA256,20X20,50

Digital Transmission Controllers

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

3

2.34 mm

27 mm

Not Qualified

e0

27 mm

DS3112N+ by Maxim Integrated

DS3112N+

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

GRID ARRAY

BGA256,20X20,50

Digital Transmission Controllers

1.27 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B256

3

2.34 mm

27 mm

Not Qualified

e3

27 mm

DS2155LNC2+ by Analog Devices

DS2155LNC2+

Analog Devices

FRAMER;

FRAMER

DS3112+ by Maxim Integrated

DS3112+

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FRAMER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

GRID ARRAY

BGA256,20X20,50

Digital Transmission Controllers

1.27 mm

70 Cel

0 Cel

MATTE TIN

BOTTOM

S-PBGA-B256

3

2.34 mm

27 mm

Not Qualified

e3

27 mm

DS3112 by Maxim Integrated

DS3112

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FRAMER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

GRID ARRAY

BGA256,20X20,50

Digital Transmission Controllers

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

3

2.34 mm

27 mm

Not Qualified

e0

27 mm

DS3112DK by Analog Devices

DS3112DK

Analog Devices

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FRAMER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

2.34 mm

27 mm

Not Qualified

e0

27 mm

DS21458N+ by Maxim Integrated

DS21458N+

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B256

3

1.5 mm

17 mm

Not Qualified

e3

17 mm

DS21458N by Maxim Integrated

DS21458N

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

256

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

3.3

GRID ARRAY, LOW PROFILE

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

3

1.5 mm

17 mm

Not Qualified

e0

17 mm

PEF2256HV2XSLL76 by Intel

PEF2256HV2XSLL76

Intel

FRAMER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: UNSPECIFIED; No. of Functions: 1;

FRAMER

GULL WING

80

QFP

UNSPECIFIED

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

X-PQFP-G80

NOT SPECIFIED

NOT SPECIFIED

PM4351-RGI by Microchip Technology

PM4351-RGI

Microchip Technology

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: BGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

81

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B81

e3

TP3404V by Texas Instruments

TP3404V

Texas Instruments

TIME SLOT ASSIGNER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

TIME SLOT ASSIGNER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

BASIC

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

70 Cel

2.4 V

.4 V

0 Cel

TIN LEAD

QUAD

.144 Mbps

S-PQCC-J28

U

2A

4.57 mm

11.43 mm

Not Qualified

1 Amp

e0

245

11.43 mm

TP3404V/NOPB by Texas Instruments

TP3404V/NOPB

Texas Instruments

TIME SLOT ASSIGNER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

TIME SLOT ASSIGNER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

BASIC

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

70 Cel

2.4 V

.4 V

0 Cel

MATTE TIN

QUAD

.144 Mbps

S-PQCC-J28

U

3

4.57 mm

11.43 mm

Not Qualified

1 Amp

e3

30

245

11.43 mm

TP3404V/63SN by Texas Instruments

TP3404V/63SN

Texas Instruments

TIME SLOT ASSIGNER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

TIME SLOT ASSIGNER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5 V

5

BASIC

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

70 Cel

2.4 V

.4 V

0 Cel

MATTE TIN

QUAD

.144 Mbps

S-PQCC-J28

U

2A

Not Qualified

1 Amp

e3

30

245

DS2155GN+ by Analog Devices

DS2155GN+

Analog Devices

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B100

10 mm

Not Qualified

e1

10 mm

DS2155G/T by Analog Devices

DS2155G/T

Analog Devices

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

FRAMER

COMMERCIAL

BALL

100

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, FINE PITCH

.8 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B100

10 mm

Not Qualified

e0

10 mm

DS34S104GN+ by Analog Devices

DS34S104GN+

Analog Devices

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.28 mA

1.8 V

1.8/3.3

GRID ARRAY

BGA256,16X16,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.76 mm

17 mm

Not Qualified

e1

30

260

17 mm

DS34T102GN+ by Analog Devices

DS34T102GN+

Analog Devices

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.55 mA

1.8 V

1.8/3.3

GRID ARRAY

BGA484,22X22,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B484

3

2.41 mm

23 mm

Not Qualified

e1

30

260

23 mm

DS21Q58L-W+ by Analog Devices

DS21Q58L-W+

Analog Devices

FRAMER;

FRAMER

DS26514GN+ by Analog Devices

DS26514GN+

Analog Devices

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.25 mA

1.8 V

1.8,3.3

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.76 mm

T-1(DS1)

CEPT PCM-30/E-1

17 mm

Not Qualified

e1

30

260

17 mm

DS2155GNC2+T&R by Analog Devices

DS2155GNC2+T&R

Analog Devices

FRAMER;

FRAMER

DS26503LN+GSW by Analog Devices

DS26503LN+GSW

Analog Devices

FRAMER;

FRAMER

DS2151QB/T&R/C01 by Analog Devices

DS2151QB/T&R/C01

Analog Devices

FRAMER;

FRAMER

DS21Q59LN+ by Analog Devices

DS21Q59LN+

Analog Devices

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

30

260

14 mm

DS2155GN-W by Analog Devices

DS2155GN-W

Analog Devices

FRAMER;

FRAMER

DS2180AQN/T&R/C02 by Analog Devices

DS2180AQN/T&R/C02

Analog Devices

FRAMER;

FRAMER

DS2151QNB/T&R/C02 by Analog Devices

DS2151QNB/T&R/C02

Analog Devices

FRAMER;

FRAMER

DS21458DK by Analog Devices

DS21458DK

Analog Devices

FRAMER;

FRAMER

DS34S132GNA2+ by Analog Devices

DS34S132GNA2+

Analog Devices

FRAMER; Temperature Grade: INDUSTRIAL; Package Code: BGA; Length: 27 mm; Minimum Operating Temperature: -40 Cel; Maximum Seated Height: 2.41 mm;

FRAMER

INDUSTRIAL

BGA

1

3.3 V

1 mm

85 Cel

-40 Cel

3

2.41 mm

27 mm

27 mm

DS2181AQ/T&R/C03 by Analog Devices

DS2181AQ/T&R/C03

Analog Devices

FRAMER;

FRAMER

DS2151QNB-W by Analog Devices

DS2151QNB-W

Analog Devices

FRAMER;

FRAMER

DS26518GN by Analog Devices

DS26518GN

Analog Devices

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.45 mA

1.8 V

1.8,3.3

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

3

1.76 mm

T-1(DS1)

CEPT PCM-30/E-1

17 mm

Not Qualified

245

17 mm

DS34T108GN+ by Analog Devices

DS34T108GN+

Analog Devices

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FRAMER

INDUSTRIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.55 mA

1.8 V

1.8/3.3

GRID ARRAY

BGA484,22X22,40

Digital Transmission Interfaces

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B484

3

2.41 mm

23 mm

Not Qualified

e1

30

260

23 mm

DS2153Q-A7/T&R/C01 by Analog Devices

DS2153Q-A7/T&R/C01

Analog Devices

FRAMER;

FRAMER

DS26518GNB1+ by Analog Devices

DS26518GNB1+

Analog Devices

FRAMER;

FRAMER

DS2151QB-C07/T&R by Analog Devices

DS2151QB-C07/T&R

Analog Devices

FRAMER;

FRAMER