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DS34S108GN

Maxim Integrated

DS34S108GN by Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,641 parts In-Stock

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Digiode

USA . 752 parts In-Stock

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Anansix

USA . 516 parts In-Stock

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Northwest PG Solutions

USA . 2,189 parts In-Stock

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$2.585

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MARBEL Systems

Belgium . 75 parts In-Stock

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$8.529

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Texas Native Microelectronics

USA . 24,400 parts In-Stock

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$9.803

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$9.411

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$9.117

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$8.627

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$9.803

$9.411

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$8.627

AZTECH Wire

Italy . 723 parts In-Stock

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$10.430

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Kenton Components

USA . 1,792 parts In-Stock

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$11.764

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$10.352

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Qasali Group International

UK . 4,187 parts In-Stock

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$26.468

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$24.615

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$23.292

4,187

$26.468

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$23.292

Semicontronic

India . 1,230 parts In-Stock

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$146.000

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$142.350

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$141.620

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One Stop Electronics

USA . 1,107 parts In-Stock

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$404.000

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Glotronic Ltd.

UK . 4,100 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Corphita

USA . 2,326 parts In-Stock

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Native Components

USA . 897 parts In-Stock

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$2.279

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Vigor

Singapore . 490 parts In-Stock

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Microchip USA

USA . 294 parts In-Stock

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Component Stockers USA

USA . 207 parts In-Stock

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Technical Specifications

Digital Transmission Controllers DS34S108GN attributes and parameters. Explore more Digital Transmission Controllers devices from Maxim Integrated

Specs

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e0

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

484

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.41 mm

Sub-Category:

Digital Transmission Interfaces

Maximum Supply Current:

.28 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

DS34S108GN Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Maxim Integrated

Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.

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Management team

President & CEO

Tunc Doluca

Senior VP & CFO

Brian C. White

Senior VP, Technology & Manufacturing Group

Vivek Jain

Manufacturer fab locations 3

Fab name Location Fab Initiation Wafer Capacity

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Fabrication

Fab Initiation

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Philippines

Cavite

Wafer Capacity

489,000

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489,000

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Fabrication

Fab Initiation

-

USA

Beaverton

Wafer Capacity

312,000

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312,000

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Fabrication

Fab Initiation

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Thailand

Chon Buri

Wafer Capacity

194,000

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194,000

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