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Modems

A modem, short for modulator-demodulator, is a device used to convert digital signals into analog signals for transmission over telephone lines or other analog communication channels. Modems can also receive and decode analog signals and convert them back into digital signals. They are used to provide internet connectivity, transmit data over long distances, and connect to remote devices.

Modems use a technique called modulation to convert digital signals into analog signals that can be transmitted over an analog communication channel. This involves changing the amplitude, frequency, or phase of the signal in response to the digital data being transmitted. At the receiving end, the modem uses a technique called demodulation to convert the analog signal back into a digital signal that can be processed by the receiving device.

Modems also use various modulation and demodulation techniques to ensure reliable and efficient transmission of data. These techniques include phase-shift keying (PSK), quadrature amplitude modulation (QAM), and frequency-shift keying (FSK), among others. The choice of modulation technique depends on the specific application and the characteristics of the communication channel being used.

There are several types of modems, including dial-up modems, cable modems, DSL modems, and wireless modems. Dial-up modems are the oldest type of modem and use the telephone network to transmit data at relatively slow speeds. Cable modems and DSL modems are used to provide high-speed internet connectivity over cable and phone lines, respectively. Wireless modems, also known as cellular modems, use wireless communication protocols to provide internet connectivity over cellular networks.

Modems are an essential technology for modern communication systems, enabling the transmission of data over a variety of communication channels and protocols. As the technology continues to evolve, we can expect to see even more advanced and innovative modems in the future.

Modems

Available Parts 486

Part RoHS Manufacturer Description Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Fax Rate Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length
AD5700-1ACPZ-RL7 by Analog Devices

AD5700-1ACPZ-RL7

Analog Devices

MODEM; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC24,.16SQ,20;

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

3

.8 mm

4 mm

30

260

4 mm

TDA5051AT/C1,518 by NXP Semiconductors

TDA5051AT/C1,518

NXP Semiconductors

MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

MODEM

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

.068 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Modems

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G16

3

Not Qualified

260

A5191HRTLG-XTD by Onsemi

A5191HRTLG-XTD

Onsemi

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.0012 Mbps

S-PQFP-G32

3

1.6 mm

7 mm

Not Qualified

e3

30

260

7 mm

DS8500-JND+TR by Analog Devices

DS8500-JND+TR

Analog Devices

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE;

MODEM

INDUSTRIAL

NO LEAD

20

QCCN

SQUARE

PLASTIC/EPOXY

YES

.000285 mA

3/3.3

CHIP CARRIER

LCC20,.20SQ,25

Modems

.635 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-N20

1

Not Qualified

e3

DS8500-JND+ by Analog Devices

DS8500-JND+

Analog Devices

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

MODEM

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.000285 mA

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

Modems

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

.0012 Mbps

S-XQCC-N20

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

AD5700-1BCPZ-R5 by Analog Devices

AD5700-1BCPZ-R5

Analog Devices

MODEM; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

4 mm

e3

30

260

4 mm

AD5700-1BCPZ-RL7 by Analog Devices

AD5700-1BCPZ-RL7

Analog Devices

MODEM; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

3

.8 mm

4 mm

30

260

4 mm

A5191HRTLG-XTP by Onsemi

A5191HRTLG-XTP

Onsemi

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;

MODEM

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.0012 Mbps

S-PQFP-G32

3

1.6 mm

7 mm

Not Qualified

e3

30

260

7 mm

AD5700BCPZ-R5 by Analog Devices

AD5700BCPZ-R5

Analog Devices

MODEM; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .8 mm;

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

4 mm

e3

260

4 mm

AD5700ACPZ-RL7 by Analog Devices

AD5700ACPZ-RL7

Analog Devices

MODEM; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

3

.8 mm

4 mm

30

260

4 mm

AD5700BCPZ-RL7 by Analog Devices

AD5700BCPZ-RL7

Analog Devices

MODEM; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;

MODEM

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

3

.8 mm

4 mm

30

260

4 mm

ST7540TR by STMicroelectronics

ST7540TR

STMicroelectronics

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: HTSSOP; Package Shape: RECTANGULAR;

MODEM

INDUSTRIAL

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BCDMOS

5 V

5,9

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Modems

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

.0048 Mbps

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e3

30

260

9.7 mm

ST7540 by STMicroelectronics

ST7540

STMicroelectronics

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: HTSSOP; Package Shape: RECTANGULAR;

MODEM

INDUSTRIAL

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BCDMOS

5 V

5,9

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Modems

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

.0048 Mbps

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e3

30

260

9.7 mm

XB3-C-A2-UT-001 by Digi International

XB3-C-A2-UT-001

Digi International

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Shape: RECTANGULAR; Data Rate: .375 Mbps;

MODEM

INDUSTRIAL

THROUGH-HOLE

20

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.375 Mbps

R-XXMA-T20

POWER REQUIREMENTS AVAILABLE AT 3.3VDC INPUT POWER

NOT SPECIFIED

NOT SPECIFIED

TDA5051AT/C1,512 by NXP Semiconductors

TDA5051AT/C1,512

NXP Semiconductors

MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

MODEM

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

.068 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Modems

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G16

3

Not Qualified

260

A5191HRTPG-XTD by Onsemi

A5191HRTPG-XTD

Onsemi

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

MODEM

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

CHIP CARRIER

LDCC28,.5SQ

Modems

1.27 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.0012 Mbps

S-PQCC-J28

3

4.572 mm

11.506 mm

Not Qualified

e3

30

260

11.506 mm

A5191HRTPG-XTP by Onsemi

A5191HRTPG-XTP

Onsemi

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

MODEM

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

CHIP CARRIER

LDCC28,.5SQ

Modems

1.27 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.0012 Mbps

S-PQCC-J28

3

4.572 mm

11.506 mm

Not Qualified

e3

30

260

11.506 mm

TDA5051AT/C1,118 by NXP Semiconductors

TDA5051AT/C1,118

NXP Semiconductors

MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

MODEM

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

68 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Modems

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G16

Not Qualified

CMX993WQ3 by Cml Microcircuits

CMX993WQ3

Cml Microcircuits

MODEM-MODULATOR; Power Supplies (V): 1.8/3.3,3.3; Qualification: Not Qualified;

MODEM-MODULATOR

1.8/3.3,3.3

Other Telecom ICs

Not Qualified

FX604D4 by Cml Microcircuits

FX604D4

Cml Microcircuits

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

MODEM

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0025 mA

5 V

3/5

SMALL OUTLINE

SOP16,.4

Modems

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

.0012 Mbps

R-PDSO-G16

2.67 mm

7.49 mm

Not Qualified

HALF DUPLEX

e3

40

260

10.26 mm

ST7538Q by STMicroelectronics

ST7538Q

STMicroelectronics

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;

MODEM

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

BCDMOS

5 V

5,9

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

Modems

.8 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.0048 Mbps

S-PQFP-G44

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

TDA5051AT/C1,112 by NXP Semiconductors

TDA5051AT/C1,112

NXP Semiconductors

MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

MODEM

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

68 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Modems

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G16

Not Qualified

TDA5051AT by NXP Semiconductors

TDA5051AT

NXP Semiconductors

MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

MODEM

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.068 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Modems

1.27 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

.0012 Mbps

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

DATA RATE MIN:600BPS

e4

10.3 mm

DAC8741HRGET by Texas Instruments

DAC8741HRGET

Texas Instruments

PROGRAMMABLE MODEM; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

PROGRAMMABLE MODEM

MILITARY

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.03125 Mbps

S-PQCC-N24

2

1 mm

4 mm

DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF

e4

30

260

4 mm

MPL360BT-I/Y8X by Microchip Technology

MPL360BT-I/Y8X

Microchip Technology

PROGRAMMABLE MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TFQFP; Package Shape: SQUARE;

PROGRAMMABLE MODEM

INDUSTRIAL

GULL WING

48

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE, FINE PITCH

TQFP48,.35SQ

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.2 mm

7 mm

7 mm

MAX79356ECM+T by Analog Devices

MAX79356ECM+T

Analog Devices

MODEM; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3;

MODEM

Matte Tin (Sn) - annealed

1

e3

30

260

A5191HRTNG-XTP by Onsemi

A5191HRTNG-XTP

Onsemi

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

MODEM

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Modems

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.0012 Mbps

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

CPC5620ATR by Littelfuse

CPC5620ATR

Littelfuse

MODEM-DATA/FAX/VOICE; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

MODEM-DATA/FAX/VOICE

TIN

3

e3

30

260

CPC5620A by Littelfuse

CPC5620A

Littelfuse

MODEM-DATA/FAX/VOICE; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN;

MODEM-DATA/FAX/VOICE

TIN

3

e3

30

260

TDA5051 by NXP Semiconductors

TDA5051

NXP Semiconductors

MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

MODEM

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

.0012 Mbps

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

DATA RATE MIN:600BPS

10.3 mm

TDA5051T by NXP Semiconductors

TDA5051T

NXP Semiconductors

MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

MODEM

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.068 mA

5 V

5

SMALL OUTLINE

SOP16,.4

Modems

1.27 mm

70 Cel

0 Cel

DUAL

.0012 Mbps

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

10.3 mm

DAC8741HRGER by Texas Instruments

DAC8741HRGER

Texas Instruments

PROGRAMMABLE MODEM; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

PROGRAMMABLE MODEM

MILITARY

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.03125 Mbps

S-PQCC-N24

2

1 mm

4 mm

e4

30

260

4 mm

DAC8740HRGET by Texas Instruments

DAC8740HRGET

Texas Instruments

PROGRAMMABLE MODEM; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

PROGRAMMABLE MODEM

MILITARY

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.15SQ,20

.5 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.03125 Mbps

S-PQCC-N24

2

1 mm

4 mm

DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF

e4

NOT SPECIFIED

260

4 mm

CPC5622ATR by Littelfuse

CPC5622ATR

Littelfuse

MODEM-DATA/FAX/VOICE; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3;

MODEM-DATA/FAX/VOICE

TIN

3

e3

30

260

MPL360B-I/SCB by Microchip Technology

MPL360B-I/SCB

Microchip Technology

PROGRAMMABLE MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

PROGRAMMABLE MODEM

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.25SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

6 mm

6 mm

MPL360B-I/Y8X by Microchip Technology

MPL360B-I/Y8X

Microchip Technology

PROGRAMMABLE MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TFQFP; Package Shape: SQUARE;

PROGRAMMABLE MODEM

INDUSTRIAL

GULL WING

48

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE, FINE PITCH

TQFP48,.35SQ

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.2 mm

7 mm

7 mm

TCM3105JE by Texas Instruments

TCM3105JE

Texas Instruments

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

MODEM

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

16 mA

5 V

5

IN-LINE

DIP16,.3

Modems

2.54 mm

85 Cel

-40 Cel

DUAL

R-GDIP-T16

5.08 mm

7.62 mm

Not Qualified

FULL DUPLEX

NOT SPECIFIED

NOT SPECIFIED

19.56 mm

CMX993Q3 by Cml Microcircuits

CMX993Q3

Cml Microcircuits

MODEM-MODULATOR; Qualification: Not Qualified; Power Supplies (V): 1.8/3.3,3.3;

MODEM-MODULATOR

1.8/3.3,3.3

Other Telecom ICs

Not Qualified

NCN5192MNRG by Onsemi

NCN5192MNRG

Onsemi

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

MODEM

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0006 mA

3.3 V

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Modems

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

73M2901CE-IGV/F by Analog Devices

73M2901CE-IGV/F

Analog Devices

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE;

MODEM

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

15.5 mA

3/3.3

FLATPACK

TQFP32,.35SQ,32

Modems

.8 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G32

Not Qualified

R9A06G037GNP#AA0 by Renesas Electronics

R9A06G037GNP#AA0

Renesas Electronics

MODEM; Moisture Sensitivity Level (MSL): 3;

MODEM

3

ST7538QTR by STMicroelectronics

ST7538QTR

STMicroelectronics

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;

MODEM

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

BCDMOS

5 V

5,9

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

Modems

.8 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.0048 Mbps

S-PQFP-G44

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

NCN5193MNTWG by Onsemi

NCN5193MNTWG

Onsemi

MODEM;

MODEM

MAX79356ECM+ by Analog Devices

MAX79356ECM+

Analog Devices

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LQFP; Package Shape: SQUARE;

MODEM

INDUSTRIAL

GULL WING

48

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

.2304 Mbps

S-PQFP-G48

1

1.6 mm

7 mm

e3

30

260

7 mm

20437-11 by Synaptics

20437-11

Synaptics

MODEM-DATA/FAX/VOICE; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

MODEM-DATA/FAX/VOICE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

2 mA

3.3 V

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

.8 mm

70 Cel

14.4 kbps

0 Cel

QUAD

.056 Mbps

S-PQFP-G32

1.6 mm

7 mm

7 mm

MPL460A-I/4LB by Microchip Technology

MPL460A-I/4LB

Microchip Technology

MODEM;

MODEM

MPL460AT-I/4LB by Microchip Technology

MPL460AT-I/4LB

Microchip Technology

MODEM;

MODEM

MSM7510GS-K by Lapis Semiconductor

MSM7510GS-K

Lapis Semiconductor

MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

MODEM

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

10 mA

3/5

SMALL OUTLINE

SOP24,.45

Modems

1.27 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0