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DAC8741HRGER

Texas Instruments

DAC8741HRGER by Texas Instruments

DAC8741HRGER by Texas Instruments is a programmable modem telecom IC with a data rate of 0.03125 Mbps. It operates in a temperature range of -55 to 125°C and has a package style of chip carrier with very thin profile. It is suitable for military applications due to its temperature grade and moisture sensitivity level.

Median Price

$6.578

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,728 parts In-Stock

1+ parts

$6.578

100+ parts

$5.363

1k+ parts

$3.575

10k+ parts

-

9,728

$6.578

$5.363

$3.575

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,897 parts In-Stock

1+ parts

$6.249

100+ parts

-

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1,897

$6.249

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Vyrian

USA . 4,299 parts In-Stock

1+ parts

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4,299

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Nova Conductors

Japan . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,608 parts In-Stock

1+ parts

$5.590

100+ parts

-

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9,608

$5.590

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Corphita

USA . 3,319 parts In-Stock

1+ parts

$5.920

100+ parts

-

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3,319

$5.920

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Corohmni

South Africa . 374 parts In-Stock

1+ parts

$7.848

100+ parts

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374

$7.848

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Semicontronic

India . 9,423 parts In-Stock

1+ parts

$12.170

100+ parts

$11.866

1k+ parts

$11.805

10k+ parts

-

9,423

$12.170

$11.866

$11.805

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Parana Technologies

USA . 147 parts In-Stock

1+ parts

$15.618

100+ parts

$1,450.342

1k+ parts

$14.056

10k+ parts

-

147

$15.618

$1,450.342

$14.056

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DigiPath Technology Company

USA . 2,307 parts In-Stock

1+ parts

$17.197

100+ parts

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2,307

$17.197

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ChromeModa Solutions

Germany . 2,698 parts In-Stock

1+ parts

$17.548

100+ parts

$14.389

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2,698

$17.548

$14.389

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IDEA Electronic Components Group

UK . 1,172 parts In-Stock

1+ parts

$17.548

100+ parts

$16.671

1k+ parts

$15.793

10k+ parts

-

1,172

$17.548

$16.671

$15.793

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AZTECH Wire

Italy . 552 parts In-Stock

1+ parts

$18.500

100+ parts

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552

$18.500

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A-Z Elektronik GmbH

Germany . 6,528 parts In-Stock

1+ parts

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6,528

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Continental Prestige Electronics

USA . 5,529 parts In-Stock

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5,529

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Alle Elektronik GmbH

Germany . 4,352 parts In-Stock

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4,352

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Argo Parts USA

USA . 1,619 parts In-Stock

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1,619

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Discover the DAC8741HRGER by Texas Instruments, a high-quality modem with endless possibilities. Manufactured by Texas Instruments, a leader in the industry, this modem offers unmatched reliability and performance. Whether you need to connect devices, transfer data, or enhance communication, the DAC8741HRGER has got you covered. With its advanced features and cutting-edge technology, it delivers exceptional value, benefits, and advantages to customers. Experience seamless connectivity, increased efficiency, and improved productivity with the DAC8741HRGER. Upgrade your communication capabilities today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material provides durability and protection for the modem, making it a reliable choice.

Surface Mount:

YES - With surface mount capability, the modem can be easily integrated into electronic devices, enhancing convenience and versatility.

Package Shape:

SQUARE - The square shape of the package allows for efficient use of space, making it suitable for compact designs.

No. of Terminals:

24 - The modem's 24 terminals enable seamless connectivity and compatibility with various devices, ensuring smooth data transmission.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - The modem's chip carrier style with heat sink/slug and thin profile design aids in effective heat dissipation and space optimization, making it an efficient choice for high-performance applications.

Maximum Operating Temperature:

125 °C - The modem's capability to operate at a maximum temperature of 125 °C ensures reliable performance even under demanding conditions.

Minimum Operating Temperature:

55 °C - The modem's ability to operate in extremely low temperatures (-55 °C) makes it suitable for use in various environments, including industrial and outdoor settings.

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) - The use of nickel, palladium, gold, and silver for terminal finish enhances conductivity and corrosion resistance, ensuring accurate signal transmission and longevity.

Terminal Position:

QUAD - The quad terminal position provides stable and secure connectivity, reducing the risk of signal loss or disconnections.

Maximum Seated Height:

1 mm - The modem's compact maximum seated height of 1 mm allows for easy integration into space-constrained devices, without compromising performance.

Width:

4 mm - The modem's compact width of 4 mm facilitates seamless installation in small electronic devices, enabling design flexibility.

Maximum Time At Peak Reflow Temperature (s):

30 - The modem's ability to withstand a maximum time of 30 seconds at peak reflow temperature ensures reliable soldering during manufacturing processes, contributing to the overall quality and longevity of the product.

Peak Reflow Temperature °C:

260 - The modem's peak reflow temperature of 260 °C allows for efficient soldering and assembly, ensuring optimal performance and reliability.

Length:

4 mm - The modem's compact length of 4 mm enables easy integration into space-constrained electronic designs, maximizing efficiency and versatility.

Temperature Grade:

MILITARY - The modem's temperature grade specified as "MILITARY" indicates its suitability for use in demanding conditions, such as military or aerospace applications, where extreme temperature variations may occur.

Terminal Form:

NO LEAD - The modem's no lead terminal form eliminates the use of potentially harmful lead-based materials, making it environmentally friendly and compliant with modern regulations.

Telecom IC Type:

PROGRAMMABLE MODEM - The modem being programmable allows for customization and adaptability to different communication protocols, making it suitable for a wide range of applications.

Terminal Pitch:

0.5 mm - The modem's terminal pitch of 0.5 mm ensures efficient and secure connectivity, enabling reliable data transmission and reducing signal interference.

Data Rate:

0.03125 Mbps - The modem's data rate of 0.03125 Mbps allows for fast and efficient data transfer, making it ideal for applications that require real-time communication.

Moisture Sensitivity Level (MSL):

2 - The modem's MSL 2 rating indicates its resistance to moisture, ensuring its reliability and performance even in humid or moist environments.

Technical Specifications

Modems DAC8741HRGER attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Data Rate:

.03125 Mbps

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

DAC8741HRGER Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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