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TCM3105NL

Texas Instruments

TCM3105NL by Texas Instruments

Texas Instruments' TCM3105NL modem operates at 5V with 16 terminals in a rectangular package. With a max temp of 70°C, it's ideal for commercial telecom applications. This CMOS technology device has a supply current of 12mA and terminal pitch of 2.54mm, making it suitable for various modem designs.

Median Price

$57.660

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,492 parts In-Stock

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$57.660

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$54.200

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$50.740

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$57.660

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DigiKey

USA . 6,492 parts In-Stock

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Bristol Electronics

USA . 861 parts In-Stock

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$50.616

100+ parts

$42.517

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$40.999

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861

$50.616

$42.517

$40.999

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Nova Conductors

Japan . 100 parts In-Stock

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$56.505

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$56.505

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Digiode

USA . 3,037 parts In-Stock

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$57.960

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Vyrian

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

USA . 861 parts In-Stock

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Vectronix, Inc

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LWI Electronics Inc

India . 128 parts In-Stock

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ComSIT Distribution GmbH

Germany . 125 parts In-Stock

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MRC Electronics

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Fibra_Brandt Electronic GMBH

Germany . 31 parts In-Stock

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PC Components Company LLC

USA . 10 parts In-Stock

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Standard Data Resources

USA . 8 parts In-Stock

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R&J Components

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Lantek

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Extreme Components

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Inventory MP

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Manoshevitz Elec. Sales

Israel . 3 parts In-Stock

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Zilex Electronics Inc.

Canada . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 908 parts In-Stock

1+ parts

$7.132

100+ parts

$662.357

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$6.419

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908

$7.132

$662.357

$6.419

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DigiPath Technology Company

USA . 1,054 parts In-Stock

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$7.854

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$7.854

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ChromeModa Solutions

Germany . 2,481 parts In-Stock

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$8.014

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$6.571

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IDEA Electronic Components Group

UK . 785 parts In-Stock

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$8.014

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$7.213

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Corphita

USA . 97 parts In-Stock

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$54.909

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Ampacity Inc.

Singapore . 6,258 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,888 parts In-Stock

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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Assy Fe

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Authorized Procurement Solutions

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Netroflash

USA . 2,000 parts In-Stock

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$55.375

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$53.680

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$52.550

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$53.680

$52.550

A-Z Elektronik GmbH

Germany . 1,133 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 19 parts In-Stock

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GreenTree Electronics

Israel . 5 parts In-Stock

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Standard Data Resources (Excess)

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A-Plus Industry Inc.

USA . 1 parts In-Stock

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Overview

Enhance your communications with the TCM3105NL by Texas Instruments, a top-quality modem designed for reliability and performance. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this modem ensures seamless connectivity for a wide range of applications. Whether you're looking to upgrade your home network or enhance your industrial automation systems, the TCM3105NL offers unmatched value, benefits, and advantages that will exceed your expectations. Trust Texas Instruments to deliver cutting-edge technology that empowers you to stay connected with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the modem lightweight and durable, ideal for long-term use and easy handling.

Power Supplies (V): 5

Operating at a power supply of 5V ensures compatibility with standard power sources, making it versatile for various setups.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity and compatibility with a variety of devices and systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this modem can withstand higher temperatures without risk of overheating or malfunctioning.

Width: 7.62 mm

The compact width of 7.62mm makes this modem space-efficient and suitable for installations with limited room for components.

Technical Specifications

Modems TCM3105NL attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

JESD-30 Code:

R-PDIP-T16

Length:

19.304 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Modems

Maximum Supply Current:

12 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM3105NL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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