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TCM3105NE

Texas Instruments

TCM3105NE by Texas Instruments

TCM3105NE by Texas Instruments is a 16-terminal modem IC with 5V supply voltage. It operates in industrial temperature range (-40 to 85°C) and draws max 16mA current. Suitable for telecom applications, it features CMOS technology and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,447 parts In-Stock

1+ parts

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7,447

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Digiode

USA . 4,818 parts In-Stock

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4,818

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 800 parts In-Stock

1+ parts

$7.160

100+ parts

-

1k+ parts

$7.669

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800

$7.160

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$7.669

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DigiPath Technology Company

USA . 664 parts In-Stock

1+ parts

$7.884

100+ parts

$7.253

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664

$7.884

$7.253

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ChromeModa Solutions

Germany . 6,300 parts In-Stock

1+ parts

$8.045

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$6.597

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6,300

$8.045

$6.597

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IDEA Electronic Components Group

UK . 2,350 parts In-Stock

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$8.045

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$7.240

10k+ parts

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2,350

$8.045

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$7.240

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AZTECH Wire

Italy . 821 parts In-Stock

1+ parts

$17.525

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821

$17.525

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One Stop Electronics

USA . 729 parts In-Stock

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$50.000

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729

$50.000

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Ampacity Inc.

Singapore . 440 parts In-Stock

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$295.000

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440

$295.000

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Corphita

USA . 4,194 parts In-Stock

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4,194

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Upgrade your communication systems with the TCM3105NE by Texas Instruments, a top-quality modem that delivers reliable performance in industrial applications. With Texas Instruments' reputation for excellence, you can trust that this modem will exceed your expectations. Whether you need to transmit data efficiently or enhance your network connectivity, the TCM3105NE offers unmatched value and benefits. Say goodbye to communication challenges and hello to seamless connectivity with this cutting-edge modem.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is lightweight and durable, making the modem easy to handle and less prone to damage during use.

Power Supplies (V): 5

Operating at a power supply of 5V makes the modem energy efficient and compatible with standard power sources.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this modem can perform reliably even under high-temperature conditions.

Technology: CMOS

Utilizing CMOS technology ensures efficient power consumption and high performance, making this modem a reliable and cost-effective choice.

Technical Specifications

Modems TCM3105NE attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

JESD-30 Code:

R-PDIP-T16

Length:

19.304 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Modems

Maximum Supply Current:

16 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM3105NE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-493-7445, 5962014937445

NIIN

014937445

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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