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12197-507-XTD

Onsemi

12197-507-XTD by Onsemi

12197-507-XTD by Onsemi is a modem IC with 32 terminals, CMOS technology, and 3.3V supply voltage. It operates b/w -40 to 85 °C and has a data rate of 0.0012 Mbps. Ideal for industrial telecom applications due to its low profile flatpack design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,327 parts In-Stock

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Digiode

USA . 1,774 parts In-Stock

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Native Components

USA . 785 parts In-Stock

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$1.056

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Northwest PG Solutions

USA . 829 parts In-Stock

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Problanco Electronics

Mexico . 6,205 parts In-Stock

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TANS Electronics

Latvia . 4,106 parts In-Stock

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SupplyDigital Components

Austria . 2,976 parts In-Stock

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Kulean Microsystems

USA . 1,167 parts In-Stock

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UHIMA Technologies

Türkiye . 539 parts In-Stock

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Corohmni

South Africa . 410 parts In-Stock

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Corphita

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Overview

Looking for a reliable modem for your industrial applications? Look no further than the 12197-507-XTD by Onsemi. With a focus on quality and cutting-edge technology, Onsemi delivers top-notch modems that ensure seamless connectivity and reliable performance. Whether you're in telecommunications, networking, or IoT, this modem offers unmatched value with its industrial-grade construction, high-speed data rates, and low profile design. Trust Onsemi to keep you connected and ahead of the game!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making the modem easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the modem onto circuit boards.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

No. of Terminals: 32

Having 32 terminals provides a good amount of connectivity options for various components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile package style saves space and allows for more compact design of the overall system.

Maximum Operating Temperature: 85 °C

Operating at high temperatures ensures reliability and performance in various environments.

Minimum Operating Temperature: -40 °C

Operating at low temperatures ensures reliability and performance in various environments.

Terminal Position: QUAD

Quad terminal position allows for efficient connectivity and signal routing within the modem.

Maximum Seated Height: 1.6 mm

Low seated height allows for a compact and space-saving design.

Width: 7 mm

Narrow width allows for easy integration into existing systems or circuit boards.

Length: 7 mm

Compact length saves space and allows for more flexible placement within a system.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability in harsh industrial environments.

Technology: CMOS

CMOS technology enables low power consumption and high-speed operation in the modem.

Terminal Form: GULL WING

Gull wing terminals provide reliable connectivity and easy soldering onto circuit boards.

Telecom IC Type: MODEM

Specifically designed as a modem for telecom applications, ensuring compatibility and performance.

Nominal Supply Voltage: 3.3 V

Stable supply voltage of 3.3V ensures consistent and reliable operation of the modem.

Terminal Pitch: 0.8 mm

0.8mm terminal pitch allows for compact design and efficient signal routing within the modem.

Data Rate: 0.0012 Mbps

Data rate of 0.0012 Mbps provides sufficient bandwidth for communication needs in various applications.

Technical Specifications

Modems 12197-507-XTD attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

12197-507-XTD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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