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73K224L-32IH

Texas Instruments

73K224L-32IH by Texas Instruments

The Texas Instruments 73K224L-32IH is a modem IC with 32 terminals in a chip carrier package. It operates b/w -40 to 85°C, supporting data rates up to 0.0024 Mbps. Ideal for industrial telecom applications due to its compact size and J bend terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,496 parts In-Stock

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4,496

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Vyrian

USA . 2,293 parts In-Stock

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2,293

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Mil-Aero Solutions, Inc.

USA . 372 parts In-Stock

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372

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ACDS - Activité Composants Distribution Service

France . 300 parts In-Stock

1+ parts

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300

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ABC Electronics Ltd.

UK . 300 parts In-Stock

1+ parts

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300

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ZD Integrated Circuits Inc.

USA . 145 parts In-Stock

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145

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Corel Iberica Componentes, S.L.

Spain . 107 parts In-Stock

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107

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ComSIT Distribution GmbH

Germany . 45 parts In-Stock

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45

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Standard Data Resources

USA . 14 parts In-Stock

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14

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Distributors (Availability)

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Native Components

USA . 369 parts In-Stock

1+ parts

$0.193

100+ parts

-

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$0.185

369

$0.193

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$0.185

Northwest PG Solutions

USA . 1,652 parts In-Stock

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$0.212

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$0.187

1,652

$0.212

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$0.187

Parana Technologies

USA . 315 parts In-Stock

1+ parts

$6.345

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$7.096

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315

$6.345

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$7.096

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DigiPath Technology Company

USA . 1,884 parts In-Stock

1+ parts

$6.986

100+ parts

$6.428

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1,884

$6.986

$6.428

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ChromeModa Solutions

Germany . 3,123 parts In-Stock

1+ parts

$7.129

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$5.846

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3,123

$7.129

$5.846

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IDEA Electronic Components Group

UK . 633 parts In-Stock

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$7.129

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$6.416

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633

$7.129

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$6.416

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AZTECH Wire

Italy . 887 parts In-Stock

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$9.680

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887

$9.680

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One Stop Electronics

USA . 1,228 parts In-Stock

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$298.000

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$298.000

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Corphita

USA . 3,961 parts In-Stock

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3,961

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Cyclops Electronics Ltd (Excess)

UK . 300 parts In-Stock

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300

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Glotronic Ltd.

UK . 240 parts In-Stock

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240

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Assy Fe

Spain . 107 parts In-Stock

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107

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Overview

Experience unparalleled connectivity with the 73K224L-32IH by Texas Instruments, a top-of-the-line modem designed to elevate your communication capabilities. Crafted with precision and expertise by a renowned manufacturer, this modem offers reliability and efficiency like no other. Perfect for a wide range of applications, this modem is a game-changer in the tech industry. Unlock the full potential of your devices with this high-quality product that guarantees seamless performance and unmatched value. Elevate your connectivity experience today with the 73K224L-32IH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for internal components, ensuring longevity and reliability of the modem.

Surface Mount: YES

Surface mount technology makes installation easier and more convenient, saving time and effort during setup.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices or systems, making it versatile and adaptable.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options and ensures compatibility with a wide range of devices or networks.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and space-efficient, making it ideal for applications where space is limited.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this modem can withstand high temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

The modem can also operate in extremely low temperatures down to -40°C, ensuring reliability in various environmental conditions.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 3.56 mm

Low seated height makes the modem compact and slim, ideal for applications where space is a premium.

Width: 11.455 mm

Narrow width of 11.455 mm makes the modem easy to fit into tight spaces or crowded PCB layouts.

Length: 13.995 mm

The length of 13.995 mm strikes a balance between compact size and required functionality, making it a versatile choice for various applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments with fluctuating temperatures.

Terminal Form: J BEND

J bend terminal form provides a secure and stable connection, reducing the risk of disconnection or signal loss.

Telecom IC Type: MODEM

Designed specifically for modem applications, ensuring optimized performance and compatibility with telecom networks.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes the modem compatible with standard power sources and easy to integrate into existing systems.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm allows for easy soldering and secure connections, ensuring stable performance and signal integrity.

Data Rate: 0.0024 Mbps

With a data rate of 0.0024 Mbps, this modem is suitable for low to moderate data transfer requirements, making it a cost-effective solution for various applications.

Technical Specifications

Modems 73K224L-32IH attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0024 Mbps

JESD-30 Code:

R-PQCC-J32

Length:

13.995 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.455 mm

Trade Compliance

73K224L-32IH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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