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73K221SL-IP

Texas Instruments

73K221SL-IP by Texas Instruments

73K221SL-IP by Texas Instruments is an industrial-grade modem IC with a data rate of 0.0012 Mbps. It features a rectangular package style, 22 terminals, and operates b/w -40°C to 85°C. Ideal for telecom applications requiring reliable data transmission in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,455 parts In-Stock

1+ parts

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5,455

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Digiode

USA . 1,949 parts In-Stock

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1,949

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,569 parts In-Stock

1+ parts

$11.307

100+ parts

-

1k+ parts

$11.740

10k+ parts

-

1,569

$11.307

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$11.740

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ChromeModa Solutions

Germany . 5,466 parts In-Stock

1+ parts

$12.704

100+ parts

$10.417

1k+ parts

-

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5,466

$12.704

$10.417

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IDEA Electronic Components Group

UK . 419 parts In-Stock

1+ parts

$12.704

100+ parts

$12.069

1k+ parts

$11.434

10k+ parts

-

419

$12.704

$12.069

$11.434

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AZTECH Wire

Italy . 767 parts In-Stock

1+ parts

$19.401

100+ parts

-

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767

$19.401

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Semicontronic

India . 1,611 parts In-Stock

1+ parts

$41.000

100+ parts

$39.975

1k+ parts

$39.770

10k+ parts

-

1,611

$41.000

$39.975

$39.770

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Ampacity Inc.

Singapore . 612 parts In-Stock

1+ parts

$518.000

100+ parts

-

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612

$518.000

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One Stop Electronics

USA . 1,130 parts In-Stock

1+ parts

$892.000

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1,130

$892.000

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DigiPath Technology Company

USA . 2,128 parts In-Stock

1+ parts

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100+ parts

$11.454

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2,128

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$11.454

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Northwest PG Solutions

USA . 1,363 parts In-Stock

1+ parts

-

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1,363

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Corphita

USA . 1,041 parts In-Stock

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1,041

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Native Components

USA . 272 parts In-Stock

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272

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Corohmni

South Africa . 172 parts In-Stock

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172

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Overview

Experience lightning-fast internet speeds with the 73K221SL-IP modem by Texas Instruments. Renowned for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in every product they create. Ideal for a wide range of applications, this modem offers seamless connectivity and unparalleled performance. Elevate your online experience with the 73K221SL-IP, providing unbeatable value and unmatched benefits to customers seeking top-of-the-line networking solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, ideal for portable or long-term use.

No. of Terminals: 22

Having 22 terminals allows for more connectivity options and flexibility in setting up the modem for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this modem can function reliably even in harsh environmental conditions.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common and convenient power requirement, making it compatible with many power sources.

Data Rate: 0.0012 Mbps

The data rate of 0.0012 Mbps indicates a decent speed for transmitting data over a network, suitable for various communication needs.

Technical Specifications

Modems 73K221SL-IP attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDIP-T22

Length:

27.686 mm

No. of Functions:

1

No. of Terminals:

22

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

73K221SL-IP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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