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73K222SL-IP

Texas Instruments

73K222SL-IP by Texas Instruments

73K222SL-IP by Texas Instruments is an industrial-grade modem IC with a data rate of 0.0012 Mbps. It operates b/w -40 to 85°C, has 22 terminals in an in-line package style, and requires a nominal voltage of 5V. Ideal for telecom applications requiring reliable communication within specified temperature ranges.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,205 parts In-Stock

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6,205

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Connector Distribution Corp

USA . 3,688 parts In-Stock

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3,688

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Right Parts Inc.

USA . 3,688 parts In-Stock

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3,688

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Prism Electronics

USA . 2,387 parts In-Stock

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Digiode

USA . 368 parts In-Stock

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368

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Distributors (Availability)

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Parana Technologies

USA . 1,701 parts In-Stock

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$5.646

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$6.442

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$5.646

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$6.442

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DigiPath Technology Company

USA . 102 parts In-Stock

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$6.217

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$5.720

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102

$6.217

$5.720

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ChromeModa Solutions

Germany . 5,009 parts In-Stock

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$6.344

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$5.202

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$6.344

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IDEA Electronic Components Group

UK . 460 parts In-Stock

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$6.344

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$5.710

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460

$6.344

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$5.710

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AZTECH Wire

Italy . 622 parts In-Stock

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$15.213

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622

$15.213

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One Stop Electronics

USA . 488 parts In-Stock

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$850.000

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488

$850.000

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Infinite Electronics LLP (Excess)

. 2,397 parts In-Stock

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2,397

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Northwest PG Solutions

USA . 2,239 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 698 parts In-Stock

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698

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Native Components

USA . 640 parts In-Stock

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640

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Perfect Parts

USA . 228 parts In-Stock

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228

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Kepictronics

USA . 80 parts In-Stock

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80

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Overview

Elevate your communication capabilities with the 73K222SL-IP by Texas Instruments. Crafted with precision and expertise, this modem offers exceptional quality and reliability for a wide range of applications. From industrial settings to consumer electronics, the Texas Instruments modem delivers unparalleled performance and value. Stay connected seamlessly with this cutting-edge technology that is designed to exceed expectations. Upgrade your communication systems today with the 73K222SL-IP and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, ensuring long-term reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this modem can withstand harsh environmental conditions without overheating.

Nominal Supply Voltage: 5 V

The low nominal supply voltage of 5 V makes this modem energy-efficient and suitable for various power sources.

Data Rate: 0.0012 Mbps

Although the data rate is low, this modem is ideal for basic internet browsing and email communication, making it a cost-effective option.

Technical Specifications

Modems 73K222SL-IP attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDIP-T22

Length:

27.686 mm

No. of Functions:

1

No. of Terminals:

22

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

73K222SL-IP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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