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73K224L-IG

Texas Instruments

73K224L-IG by Texas Instruments

73K224L-IG by Texas Instruments is a modem IC with data rate of 0.0024 Mbps. It operates in industrial temperature range (-40 to 85 °C) and has 52 terminals in a square package style. Ideal for telecom applications, it features gull wing terminal form and requires nominal voltage of 5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,908 parts In-Stock

1+ parts

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3,908

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Vyrian

USA . 3,515 parts In-Stock

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3,515

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,503 parts In-Stock

1+ parts

$13.244

100+ parts

$1,229.915

1k+ parts

$11.920

10k+ parts

-

1,503

$13.244

$1,229.915

$11.920

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DigiPath Technology Company

USA . 1,674 parts In-Stock

1+ parts

$14.583

100+ parts

-

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1,674

$14.583

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ChromeModa Solutions

Germany . 6,172 parts In-Stock

1+ parts

$14.881

100+ parts

$12.202

1k+ parts

-

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6,172

$14.881

$12.202

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IDEA Electronic Components Group

UK . 1,976 parts In-Stock

1+ parts

$14.881

100+ parts

$14.137

1k+ parts

$13.393

10k+ parts

-

1,976

$14.881

$14.137

$13.393

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AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$15.128

100+ parts

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506

$15.128

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One Stop Electronics

USA . 283 parts In-Stock

1+ parts

$354.000

100+ parts

-

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283

$354.000

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Corphita

USA . 2,271 parts In-Stock

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2,271

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Native Components

USA . 80 parts In-Stock

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80

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Northwest PG Solutions

USA . 57 parts In-Stock

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57

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Overview

Step into the future of communication with the Texas Instruments 73K224L-IG modem. Crafted with precision and expertise by one of the leading manufacturers in the industry, this modem offers unparalleled quality and reliability. Perfect for a wide range of applications, this modem provides seamless connectivity and high-speed data transmission. Experience the value and benefits that only Texas Instruments can deliver, and revolutionize your communication needs with the 73K224L-IG modem.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package for the modem, making it easy to handle and resistant to damage.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices or systems.

No. of Terminals: 52

Having 52 terminals provides ample connectivity options for the modem, allowing for seamless communication with other devices or networks.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this modem can function efficiently even in high-temperature environments.

Nominal Supply Voltage: 5 V

The 5V supply voltage is standard and widely available, ensuring compatibility and ease of use with various power sources.

Data Rate: 0.0024 Mbps

The data rate of 0.0024 Mbps indicates that this modem is capable of transmitting data at a decent speed, suitable for most communication needs.

Technical Specifications

Modems 73K224L-IG attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0024 Mbps

JESD-30 Code:

S-PQFP-G52

Length:

10 mm

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.43 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

73K224L-IG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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