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TDA5051AT/C1,118

NXP Semiconductors

TDA5051AT/C1,118 by NXP Semiconductors

TDA5051AT/C1,118 by NXP Semiconductors is a modem with a power supply of 5V and a max operating temperature of 70°C. It has 16 terminals in a small outline package shape and is commonly used in telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 3,434 parts In-Stock

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3,434

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Anansix

USA . 2,465 parts In-Stock

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Vyrian

USA . 179 parts In-Stock

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179

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Nova Conductors

Japan . 98 parts In-Stock

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98

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Aztec Data Supply Inc.

USA . 3,950 parts In-Stock

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$10.900

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3,950

$10.900

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AZTECH Wire

Italy . 760 parts In-Stock

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$14.637

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760

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Corohmni

South Africa . 695 parts In-Stock

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$15.461

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695

$15.461

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One Stop Electronics

USA . 240 parts In-Stock

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$485.000

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240

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Semicontronic

India . 856 parts In-Stock

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$534.000

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$520.650

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$517.980

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856

$534.000

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Ampacity Inc.

Singapore . 366 parts In-Stock

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$598.000

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366

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UNI Independent Distributors

Spain . 8,200 parts In-Stock

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Continental Prestige Electronics

USA . 4,207 parts In-Stock

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Argo Parts USA

USA . 3,979 parts In-Stock

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Corphita

USA . 1,801 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Discover the TDA5051AT/C1,118 by NXP Semiconductors, a cutting-edge modem that offers unparalleled quality and performance. As a trusted manufacturer in the semiconductor industry, NXP Semiconductors ensures reliability and innovation in every product they create. With its compact size and easy installation, this modem is perfect for various applications. Unlock seamless connectivity and faster data transmission with the TDA5051AT/C1,118. Experience the value, benefits, and advantages this exceptional product brings to your projects. Upgrade your communication capabilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability, making it a great choice for long-lasting performance.

Surface Mount: YES

With a surface mount option, this modem can easily be integrated into various electronic devices, providing convenience and flexibility in installations.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard circuit board designs, facilitating easy integration and reducing complexity during assembly.

Power Supplies (V): 5

With a 5V power supply, this modem ensures compatibility with a wide range of power sources, allowing for versatile and reliable usage across different applications.

No. of Terminals: 16

Having 16 terminals enables efficient connectivity options, allowing for seamless integration with other components and peripherals, enhancing the overall performance and functionality of the product.

Package Style (Meter): SMALL OUTLINE

Featuring a small outline package style, this modem is compact in size, making it suitable for space-constrained environments without compromising on performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this modem can withstand and operate reliably even in demanding conditions, ensuring optimal performance and durability.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C enables the modem to function in colder environments, making it adaptable for a wide range of operating conditions.

Terminal Position: DUAL

The dual terminal position provides versatility in connection options, allowing for convenient integration and customization depending on the specific requirements of the application.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this modem is built to meet the reliability and performance needs of commercial environments, making it a dependable choice.

Terminal Form: GULL WING

With a gull wing terminal form, this modem ensures secure and reliable soldering connections, contributing to overall product integrity and longevity.

Maximum Supply Current: 68 mA

Operating within a maximum supply current of 68 mA, this modem offers energy efficiency while delivering stable and consistent performance.

Telecom IC Type: MODEM

With a telecom IC type specifically designed for modems, this product ensures optimized performance and compatibility with various telecommunications systems, making it an ideal choice within the modem category.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides stable and consistent power to the modem, guaranteeing reliable and uninterrupted operation in a variety of applications.

Terminal Pitch: 1.27 mm

Featuring a terminal pitch of 1.27 mm, this modem allows for precise and secure connections, reducing the risk of signal loss or interference, ensuring reliable data transmission.

Technical Specifications

Modems TDA5051AT/C1,118 attributes and parameters. Explore more Modems devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Modems

Maximum Supply Current:

68 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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