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ST7546CFN

STMicroelectronics

ST7546CFN by STMicroelectronics

ST7546CFN by STMicroelectronics is a modem chip carrier with 28 terminals, operating at temperatures from 0 to 70 °C. It supports power supplies of 3.3/5,5V and uses CMOS technology. Ideal for commercial applications requiring surface mount square packages with tin/lead terminal finish.

Median Price

$6.272

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 28 parts In-Stock

1+ parts

$6.272

100+ parts

$3.136

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28

$6.272

$3.136

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Vyrian

USA . 1,492 parts In-Stock

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1,492

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Digiode

USA . 941 parts In-Stock

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941

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Anansix

USA . 217 parts In-Stock

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217

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Cyclops Electronics Ltd

UK . 213 parts In-Stock

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213

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Q Components

USA . 130 parts In-Stock

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130

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Microfarads

USA . 27 parts In-Stock

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27

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Prism Electronics

USA . 7 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,579 parts In-Stock

1+ parts

$8.158

100+ parts

-

1k+ parts

$7.342

10k+ parts

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1,579

$8.158

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$7.342

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MKK Technologies

India . 849 parts In-Stock

1+ parts

$15.340

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849

$15.340

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DigiPath Technology Company

USA . 849 parts In-Stock

1+ parts

$15.340

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849

$15.340

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A-Z Elektronik GmbH

Germany . 4,593 parts In-Stock

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4,593

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Kepictronics

USA . 2,036 parts In-Stock

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2,036

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Parana Technologies

USA . 1,763 parts In-Stock

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$9.754

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1,763

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$9.754

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Corphita

USA . 385 parts In-Stock

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385

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Perfect Parts

USA . 30 parts In-Stock

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30

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Overview

Unlock the power of seamless communication with the ST7546CFN modem by STMicroelectronics. Crafted with precision and innovation, this modem offers unparalleled reliability and performance. Perfect for a wide range of applications, this product is a game-changer in the field of electronics. Experience faster data transmission, enhanced connectivity, and superior quality with the ST7546CFN. Elevate your projects to new heights with this cutting-edge modem that guarantees value, efficiency, and satisfaction. Trust STMicroelectronics to deliver excellence in every aspect, making your technological endeavors a success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Having a package body made of plastic/epoxy makes the modem lightweight and durable, making it easy to handle and less prone to damage during transportation or installation.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing processes.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for applications where size is a constraint.

Power Supplies (V): 3.3/5,5

The modem supports multiple power supply options, providing flexibility in different operating environments and compatibility with various power sources.

No. of Terminals: 28

Having 28 terminals allows for a greater level of connectivity and functionality, enabling the modem to handle complex communication processes efficiently.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers high component density and excellent thermal conductivity, resulting in improved performance and reliability of the modem.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the modem can withstand high temperatures, making it suitable for use in challenging environments without overheating.

Minimum Operating Temperature: 0 °C

The modem can operate in temperatures as low as 0 °C, ensuring reliable performance even in cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides excellent conductivity and solderability, ensuring secure connections and reducing the risk of signal loss or interference.

Terminal Position: QUAD

The quad terminal position offers increased stability and mechanical strength, reducing the risk of damage to the terminals during handling or operation.

Temperature Grade: COMMERCIAL

Being designed for commercial grade applications, the modem offers reliable performance and durability in standard operating conditions, making it a cost-effective choice for businesses.

Technology: CMOS

Utilizing CMOS technology allows the modem to operate efficiently while consuming minimal power, resulting in improved energy efficiency and extended battery life.

Terminal Form: J BEND

The J bend terminal form provides easy insertion and removal during installation, making it convenient for technicians to work with the modem, saving time and effort.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, the modem offers precise and secure connections, reducing the risk of signal interference or loss due to poor contact.

Technical Specifications

Modems ST7546CFN attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Sub-Category:

Modems

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

ST7546CFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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