Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ST7546CFN by STMicroelectronics is a modem chip carrier with 28 terminals, operating at temperatures from 0 to 70 °C. It supports power supplies of 3.3/5,5V and uses CMOS technology. Ideal for commercial applications requiring surface mount square packages with tin/lead terminal finish.
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Perfect Parts
Having a package body made of plastic/epoxy makes the modem lightweight and durable, making it easy to handle and less prone to damage during transportation or installation.
Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing processes.
The square package shape is compact and space-efficient, making it suitable for applications where size is a constraint.
The modem supports multiple power supply options, providing flexibility in different operating environments and compatibility with various power sources.
Having 28 terminals allows for a greater level of connectivity and functionality, enabling the modem to handle complex communication processes efficiently.
The chip carrier package style offers high component density and excellent thermal conductivity, resulting in improved performance and reliability of the modem.
With a maximum operating temperature of 70 °C, the modem can withstand high temperatures, making it suitable for use in challenging environments without overheating.
The modem can operate in temperatures as low as 0 °C, ensuring reliable performance even in cold conditions.
The tin/lead terminal finish provides excellent conductivity and solderability, ensuring secure connections and reducing the risk of signal loss or interference.
The quad terminal position offers increased stability and mechanical strength, reducing the risk of damage to the terminals during handling or operation.
Being designed for commercial grade applications, the modem offers reliable performance and durability in standard operating conditions, making it a cost-effective choice for businesses.
Utilizing CMOS technology allows the modem to operate efficiently while consuming minimal power, resulting in improved energy efficiency and extended battery life.
The J bend terminal form provides easy insertion and removal during installation, making it convenient for technicians to work with the modem, saving time and effort.
With a terminal pitch of 1.27 mm, the modem offers precise and secure connections, reducing the risk of signal interference or loss due to poor contact.
Modems ST7546CFN attributes and parameters. Explore more Modems devices from STMicroelectronics
JESD-30 Code:
JESD-609 Code:
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Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Power Supplies (V):
Qualification:
Sub-Category:
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ST7546CFN Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
STM32F405RGT6
STMicroelectronics
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1552200253
Molex
WIRE AND CABLE;
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
Diodes Incorporated
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
Micro Commercial Components
Rochester Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-TP
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
2N2222A
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
SDR0604-101KL
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
SI21822-B60-GMR
Skyworks Solutions
MODEM-DEMODULATOR;
ST75C540FP-A
ST75C540FP-A by STMicroelectronics is a 80-terminal modem IC with 5V supply voltage, operating b/w 0-70 °C. It supports fax rate of 14.4 kbps and data rate of 0.0144 Mbps, making it ideal for data/fax/voice applications in telecom systems.
TDA5051AT/C1,518
NXP Semiconductors
NXP Semiconductors' TDA5051AT/C1,518 is a 16-terminal modem IC with 5V supply voltage. Operating b/w 0-70°C, it features CMOS technology and consumes 0.068mA max current. Ideal for telecom applications, this surface-mount device in small outline package suits commercial-grade temperature requirements.
MAX2395EGI-T
Maxim Integrated
MODEM-MODULATOR; JESD-609 Code: e0; Terminal Finish: TIN LEAD; Moisture Sensitivity Level (MSL): 1;
73K312L-32IH
Texas Instruments
The Texas Instruments 73K312L-32IH is a modem IC with 32 terminals in a rectangular chip carrier package. It operates at temperatures ranging from -40 to 85°C, suitable for industrial applications. With a data rate of 0.0012 Mbps and nominal voltage of 5V, it is ideal for telecom systems requiring low-speed data transmission.
CPC5621A
Littelfuse
MODEM-DATA/FAX/VOICE; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN;
TCM3101J
Texas Instruments TCM3101J modem features CMOS technology, 16 terminals in a ceramic rectangular package with in-line style. Operating temperature range from -10°C to 70°C makes it suitable for commercial telecom applications. Dual terminal position and 2.54mm pitch enhance connectivity and performance.
DS2245M-24
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: SIMM; Package Shape: RECTANGULAR;
TCM3105DWL
TCM3105DWL by Texas Instruments is a 24-terminal modem IC with 5V supply, operating b/w 0-70°C. It features CMOS technology, GULL WING terminals, and requires 12mA current. Ideal for telecom applications due to its small outline package and dual terminal position.
BCM3349IPBG
Broadcom
Modems;
AD28MSP01KR
Analog Devices
AD28MSP01KR by Analog Devices is a 28-terminal modem IC with 5V supply, operating from 0 to 70°C. It features GULL WING terminals in a SMALL OUTLINE package, suitable for telecom applications requiring MODEM-SUPPORT CIRCUIT.
AD5700-1BCPZ-R5
AD5700-1BCPZ-R5 by Analog Devices is a modem IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 125°C, with a peak reflow temperature of 260°C. Suitable for telecom applications, it has a nominal voltage of 2.7V and low profile at 0.8mm seated height.
73M2901CL-IH
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR;
73K222U-IH
73K222U-IH by Texas Instruments is a modem IC with data rate of 0.0012 Mbps. It operates in industrial temperature range (-40 to 85 °C) and requires nominal voltage of 5 V. Suitable for telecom applications, it comes in a square chip carrier package with 44 terminals.
ST7537HS1
ST7537HS1 by STMicroelectronics is a modem IC with 28 terminals, operating at 0-70 °C. It has a supply voltage of 10V and data rate of 0.0024 Mbps. Ideal for telecom applications, it comes in a square chip carrier package with matte tin finish and quad terminal position.
S5N8952X
Samsung
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: LFQFP; Package Shape: SQUARE;
73M1822-IMR
ADSP-21MOD870-100
ADSP-21MOD870-100 by Analog Devices is a modem IC with 100 terminals, 8 kbps fax rate, and 0.056 Mbps data rate. It is used in telecom applications for low profile, fine pitch package style in plastic/epoxy material.
935288611518
MODEM-DEMODULATOR; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: 1 mm;
73M2901CL-IGV/F
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
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ST7540TR
ST7540TR by STMicroelectronics is a modem IC with 28 terminals, operating at 5-9V. It features BCDMOS technology, 0.0048 Mbps data rate, and -40 to 85°C temperature range. Ideal for industrial telecom applications due to its small outline package and dual terminal position.
ST7540
ST7540 by STMicroelectronics is a modem IC with 28 terminals, operating at -40 to 85°C. It has a data rate of 0.0048 Mbps and operates on a nominal voltage of 5V. This BCDMOS technology chip is ideal for industrial telecom applications due to its compact size and surface-mount capability.
ST7538Q
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
ST7538QTR
ST75C50
MODEM-DATA/FAX/VOICE; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;
ST75951
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
ST75C501CQFP
MODEM; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Length: 14 mm;
ST75C502CQFP
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE;
ST7536CFNTR
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
ST7538P
ST7543CQFP
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
ST7554TQF7
MODEM-DATA/FAX/VOICE; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
ST7544CFN
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
ST7544CQFP
ST7543CFN
ST7536CFN
ST7537
ST7546CQFP
Modems; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
Supply Digital Components
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