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ST7536CFNTR

STMicroelectronics

ST7536CFNTR by STMicroelectronics

ST7536CFNTR by STMicroelectronics is a modem IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -10 to 70 °C, suitable for commercial telecom applications. It has a data rate of 0.0012 Mbps and requires nominal voltage of 5V with max current draw of 35mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,316 parts In-Stock

1+ parts

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4,316

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Vyrian

USA . 1,409 parts In-Stock

1+ parts

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1,409

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Anansix

USA . 597 parts In-Stock

1+ parts

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597

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,495 parts In-Stock

1+ parts

$10.286

100+ parts

-

1k+ parts

$9.257

10k+ parts

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1,495

$10.286

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$9.257

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MKK Technologies

India . 1,178 parts In-Stock

1+ parts

$19.341

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1,178

$19.341

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DigiPath Technology Company

USA . 1,178 parts In-Stock

1+ parts

$19.341

100+ parts

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1,178

$19.341

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Corphita

USA . 1,802 parts In-Stock

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1,802

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Parana Technologies

USA . 772 parts In-Stock

1+ parts

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100+ parts

$12.298

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772

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$12.298

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Overview

Experience the cutting-edge technology of the ST7536CFNTR modem by STMicroelectronics, a leading manufacturer known for its quality and reliability. This modem is designed to cater to various applications in the telecommunications industry, offering customers unmatched value, benefits, and advantages. With its innovative features and high-performance capabilities, the ST7536CFNTR is the perfect solution for all your modem needs. Upgrade to the next level of connectivity with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the modem lightweight and durable, perfect for portable use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape is compact and efficient, making it easier to integrate into electronic designs with limited space.

No. of Terminals: 28

Having 28 terminals provides sufficient connectivity options for various input and output functions, ensuring versatility in usage.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10 °C allows the modem to function effectively in a wide range of temperature settings.

Terminal Position: QUAD

The quad terminal position enables secure connections and easy PCB mounting, enhancing the stability and reliability of the modem.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57 mm ensures that the modem can fit into compact spaces within electronic devices without compromising functionality.

Width: 11.5062 mm

The narrow width of 11.5062 mm makes the modem suitable for placement in tight spaces on PCBs, enabling efficient design layouts.

Length: 11.5062 mm

The compact length of 11.5062 mm further contributes to the modem's space-saving design, making it ideal for constrained electronic assemblies.

Temperature Grade: COMMERCIAL

The commercial-grade temperature rating ensures that the modem is suitable for use in standard operating environments, providing reliable performance in everyday settings.

Nominal Negative Supply Voltage: -5 V

The nominal negative supply voltage of -5 V supports the modem's power requirements, enabling stable operation and efficient power management.

Terminal Form: J BEND

The J bend terminal form facilitates easy soldering and secure connections, simplifying the assembly process and ensuring reliable performance.

Maximum Supply Current: 35 mA

The maximum supply current of 35 mA indicates the power consumption of the modem, allowing for efficient power usage and reduced energy costs.

Telecom IC Type: MODEM

Being a modem telecom IC type, this product is optimized for data communication applications, ensuring high-speed and reliable data transmission capabilities.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V supports the stable operation of the modem, providing consistent power output for optimal performance.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for dense packing of terminals on the modem, maximizing connectivity options and enhancing design flexibility.

Data Rate: 0.0012 Mbps

With a data rate of 0.0012 Mbps, this modem offers efficient data transfer speeds for various communication tasks, ensuring quick and reliable data transmission.

Technical Specifications

Modems ST7536CFNTR attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

Additional Features:

HALF DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

35 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

ST7536CFNTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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